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Abstract: Today's complex systems for high-performance computing feature chiplets using advanced packaging technologies, commercially known as EMIB, CoWoS, InFO, FOCoS, and several others from multiple sources. These 2D/2.5D structures require ultra-dense I/O PHYs to deliver a large amount of data between dice over a distance of a few millimeters without adding much power and area […]

Abstract: The automotive industry is in the midst of a significant transformation. “CASE: Connected, Autonomous, Shared & Service, Electric” has been advocated as a trend. Along with this trend, automotive E/E (Electrical/Electronic) architecture will evolve from the current distributed architecture to a domain architecture and then to the future zone architecture in the autonomous driving […]

Abstract: The semiconductor industry has witnessed a renaissance that has fueled excitement and research in this area. A great deal of investment has been made in chip fabrication. The question is, who will design the chips that must fill the capacity of these fabrication lines? This presentation describes a plan for educating future generations of […]

Abstract: The first vacuum tube amplifiers appeared circa 1912 and were used originally as audio amplifiers. Shortly thereafter they helped to popularize AM radio broadcasting. Generating sufficient broadcast power was difficult and electricity costs were high for operators, driving many key innovations to improve output power and efficiency, particularly when amplifying signals with large peak-to-average power […]