Award Information
For a small number of promising graduate students, the IEEE Solid-State Circuits Society Predoctoral Achievement Award provides an honorarium as well as reimbursement of select expenses incurred by the awardee for attending the next International Solid-State Circuits Conference (ISSCC.)
New for this cycle: the two entries deemed most outstanding by the judges will be granted prizes named in memory of Willy Sansen, former president of the IEEE Solid-State Circuits Society (SSCS) and a luminary in analog integrated-circuit design research and education; and Kenneth Smith, a tireless contributor to ISSCC for more than 50 years and co-author of the landmark textbook Microelectronic Circuits. Recipients of these top prizes will each earn a $3,000 honorarium plus reimbursement of up to $2,000 in travel expenses to attend ISSCC. All Predoctoral Achievement Award applicants will automatically be considered for one of these two top prizes.
All other Predoctoral Achievement Award recipients will each receive a $1,000 honorarium plus reimbursement of up to $1,500 in travel expenses to attend ISSCC.
Applicants must be members of the IEEE and the Solid-State Circuits Society, have completed at least one year of study in a PhD program in the area of solid state circuits, and not have received a PhD degree in the area of solid state circuits prior to the final application deadline. Awards are made on the basis of academic record and promise, quality of publications, and a graduate study program well matched to the charter of SSCS. Prior winners of the Predoctoral Achievement Award will not be eligible. No more than two awards will be granted in a given year to students of one Principal Advisor.
Any individual applying in the same year for both the Predoctoral Achievement Award and a student travel grant via the STGA program will be eligible to receive only one award, to be determined at the discretion of the judges.
Required Material:
- A brief biography (1 paragraph, to be made publicly available if you are selected for an award)
- A headshot of yourself (vertical orientation strongly preferred)
- CV that includes: (a) your prior and current education, (b) a list of your career publications, and (c) any other useful information such as relevant work experience and service activities.
- Your PhD study plan. This should be succinct (maximum 3 pages) and include: (a) a tentative timeline starting from when you began the PhD and including key milestones such as qualifying exams and coursework (depending on your own institutional requirements), and (b) a description of the main question your thesis is attempting to address and why it is relevant. Please also tell us if you will be fabricating ICs, and if you are collaborating with others.
- At least two recommendation letters: one from the principal advisor addressing academic record, accomplishments, and promise; and one from your graduate research program (ideally from a professor who has instructed you.)
The nomination cycle runs through October 15. Use the link below to apply; if you have any questions please email .
Please note: SSCS AdCom and Awards Committee members are ineligible for awards. A list of SSCS Awards Committee members can be found at the top of this page. Please refer to the SSCS Bylaws for a list of elected, appointed, or ex-officio AdCom positions whose holders are ineligible. The names of those holding AdCom positions can be found here.
Nominators, please note:
Awards are governed by the TAB Awards and Recongition Manual, and the IEEE Policies. These include, but are not limited to:
1. Individuals serving on any board or committee involved at any stage of the recipient selection or approval process for an award shall be ineligible to receive, or act as a nominator or reference for, that award. A list of SSCS Awards Committee members can be found at the top of this page. Please refer to the SSCS Bylaws for a list of elected, appointed, or ex-officio AdCom positions whose holders are ineligible. The names of those holding AdCom positions can be found here. If you have any questions, please use this form.
2. An individual shall receive only one award for a given achievement, unless the significance merits a higher award, which may be given in the following year or thereafter.
2025-2026 Predoctoral Achievement Award Recipients
Jaewoong Ahn (Graduate Student Member, IEEE) received his B.S. degree in Electrical and Electronics Engineering from Chung-Ang University (CAU), Seoul, South Korea, in 2022, and his M.S. degree in Electrical Engineering from Korea University, Seoul, in 2024. He is currently pursuing a Ph.D. in Electrical Engineering at Korea University.
His research interests include display driver and touch sensor integrated circuits (ICs).
He has first-authored two papers at the IEEE International Solid-State Circuits Conference (ISSCC) and two papers in the IEEE Journal of Solid-State Circuits (JSSC), as well as co-authored several publications in ISSCC, the IEEE Symposium on VLSI Technology and Circuits (VLSI), and the IEEE Asian Solid-State Circuits Conference (A-SSCC).
Jaewoong Ahn
Korea UniversityTinish Bhattacharya received his B.Tech. degree in Electrical Engineering from the Indian Institute of Technology (IIT) Delhi in 2019, and his M.S. degree in Electrical and Computer Engineering from the University of California, Santa Barbara (UCSB) in 2021. He is currently pursuing a Ph.D. in Electrical and Computer Engineering at UCSB. From 2023 to 2024, he was a research associate intern at Hewlett-Packard Labs’ Large-Scale Integrated Photonics Lab.
His research interests focus on leveraging physics and electronic design automation to enhance the performance and energy efficiency of unconventional computing paradigms, with contributions spanning mixed-signal circuits, architecture, and algorithm design.
He has first-authored publications in venues such as the Symposium on VLSI Circuits (VLSI), the Hot Chips Symposium, the International Solid-State Circuits Conference (ISSCC), Nature Communications, and the International Electron Devices Meeting (IEDM). His work has been recognized by TechXplore, Semiconductor Engineering, and the UCSB Current; selected by the editors of Nature Communications as one of the 50 best recent papers in the field; and honored with the UCSB ECE Dissertation Fellowship and the James V. & Beverly R. Zaleski Discovery Award in 2025. He also serves as a reviewer for Nature Communications, IEEE Transactions on Circuits and Systems I (TCAS-I), IEEE Journal on Exploratory Solid-State Computational Devices and Circuits (JXCDC), and ISCAS.
Tinish Bhattacharya
University of California Santa BarbaraXibi Chen is a Ph.D. candidate in the Department of Electrical Engineering and Computer Science (EECS) at the Massachusetts Institute of Technology (MIT), Cambridge, MA. He received his B.S. and M.S. degrees from Tsinghua University, Beijing, China, in 2017 and 2020, respectively. From 2015 to 2017, he was a Research Assistant at the Microwave and Antenna Institute, Department of Electronic Engineering, Tsinghua University, and then served as a Graduate Student Researcher at the same institute from 2017 to 2019. In 2020, he began his Ph.D. studies at MIT EECS.
His research interests include millimeter-wave and terahertz integrated circuits and systems, electromagnetics, advanced packaging technologies, large-scale phased arrays, radar imaging, and high-speed communications.
He interned at Texas Instruments (Kilby Lab) and Intel Corporation in 2023 and 2024, respectively. Xibi received the 2024 IEEE MTT-S Graduate Fellowship, the 2024 IEEE MTT-S Tom Brazil Graduate Fellowship, the ISSCC 2022 Student Travel Grant Award, and the Analog Devices Outstanding Student Designer Award.
Xibi Chen
Massachusetts Institute of Technology (MIT)Yutang Chen received his B.Sc. and M.Sc. degrees from Sun Yat-sen University (SYSU), Guangzhou, China, in 2020 and 2023, respectively. He is currently pursuing a Ph.D. in Electronic Science and Technology at SYSU.
His research interests include wireless power transfer systems and power management integrated circuits.
His research has resulted in nine papers, with first-authored IEEE publications including two at the IEEE International Solid-State Circuits Conference (ISSCC), one in the IEEE Journal of Solid-State Circuits (JSSC), one in IEEE Transactions on Power Electronics (TPEL), and one at the IEEE Asian Solid-State Circuits Conference (A-SSCC). He received the IEEE Solid-State Circuits Society Student Travel Grant Award in 2024 and serves as a technical reviewer for TPEL and TCAS-II.
Yutang Chen
Sun Yat-sen UniversityVinay Chenna received his B.Tech. degree in Electrical Engineering from the Indian Institute of Technology Madras, Chennai, India, in 2019. He is currently a Ph.D. candidate in the Ming Hsieh Department of Electrical and Computer Engineering at the University of Southern California, Los Angeles.
His research focuses on leveraging computational techniques and optimization algorithms to design high-performance RF and mmWave integrated circuits.
He received the USC Annenberg Fellowship in 2019 and the USC IUSSTF-Viterbi Summer Research Award in 2018. He won the Best Student Paper Award (1st Place) at the IEEE Radio Frequency Integrated Circuits (RFIC) Symposium in 2025 and the IEEE SSCS Predoctoral Achievement Award for 2025–26. He currently serves as a reviewer for several IEEE conferences and journals, including the IEEE Microwave and Wireless Technology Letters (MWTL), IEEE Transactions on Antennas and Propagation (TAP), IEEE Transactions on Microwave Theory and Techniques (TMTT), IEEE Transactions on Terahertz Science and Technology (TTST), and the IEEE International Symposium on Circuits and Systems (ISCAS).
Vinay Chenna
University of Southern CaliforniaLingke Ding received his B.Eng. degree (First Class Honors) in Electrical Engineering with Innovation and Design from the National University of Singapore in 2022, and his M.S. degree in Electrical and Computer Engineering from Purdue University in 2025. He is currently pursuing a Ph.D. in Electrical and Computer Engineering at Purdue University, West Lafayette, IN, where he is a member of SparcLab.
His research focuses on ultra-low-power IC design for human body communication and powering, enabling charging-free wearable systems.
His work spans biophysical modeling, circuit-level analysis, and system architectures, including clockless wake-up receivers and clock recovery circuits for human-body-centric links. He has authored papers at the IEEE International Solid-State Circuits Conference (ISSCC), IEEE Transactions on Biomedical Engineering (TBME), IEEE International Microwave Symposium (IMS), and IEEE Midwest Symposium on Circuits and Systems (MWSCAS), and is a co-inventor on multiple U.S. patent applications.
Lingke Ding
Purdue UniversityNiels Fakkel received his B.Sc. and M.Sc. degrees in Electrical Engineering (Microelectronics) from Delft University of Technology, Delft, The Netherlands, in 2018 and 2021, respectively. He is currently pursuing a Ph.D. at Delft under the supervision of Dr. Masoud Babaie.
His research interests include cryogenic electronics for quantum computing, RF transmitters for qubit control, and high-speed wireline systems.
His work has resulted in four first-authored IEEE publications, including in the IEEE Journal of Solid-State Circuits (JSSC), the IEEE International Solid-State Circuits Conference (ISSCC), and the IEEE Radio Frequency Integrated Circuits Symposium (RFIC).
Niels Fakkel
Delft University of TechnologyJihang Gao received his B.E. degree (Hons.) in Microelectronics from Peking University, Beijing, China, in 2022. He is currently pursuing a Ph.D. at the School of Integrated Circuits, Peking University.
His research interests focus on analog and mixed-signal circuit design, including data converters and sensor interfaces.
He has first-authored four papers at the International Solid-State Circuits Conference (ISSCC) and in the IEEE Journal of Solid-State Circuits (JSSC). He received the ISSCC 2023 Anantha P. Chandrakasan Award for Distinguished Technical Paper, was a co-recipient of the CICC 2024 Michael A. Zachariah Outstanding Student Paper Award, and received the National Scholarship in 2025. He has also co-authored several papers in ISSCC, JSSC, IEEE Solid-State Circuits Letters (SSC-L), the IEEE Custom Integrated Circuits Conference (CICC), and the European Solid-State Electronics Research Conference (ESSERC).
Jihang Gao
Peking UniversityChanheum Han (Graduate Student Member, IEEE) received his B.S. degree in Electronics and Communications Engineering from Kwangwoon University, Seoul, South Korea, in 2023. He is currently pursuing a Ph.D. at the same institution under the supervision of Prof. Joo-Hyung Chae.
His research interests include high-speed, low-power I/O circuit design and mixed-signal in-memory computing.
He has co-first-authored two papers at the IEEE International Solid-State Circuits Conference (ISSCC), as well as journal papers in the IEEE Journal of Solid-State Circuits (JSSC) and IEEE Transactions on Circuits and Systems I (TCAS-I). He has also co-authored additional papers in JSSC and at the IEEE European Solid-State Electronics Research Conference (ESSERC). In 2026, he presented at the ISSCC Student Research Preview. He received the IEEE ISSCC Student Travel Grant Award (STGA) in 2025, the Corporate Special Award (24th), and the Minister of Trade, Industry, and Energy Award (26th) at the Korea Semiconductor Design Contest.
Chanheum Han
Kwangwoon University, Department of Electronics and Communications Engineering, Seoul, Republic of KoreaYiming Han (Graduate Student Member, IEEE) received his B.S. degree in Electrical Engineering from Dalian University of Technology, China, in 2019, and his M.S. degree in Electrical Engineering from Zhejiang University, China, in 2022. He is currently a Ph.D. candidate in the Chandra Family Department of Electrical and Computer Engineering at The University of Texas at Austin.
His research interests include analog and mixed-signal integrated circuits and RF transceivers for wearable and implantable biomedical devices.
He interned as an Analog IC Design Engineer at NXP Semiconductors in the summers of 2023 and 2024, focusing on clock generation circuit design. His work has resulted in ten first-authored or co-first-authored IEEE publications, including at the International Solid-State Circuits Conference (ISSCC), Custom Integrated Circuits Conference (CICC), European Solid-State Circuits Conference (ESSCIRC), Biomedical Circuits and Systems Conference (BioCAS), IEEE Transactions on Biomedical Circuits and Systems (TBioCAS), and IEEE Transactions on Biomedical Engineering (TBME).
Yiming Han
The University of Texas at AustinXiyu He received his B.S. degree in Electronic Engineering from Tsinghua University, Beijing, China, in 2022. He is currently pursuing a Ph.D. at Tsinghua University.
His research interests include signal-chain-friendly and energy-efficient analog-to-digital converters.
He has first-authored two papers at the IEEE International Solid-State Circuits Conference (ISSCC) and one at the IEEE International Symposium on Circuits and Systems (ISCAS). He received the 2025 IEEE Circuits and Systems Student Travel Grant and was a co-recipient of the ISSCC 2025 Jack Kilby Award for Outstanding Student Paper. He also serves as a reviewer for the IEEE Transactions on Circuits and Systems II: Express Briefs (TCAS-II) and the IEEE Transactions on Very Large Scale Integration Systems (TVLSI).
Xiyu He
Tsinghua UniversityRamin Javadi received his B.Sc. degree in Electrical and Electronics Engineering from Shamsipour Institute of Technology, Tehran, Iran, in 2014, and his M.Sc. degree in Electrical and Electronics Engineering from the University of Tehran in 2017. He is currently pursuing a Ph.D. in Electrical Engineering and Computer Science at Oregon State University, Corvallis, OR, USA.
Since 2022, he has been a Research Scholar at the Semiconductor Research Corporation (SRC) Center for Ubiquitous Connectivity (CUbiC) in New York, NY, where he works on machine-learning-inspired wireline link architectures. He also serves as a reviewer for the IEEE Transactions on Signal Processing and the IEEE International Midwest Symposium on Circuits and Systems (MWSCAS). In Fall 2025, he was a Hardware Technology Intern at Apple Inc., Cupertino, CA, USA.
His research focuses on energy-efficient, high-speed wireline communication systems and has resulted in several first-authored and co-authored publications at the IEEE International Solid-State Circuits Conference (ISSCC), IEEE Journal of Solid-State Circuits (JSSC), Symposium on VLSI Technology and Circuits (SOVC), and IEEE Custom Integrated Circuits Conference (CICC). He is the recipient of the 2025 IEEE CICC Best Student Paper Award and the 2026 Analog Devices Outstanding Student Designer Award.
Ramin Javadi
Oregon State UniversityJueun Jung (Graduate Student Member, IEEE) received his B.S. degree in Electrical Engineering from Ulsan National Institute of Science and Technology (UNIST), Ulsan, South Korea, in 2020. He is currently pursuing a combined M.S. and Ph.D. degree at UNIST.
His research interests include energy-efficient system-on-chip (SoC) design, with a particular focus on deep neural network accelerators, hardware-algorithm co-optimization, and intelligent spatiotemporal computing for autonomous systems.
He has first-authored and co-authored several publications at the IEEE International Solid-State Circuits Conference (ISSCC), IEEE European Solid-State Electronics Research Conference (ESSERC), IEEE Asian Solid-State Circuits Conference (A-SSCC), IEEE International Symposium on Circuits and Systems (ISCAS), IEEE Journal of Solid-State Circuits (JSSC), IEEE Transactions on Circuits and Systems I: Regular Papers (TCAS-I), and IEEE Transactions on Circuits and Systems II: Express Briefs (TCAS-II), among others. He received the Demonstration Session Award at ISSCC 2024 and the IEEE ISSCC Student Travel Grant Award in 2025.
Jueun Jung
Ulsan National Institute of Science and TechnologyMahmoud A. Khalil received his B.Sc. and M.Sc. degrees in Electrical Engineering from Ain Shams University, Cairo, Egypt, in 2013 and 2019, respectively. He is currently pursuing a Ph.D. in Electrical Engineering at the University of Illinois at Urbana-Champaign, Urbana, IL, USA.
From 2013 to 2021, he was a Staff Analog/RFIC Design Engineer at Si-Vision, Cairo, where he worked on BLE transceiver design. In the summer of 2022, he interned at Intel Labs in Hillsboro, OR, where he developed high-speed optical PHY research. In 2024, he interned at Samsung Semiconductor, San Jose, CA, working on fractional-N FMCW radar synthesizers.
His current research interests include low-noise frequency synthesizers, multiphase clock generators, and high-speed SerDes. He received the Analog Devices Outstanding Student Designer Award in 2025.
Mahmoud A. Khalil
University of Illinois Urbana-ChampaignSayan Kumar is a Ph.D. student at University College Dublin, where he has been conducting research since January 2021 under the supervision of Dr. Teerachot Siriburanon and Prof. Bogdan Staszewski. His doctoral research, in collaboration with MediaTek, focuses on ultra-low-jitter and energy-efficient frequency synthesis for mmWave communications. He earned his B.Tech. from West Bengal University of Technology in 2012 and his M.Tech. from IIT Roorkee in 2014.
Prior to his Ph.D., Sayan worked as a Research Engineer at the National University of Singapore, spent two years at Juniper Networks, and three years as an IC Design Engineer at Analog Devices. During his doctoral studies, he also worked part-time as a Research Scientist at Equal1, a start-up, focusing on cryogenic circuit design.
During his Ph.D., Sayan has published 12 papers, including nine conference papers at the VLSI Symposium, RFIC, ESSERC, and ISCAS, as well as three journal papers in the IEEE Journal of Solid-State Circuits (JSSC) and the IEEE Transactions on Circuits and Systems II (TCAS-II). He also serves as a reviewer for IEEE Transactions on Microwave Theory and Techniques (TMTT), IEEE Transactions on Circuits and Systems I (TCAS-I), IEEE Transactions on Circuits and Systems II (TCAS-II), and IEEE Access.
Sayan Kumar
University College DublinEunseok Lee received his B.S. degree in Electrical Engineering from the Korea Advanced Institute of Science and Technology (KAIST), Daejeon, Korea, in 2020, and his S.M. degree in Electrical Engineering and Computer Science (EECS) from the Massachusetts Institute of Technology (MIT), Cambridge, MA, USA, in 2023. He is currently pursuing a Ph.D. at MIT.
His research interests include mm-wave and terahertz integrated circuits for miniaturized platforms and security systems.
He has received several honors, including the Korea Presidential Science Scholarship (2014), KAIST Presidential Fellowship (2014), Irwin Mark Jacobs and Joan Klein Jacobs MIT Presidential Fellowship (2020), and the MIT School of Engineering MathWorks Fellowship (2023).
Eunseok Lee
Massachusetts Institute of TechnologyHuan-Cheng Liao received his B.S. degree from National Taiwan University, Taipei, Taiwan, in 2020. He is currently pursuing a Ph.D. in Electrical and Computer Engineering at Rice University, Houston, TX, USA.
His research interests include analog and mixed-signal circuit design for bioelectronics and in-sensor computing. In the summer of 2025, he was an analog design intern at D-Matrix, Santa Clara, CA, where he worked on high-speed die-to-die communication circuits.
He has co-first-authored multiple publications at the International Solid-State Circuits Conference (ISSCC) and in the IEEE Journal of Solid-State Circuits (JSSC). He has also co-authored several publications in the Symposium on VLSI Circuits (VLSI), Custom Integrated Circuits Conference (CICC), and IEEE Transactions on Biomedical Circuits and Systems (TBioCAS). He serves as a reviewer for IEEE Transactions on Very Large-Scale Integration (TVLSI).
Huan-Cheng Liao
Rice UniversityGang Liu received his B.Eng. degree from Huazhong University of Science and Technology, Wuhan, China, in 2021, and his M.Eng. degree from Southern University of Science and Technology, Shenzhen, China, in 2023. He is currently pursuing a Ph.D. in the School of Science and Engineering at The Chinese University of Hong Kong, Shenzhen, China.
His research interests include power management IC design and high-power-density AC–DC and DC–DC converters.
He has first-authored two papers accepted for presentation at the IEEE International Solid-State Circuits Conference (ISSCC) and has published first- or co-first-authored papers in the IEEE Journal of Solid-State Circuits (JSSC) and the IEEE Transactions on Power Electronics (TPEL). He received the 2024 ISSCC Student Travel Grant Award and serves as a reviewer for the IEEE International Symposium on Circuits and Systems (ISCAS).
Gang Liu
The Chinese University of Hong Kong, ShenzhenJiahao Liu (Graduate Student Member, IEEE) received his B.Eng. degree in Communication and Information Engineering from the University of Electronic Science and Technology of China (UESTC), Chengdu, in 2020. He is currently pursuing a Ph.D. at UESTC under the supervision of Prof. Jun Zhou.
His research interests include the design of high-accuracy and energy-efficient biomedical AI processors.
He has co–first-authored a paper in Nature Communications and first-authored two papers at the IEEE International Solid-State Circuits Conference (ISSCC) (including one ISSCC Highlighted Paper), two in the IEEE Journal of Solid-State Circuits (JSSC), two at the IEEE Custom Integrated Circuits Conference (CICC), one at the ACM/IEEE Design Automation Conference (DAC), and one in the IEEE Transactions on Biomedical Circuits and Systems (TBioCAS). He has also co-authored several papers in the IEEE Asian Solid-State Circuits Conference (A-SSCC), IEEE Solid-State Circuits Letters (SSCL), IEEE Journal of Biomedical and Health Informatics (JBHI), and TBioCAS. He serves as a reviewer for the IEEE Transactions on Very Large Scale Integration (TVLSI), IEEE Transactions on Biomedical Circuits and Systems (TBioCAS), and the IEEE International Symposium on Circuits and Systems (ISCAS).
Jiahao Liu
University of Electronic Science and Technology of China (UESTC)Soumya Mahapatra (Graduate Student Member, IEEE) received his B.Tech. degree in Electronics and Electrical Communication Engineering from the Indian Institute of Technology (IIT) Kharagpur, India, in 2019, and his Ph.D. in Electrical Engineering from the University of Southern California (USC), Los Angeles, USA, in 2025. His research focuses on analog and RF integrated circuits for next-generation wireless communication systems, emphasizing high-performance transceivers, energy-efficient digital power amplifiers, and millimeter-wave circuit techniques.
He has authored multiple papers at the IEEE International Solid-State Circuits Conference (ISSCC) and in the IEEE Journal of Solid-State Circuits (JSSC). His work has been recognized with two Best Student Presentation Awards from the Semiconductor Research Corporation (SRC) at TECHCON 2024 and 2025. In 2022, he completed an industry internship focused on Wi-Fi power amplifier design.
He received the Ming Hsieh Fellowship and the IUSSTF-Viterbi Summer Research Award. He currently serves as a reviewer for the IEEE Journal of Solid-State Circuits (JSSC) and the IEEE Circuits and Systems Magazine (CASM).
Soumya Mahapatra
University of Southern CaliforniaYuhwan Shin (Graduate Student Member, IEEE) received his B.S. degree in Electrical Engineering from the Korea Advanced Institute of Science and Technology (KAIST), Daejeon, South Korea, in 2021. He is currently pursuing a combined M.S. and Ph.D. degree in Electrical Engineering at KAIST.
His research interests include CMOS analog and mixed-signal integrated circuits and systems, with a focus on high-speed serial links and clock/frequency generation circuits.
He has first-authored and co-authored several publications at the IEEE International Solid-State Circuits Conference (ISSCC) and in the IEEE Journal of Solid-State Circuits (JSSC). He received the Silver Prize at the 28th and 30th Samsung Human-Tech Paper Awards in Circuit Design, hosted by Samsung Electronics, and the Presidential Award at the 26th Korea Semiconductor Design Competition. He also serves as a reviewer for the IEEE Journal of Solid-State Circuits (JSSC).
Yuhwan Shin
Korea Advanced Institute of Science and Technology (KAIST)Dawei Tang received his B.S. degree in Electronics Science and Technology from Southwest Jiaotong University, Chengdu, China, in 2020. He is currently pursuing a Ph.D. in Electronics Science and Technology at Southeast University, Nanjing, China, under the supervision of Prof. Wei Hong at the State Key Laboratory of Millimeter-Waves.
His research interests include millimeter-wave and terahertz integrated circuits and systems for high-speed wireless communication and sensing.
He has authored and co-authored several papers, including two first-author and one co-first-author paper in the IEEE Journal of Solid-State Circuits (JSSC), as well as first-author papers in the IEEE International Solid-State Circuits Conference (ISSCC), the IEEE Custom Integrated Circuits Conference (CICC), the IEEE Asian Solid-State Circuits Conference (A-SSCC), and IEEE Microwave and Wireless Technology Letters (MWTL). He received Best Poster Awards at the 2024 and 2025 Workshop on IC Advances in China (ICAC), and Best Poster honors at the Excellent Doctoral Forum of the Chinese Electronics Society.
Dawei Tang
Southeast UniversityAswin Undavalli (Graduate Student Member, IEEE) received his B.Tech. degree in Electronics and Communication Engineering from NIT Delhi, India, in 2022, and his M.S. in Electrical Engineering from Washington University in St. Louis, USA, in 2024. He is currently pursuing a Ph.D. in Electrical and Computer Engineering at Northeastern University, Oakland, CA, USA.
His research interests include RF integrated circuits, radar signal processing, and analog computing.
He received the President’s Gold Medal for outstanding performance during his B.Tech. studies. He has authored and co-authored papers in leading journals and conferences, including the International Solid-State Circuits Conference (ISSCC) and the IEEE Journal of Solid-State Circuits (JSSC).
Aswin Chowdary Undavalli
Northeastern UniversityZongnan Wang (Graduate Student Member, IEEE) received his B.S. degree in Microelectronic Science and Engineering from the University of Electronic Science and Technology of China, Chengdu, in 2022. He is currently pursuing a Ph.D. at the Institute for Artificial Intelligence and the School of Integrated Circuits, Peking University, Beijing.
His research interests include analog and mixed-signal integrated circuits.
He received the National Scholarship in 2025. He has first-authored three papers at the IEEE International Solid-State Circuits Conference (ISSCC), one at the Symposium on VLSI Circuits (VLSI), and one in the IEEE Journal of Solid-State Circuits (JSSC). He has also co-authored several papers in the IEEE Solid-State Circuits Letters (SSC-L), the IEEE Custom Integrated Circuits Conference (CICC), and the IEEE Journal of Solid-State Circuits (JSSC). Since 2024, he has served as chair of the SSCS Peking University Student Branch Chapter.
Zongnan Wang
Peking UniversityZiyuan Wen received his B.E. degree in Optical and Electrical Information from Huazhong University of Science and Technology, Wuhan, China, in 2022. He is currently pursuing a Ph.D. in Electrical and Computer Engineering at Rice University, Houston, TX.
His research interests include computing-in-memory architectures and low-power digital VLSI design optimized through hardware–software co-design.
He has first-authored four papers at the Symposium on VLSI Technology and Circuits (VLSI), International Symposium on Computer Architecture (ISCA), and International Conference on Architectural Support for Programming Languages and Operating Systems (ASPLOS). He has also co-authored several publications at the International Solid-State Circuits Conference (ISSCC), the IEEE Journal of Solid-State Circuits (JSSC), the IEEE Transactions on Biomedical Circuits and Systems (TBioCAS), and the International Conference on Communications (ICC). Ziyuan also serves as a reviewer for IEEE Transactions on Very Large Scale Integration Systems (TVLSI).
Ziyuan Wen
Rice UniversityZihan Wu (Graduate Student Member, IEEE) received his B.E. degree in Microelectronics from Huazhong University of Science and Technology, Wuhan, China, in 2019, and his M.S. degree in Microelectronics from Fudan University, Shanghai, China, in 2021. He is currently pursuing a Ph.D. in the School of Integrated Circuits at Peking University, Beijing, China.
His research focuses on digital circuits and microarchitecture technologies for machine learning and combinatorial optimization.
He has first-authored three papers at the IEEE International Solid-State Circuits Conference (ISSCC), including one co-first-authored paper, and published two first-authored papers in the IEEE Journal of Solid-State Circuits (JSSC). He also serves as a reviewer for IEEE Transactions on Very Large Scale Integration Systems (TVLSI) and the IEEE International Symposium on Circuits and Systems (ISCAS).
Zihan Wu
Peking UniversityJiacheng Yang received his B.E. degree from the University of Electronic Science and Technology of China, Chengdu, in 2021. He joined the University of Macau in August 2021 and is currently pursuing a Ph.D. in Microelectronics at the State Key Laboratory of Analog and Mixed-Signal VLSI, University of Macau.
His research focuses on power management integrated circuits and high-efficiency power delivery architectures for data centers.
He has first-authored two papers at the IEEE International Solid-State Circuits Conference (ISSCC), including one co-first-authored paper, and one at the IEEE Custom Integrated Circuits Conference (CICC). He has also published two first-authored papers in the IEEE Journal of Solid-State Circuits (JSSC).
Jiacheng Yang
University of MacauGichan Yun (Graduate Student Member, IEEE) received his B.S. and M.S. degrees in Electrical Engineering from the Korea Advanced Institute of Science and Technology (KAIST), Daejeon, Republic of Korea, in 2020 and 2022, respectively. He is currently pursuing a Ph.D. in Electrical Engineering at KAIST.
His research interests include data converters, ultrasound imaging ICs, biomedical sensor interface ICs, and capacitance-to-digital converters.
His Ph.D. research has resulted in several publications in leading conferences and journals, including the IEEE International Solid-State Circuits Conference (ISSCC), IEEE Journal of Solid-State Circuits (JSSC), IEEE Open Journal of the Solid-State Circuits Society (OJ-SSCS), Symposium on VLSI Technology and Circuits (SOVC), Custom Integrated Circuits Conference (CICC), Asian Solid-State Circuits Conference (A-SSCC), Solid-State Circuits Letters (SSC-L), Transactions on Biomedical Circuits and Systems (TBioCAS), Transactions on Circuits and Systems I (TCAS-I), Transactions on Circuits and Systems II (TCAS-II), and IEEE International Symposium on Circuits and Systems (ISCAS). He has also served as a reviewer for JSSC and TBioCAS. In 2025, he received the IEEE Circuits and Systems Society (CASS) Student Travel Grant Award.
Gichan Yun
Korea Advanced Institute of Science and Technology (KAIST)Yongling Zhang (Graduate Student Member, IEEE) received his B.E. degree in Microelectronics from the School of Electronic Science and Applied Physics, Hefei University of Technology, Hefei, China, in 2010, and his M.E. degree in Microelectronics and Solid-State Electronics from the same institution in 2017. From 2017 to 2022, he worked as an analog integrated circuit designer at Lontium Semiconductor Corporation, Hefei. He is currently pursuing a Ph.D. in Microelectronics Science and Engineering at the School of Electronics and Information Engineering, Tongji University, Shanghai, China.
His research interests include low-power RF and biomedical integrated circuit design.
He has first-authored four papers, with publications at the IEEE International Solid-State Circuits Conference (ISSCC), the IEEE European Solid-State Electronics Research Conference (ESSERC), the IEEE Journal of Solid-State Circuits (JSSC), and the IEEE Solid-State Circuits Letters (SSCL). He has also co-first-authored two papers, including at the IEEE Custom Integrated Circuits Conference (CICC) and the IEEE Biomedical Circuits and Systems Conference (BioCAS).
Yongling Zhang
Tongji UniversityKaiwen Zhou received his B.E. degree in Microelectronics Engineering from the University of Electronic Science and Technology of China, Chengdu, in 2021. He is currently pursuing a Ph.D. at Fudan University, Shanghai.
His research interests include Class-D audio amplifiers, audio decoders, and analog front-end circuit design for biomedical and sensor interfaces.
He has first-authored and co-authored several papers at the International Solid-State Circuits Conference (ISSCC), the IEEE Journal of Solid-State Circuits (JSSC), the Custom Integrated Circuits Conference (CICC), and the European Solid-State Electronics Research Conference (ESSERC).
