SSC-L Submission Information
The SSC-L Word Template or the SSC-L LaTeX template must be used when submitting a manuscript to the journal.
All submissions must be in the two-column format shown in the templates and only PDF.
Information for submission is included in the main template file - SSC-L Word Template.
SSC-L Word Template (Backup)
SSCS-L LaTex Template (Backup)
To submit your manuscript, please go to: https://mc.manuscriptcentral.com/ssc-l
Additional Submission Information
The IEEE Solid-State Circuits Letters (SSCL) apears monthly with the purpose of providing fast publication of original and significant contributions in the area of solid-state circuits. The emphasis is on the transistor-level design of integrated circuits (ICs). Circuits integrated in micro- and nano-electronic (e.g., VLSI) technologies are of principal interest. Material related to discrete circuit design is rarely published. Experimental verification is strongly encouraged.
ScholarOne Web-Based Submission and Review
The SSCL uses the web-based ScholarOne system for the submission and review of manuscripts. ScholarOne makes it easier and more efficient for authors, reviewers and editors. The SSCL ScholarOne site is https://mc.manuscriptcentral.com/ssc-l. For a detailed ScholarOne tutorial, visit http://sscs.ieee.org/publications/ieee-journal-of-solid-state-circuits-jssc/jssc-submission.
All IEEE journals require an Open Researcher and Contributor ID (ORCID) for all authors. To create an ORCID, please visit: https://orcid.org/register. The author will need a registered ORCID in order to submit a manuscript or review a proof in this journal. IEEE supports the publication of author names in the native language alongside the English versions of the names in the author list of an article. For more information, visit the IEEE Author Digital Tool Box at the following URL: http://ieeeauthorcenter.ieee.org/create-your-ieee-article/create-the-text-of-your-article/publishing-author-names-in-native-languages/. English language editing services can help refine the language of your article and reduce the risk of rejection without review. IEEE authors are eligible for a 10% discount at American Journal Experts; visit http://www.aje.com/go/ieee/ to learn more. Please note these services are fee-based and do not guarantee acceptance.
Styles for Manuscript Submission
All papers must be submitted using the Word or Latex templates available at https://sscs.ieee.org/publications/ieee-solid-state-circuits-letters-ssc-l/ssc-l-submission-information.
For general manuscript preparation guidelines, visit the IEEE Author Center at http://ieeeauthorcenter.ieee.org/. Guidance on stylistic elements such as figures, tables, equations, abbreviations, etc. are available at: http://ieeeauthorcenter.ieee.org/create-your-ieee-article/use-authoring-tools-and-ieee-article-templates/ieee-article-templates/templates-for-transactions/.
During submission, all related prior publications and related current submissions in other journals or conferences should be fully declared. Include a pdf copy of those papers, as well as a prepublication statement explaining the overlap and differences of the submitted manuscripts for the convenience of the reviewers. Furthermore, authors should inform the Editor-in-Chief of any related submissions made while their SSC-L submission is in review. Prior and related publications obviously refers to e.g. earlier conference papers on which the JSSC manuscript elaborates. But also other publications where (part of) the submitted work was disclosed, earlier work of you or your group in the same field on which the submitted manuscript builds further, etc. must be included. Please consider this list carefully. An automated plagiarism check is performed on each submission, and violations of this prepublication policy detected during the review process may result in a publication ban.
The SSCL papers are allowed to have up to 4 pages of text in the two-column format described above. All figures must be sized such that they are properly readable. No modifications to the templates are allowed.
Submission of a manuscript manifests the fact that it has received proper clearance from the author’s company or institution, that it has not been copyrighted, published, submitted, or accepted for publication elsewhere, and that it will not be submitted elsewhere while under consideration. The manuscript text should not contain any commercial references, such as company names, university names, trademarks, commercial acronyms, or part numbers. IEEE owns copyright to the technical contributions it publishes. To comply with the U.S. Copyright Law, authors are required to sign an IEEE copyright transfer form. Authors can sign and submit an electronic version of the copyright form while submitting their manuscript through ScholarOne.
The review process usually take about four weeks. The author is then notified of the decision of the Editor or Associate Editor based on reviewer recommendations. Due to the tight publication schedule, only minor revisions can be accommodated.
This publication is a hybrid journal, allowing either Traditional or Open Access (author-pays OA) manuscript submission. Upon submission, if you choose to have your manuscript be an Open Access article, you commit to pay the discounted $1,950 OA fee if your manuscript is accepted for publication in order to enable unrestricted public access. Any other application charges (such as charge for the use of color in the print format) will be billed separately once the manuscript formatting is complete but prior to publication. If you would like your manuscript to be a Traditional submission, your article will be available to qualified subscribers and purchasers via IEEE Xplore. No OA payment is required for Traditional submission.
The articles in this journal are peer reviewed in accordance with the requirements set forth in the IEEE Publication Services and Products Board Operations Manual (https://pspb.ieee.org/images/