SSC-L Editorial Board

Pu-In Mak

Pui-In Mak

SSC-L Editor-in-Chief

Editor-in-Chief

Pui-In Mak

State-Key Laboratory of Analog and Mixed-Signal VLSI,
Institute of Microelectronics, University of Macau,
Avenida da Universidade, Taipa, Macau, China

Associate Editors

Mark Oude Alink University of Twente, Department of EEMCS, Integrated Circuit Design The Netherlands	Masoud Babaie Delft University of Technology The Netherlands	Wei-Zen Chen National Chiao Tung University Taiwan
Shiuh-hua Wood Chiang Brigham Young University Provo, Utah, USA	Jun-Chau Chien University of California Berkeley, USA	Wei Deng Tsinghua University Beijing, China
Yunzhi (Rocky) Dong MediaTek Inc. Woburn, MA, USA	Mohamed El-Nozahi Ain Shams University Egypt	Amr Fahim Broadcom, Inc. California, USA
Yohan Frans Xilinx San Jose, California, USA	Li Geng Xi’an Jiaotong University Xi’an, China	Ulkuhan Guler Worcester Polytechnic Institute Worcester, MA, USA
Drew Hall University of California San Diego La Jolla, CA, USA	Masum Hossain University of Alberta Edmonton, Alberta, Canada	Ping-Hsuan Hsieh National Tsing Hua University Hsinchu City, Taiwan
Sameh Ibrahim Ain Shams University Cairo, Egypt	Nader Kalantari ArianRF / Broadcom Ltd California, USA	Bongjin Kim University of California Santa Barbara, California, USA
Long Kong Apple Inc. Cupertino, California, USA	Hanh-Phuc Le University of California San Diego, USA	Antonio Liscidini University of Toronto Toronto, Canada
Chung-Cheng Liu MediaTek Hsinchu, Taiwan	Howard Luong Hong Kong University of Science and Technology Hong Kong, China	Pui-In Mak University of Macau Macau, China
Abishek Manian Texas Instruments Santa Clara, California, USA	Danilo Manstretta University of Pavia Pavia, Italy	Andrea Mazzanti Universita di Pavia Pavia, Italy
Patrick P. Mercier University of California, San Diego San Diego, California, USA	Samuel Palermo Texas A & M University College Station, Texas, USA	Jongsun Park Korea University Seoul, Korea
Shanthi Pavan Indian Institute of Technology, Madras Chennai, India	Priyanka Raina Stanford University, Electrical Engineering, Integrated Circuit Design USA	Saurabh Saxena Indian Institute of Technology Madras, India
Mingoo Seok Columbia University New York, NY, USA	Mina Shahmohammadi NXP The Netherlands	Shahriar Shahramian Bell Labs – Nokia New Providence, NJ, USA
Dr. Farhana Sheikh Intel Corporation MS: JF2-82 Hillsboro, Oregon, USA	Joseph Shor Bar Ilan University – Faculty of Engineering Israel	Jason Stauth Dartmouth University Hanover, New Hampshire, USA
Ken Takeuchi University of Tokyo Tokyo, Japan	Xiyuan Tang Peking University Beijing, China	Ka-Fai Un University of Macau Macao, China
John Wuu Advanced Micro Devices Fort Collins, CO	Shiheng Yang University of Electronic Science and Technology of China, China	Hong Zhang Xi’an Jiaotong University Xi’an, China
Xin Zhang IBM T.J. Watson Research Center Yorktown Heights, NY, USA