Y. Chae
Yonsei University
Seoul, Korea
| M. F. (Marvin) Chang
Department of Electrical Engineering
National Tsing Hua University
Taiwan
| J. Choi
Department of Electrical & Computer Engineering
Seoul National University
|
T. Dinc
Texas Instruments
Dallas, TX USA
| Y. Dong
MediaTek Inc.
USA
| Dr. N. A. W. Dutton
STMichroelectronics
Edinburgh, U.K.
|
Q. Fan
Delft University of Technology
Delft, Netherlands
| M. Fujishima
Graduate School of Advanced Science & Engineering
Hiroshima University
Japan
| V. Giannini
L&T Semiconductor Technologies
Austin, TX, USA
|
J. Gu
Northwestern University
Evanston, IL USA
| Q. J. Gu
Georgia Institute of Technology
Atlanta, GA USA
| T. Jang
Institute of Integrated Systems
ETH Zurich
Switzerland
|
B. Keller
NVIDIA Research
Santa Clara, CA USA
| C. Kim
Korea University
Seoul, Republic of Korea
| H. Lee
Department of Electrical & Computer Engineering
University of Texas at Dallas
USA
|
T. C. Lee
National Taiwan University
Taipei, Taiwan
| S. Matthew
Intel Corp.
USA
| M. Ortmanns
University of Ulm
Ulm, Germany
|
S. Palermo
Texas A&M University
College Station, TX USA
| P. Raina
Stanford University
Stanford, CA USA
| P. Reynaert
KU Leuven ESAT-MICAS
Belgium
|
D. Rossie
University of Bologna
Bologna, Italy
| B. Sadhu
IBM Thomas J. Watson Research Center
Yorktown Heights, NY USA
| V. Sathe
Georgia Institute of Technology
Atlanta, GA USA
|
F. Sebastiano
Delft University of Technology
Netherlands
| J. T. Stauth
Thayer School of Engineering at Dartmouth College
Hanover, NH USA
| K. Takeuchi
The University of Tokyo
Tokyo, Japan
|
W. Wu
Samsung Semiconductor, Inc.
San Jose, CA USA
| H. Xu
Fudan University
Shanghai, China
| C. H. Yang
National Taiwan University
Taipei, Taiwan
|
