- This event has passed.
Register Here: https://ieee.webex.com/weblink/register/rfc728634e9a28c5781c07a64ac865bbd
Abstract: In the field of circuits and systems, academia and industry have made tremendous progress over the past few decades, with many essential innovations emerging from their close collaborations. This webinar brings together two distinguished speakers, Prof. Fabio Sebastiano and Dr. Farhana Sheikh, who represent academia and industry, to discuss the critical connection between these sectors. The session will highlight strategies for fostering effective collaborations, bridging knowledge gaps, aligning research with industry needs, and advancing technology and education. Attendees will gain valuable insights into the benefits and best practices for impactful partnerships, with an opportunity to engage directly with the speakers through a Q&A session.
Presented By: Farhana Sheikh and Fabio Sebastiano
Fabio Sebastiano received the B.Sc. (cum laude) and M.Sc. (cum laude) degrees in electrical engineering from University of Pisa, Italy, in 2003 and 2005, respectively, the M.Sc. degree (cum laude) from Sant’Anna school of Advanced Studies, Pisa, Italy, in 2006 and the Ph.D. degree from Delft University of Technology, The Netherlands, in 2011.
From 2006 to 2013, he was with NXP Semiconductors Research in Eindhoven, The Netherlands, where he conducted research on fully integrated CMOS frequency references, nanometer temperature sensors, and area-efficient interfaces for magnetic sensors. In 2013, he joined Delft University of Technology, where he is currently an Associate Professor. He has authored or co-authored one book, 11 patents, and over 100 technical publications. His main research interests are cryogenic electronics, quantum computing, sensor read-outs, and fully integrated frequency references. For his academic research, he is collaborating with several companies, including Intel, Fujitsu, and NXP.
Dr. Sebastiano is on the technical program committee of the ISSCC, and the IEEE RFIC Symposium, and has been on the program committee of IMS. He is currently serving as Associate Editor of the JSSC and has also served as a Guest Editor of the JSSC and as an Associate Editor of the IEEE Transactions on VLSI. He was co-recipient of several awards, including the 2008 ISCAS Best Student Paper Award, the 2017 DATE best IP award, the ISSCC 2020 Jan van Vessem Award for Outstanding European Paper, and the 2022 IEEE CICC Best Paper Award. He has served as Distinguished Lecturer of the IEEE Solid-State Circuit Society.
Dr. Farhana Sheikh is a Principal Engineer and Research Manager at Altera, An Intel Company, where she co-leads Technology Pathfinding and manages the Advanced Chiplet Technologies Team. She has over 15 years of experience in ASIC and DSP/communications research including adaptive DSP, crypto, graphics, quantum wireless control, and 5G+ wireless. After over 10 years in Intel Labs, Farhana’s research focuses on 2-D and 3-D chiplet + FPGA integration research, with a focus on 3D heterogeneous integration for next generation wireless and sensing applications. Farhana has published over 50 papers and filed 22 patents, initiated the AIB-3D open-source specification for 3D chiplet heterogeneous integration, which was later used as the basis for the new UCIe-3D PHY standard. Farhana was instrumental in enabling Intel 16 for Intel’s IDM2.0 and is the co-creator of Intel’s University Shuttle Program. Outside of Intel she volunteers for IEEE Solid-State Circuits Society (SSCS) and co-chairs the SSCS Women in Circuits Committee. Farhana is a co-recipient of 2020, 2019, and 2012 IEEE ISSCC Outstanding Paper Awards. In 2021, Farhana was recognized for her mentorship work with students and faculty by the Semiconductor Research Corporation (SRC) that awarded her the 2021 Mahboob Khan Outstanding Industry Liaison Award. She is IEEE SSCS Member-at-Large for 2022-2024, and IEEE SSCS Distinguished Lecturer for 2023-2024. Farhana completed her M.Sc. and Ph.D. at University of California, Berkeley in 1996, and 2008 respectively.