Solids

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TexCAC: A Direct-Textile-Attachable Microcontroller Integrating 2-MB MRAM for the Command and Control of Advanced Smart Textiles

TexCAC: A Direct-Textile-Attachable Microcontroller Integrating 2-MB MRAM for the Command and Control of Advanced Smart Textiles 150 150
Author(s): Jacob Mack, Qirui Zhang, He Wang, Yi Shen, Jeongtaek Chang, Heejin Yang, Anjali Agrawal, Zichen Fan, Braden Desman, Zane Lewis, Thomas Farrell, David Blaauw, Will Farrell, Jim Owens, Benton H. Calhoun, Dennis Sylvester

Abstract:

Advanced smart textiles (ASTs) are textile-integrated electronic systems that enable many applications, including healthcare, robotics, and IoT. ASTs contain a variety of electronic components to enable whole system functionality (batteries, sensors, SoCs, etc.), which all require orchestration from a central command-and-control (CAC) module. The primary functions of the CAC module …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 3307 – 3316
Year of Publication: 2026
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2026.3695482
Publisher: IEEE

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A Two-Step Time-Domain Logic-Compatible Embedded-Flash Computing-in-Memory Macro for On-Device AI

A Two-Step Time-Domain Logic-Compatible Embedded-Flash Computing-in-Memory Macro for On-Device AI 150 150
Author(s): Jiho Chun, Byeongseon Choi, Edward Jongyoon Choi, Sohmyung Ha, Ik-Joon Chang, Minkyu Je

Abstract:

Computing in memory (CIM) has emerged as a promising architecture that can significantly reduce power consumption and latency in edge artificial intelligence (AI) devices. For battery-constrained edge devices, non-volatile memories (NVMs) are ideal due to their ability to retain neural network parameters even when powered down, ensuring rapid response time …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 15
Year of Publication: 2026
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2026.3717139
Publisher: IEEE

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A 500-MS/s 12-bit Pipeline-SAR ADC Using a PVT-Robust Triple-Cascoded FIA With Virtual Supply Extension

A 500-MS/s 12-bit Pipeline-SAR ADC Using a PVT-Robust Triple-Cascoded FIA With Virtual Supply Extension 150 150
Author(s): Michele Rocco, Gabriele Zanoletti, Alessia Ceroni, Giacomo Tombolan, Gabriele Bè, Luca Ricci, Salvatore Levantino, Andrea L. Lacaita, Luca Bertulessi, Carlo Samori, Andrea G. Bonfanti

Abstract:

The pipeline-successive approximation register (SAR) analog-to-digital converter (ADC) extends the energy efficiency and the scaling properties of SAR ADCs to the medium-to-high resolutions and high bandwidths typical of classical pipeline ADCs. However, the residue amplifier (RA) is often a performance and energy efficiency bottleneck, especially for high-speed designs in scaled …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 16
Year of Publication: 2026
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2026.3715775
Publisher: IEEE

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A Self-Calibrated NPN-Based Temperature Sensor With ±0.05 °C (3σ) Inaccuracy From −70 °C to 125 °C and 100fJ ${\\cdot}$ K2 Resolution FoM

A Self-Calibrated NPN-Based Temperature Sensor With ±0.05 °C (3σ) Inaccuracy From −70 °C to 125 °C and 100fJ ${\\cdot}$ K2 Resolution FoM 150 150
Author(s): Nandor G. Toth, Kofi A. A. Makinwa

Abstract:

This article presents a CMOS temperature sensor that achieves both state-of-the-art energy efficiency and accuracy. An NPN-based front-end generates both PTAT and CTAT currents, whose ratio is then digitized by a continuous-time (CT) $\Delta \Sigma $ modulator, which realizes a noise-optimized current-balancing scheme that maximizes the sensor’s resolution. To correct …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 12
Year of Publication: 2026
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2026.3721315
Publisher: IEEE

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A 31.5–36-GHz Low-Spur Digitally Assisted Gain-Boosting Charge-Sharing Locking PLL Achieving 54-fs RMS Jitter

A 31.5–36-GHz Low-Spur Digitally Assisted Gain-Boosting Charge-Sharing Locking PLL Achieving 54-fs RMS Jitter 150 150
Author(s): Chawin Khongprasongsiri, Sayan Kumar, Patchara Sawakewang, Robert Bogdan Staszewski, Teerachot Siriburanon

Abstract:

This article presents a 31.5–36 GHz digitally assisted gain-boosting (GB) charge-sharing locking (CSL) phase-locked loop (PLL) that achieves record-low reference spurs while maintaining sub-60 fs integrated jitter. In conventional CSL PLLs, reference spur suppression is fundamentally traded against loop bandwidth, whereas ping-pong CSL (PP-CSL) approaches typically require complex duty-cycle calibration. The …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 13
Year of Publication: 2026
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2026.3721352
Publisher: IEEE

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A Stress- and Temperature-Compensated TMR Current Sensor With ±0.13% Sensitivity Variation

A Stress- and Temperature-Compensated TMR Current Sensor With ±0.13% Sensitivity Variation 150 150
Author(s): Tianxiang Qu, Nan Wang, Zuo Zhang, Longxi Xiang, Ting Yi, Zhiliang Hong, Xiaoyang Zeng, Jiawei Xu

Abstract:

This article presents a high-precision tunnel magnetoresistance (TMR)-based non-contact current sensor with enhanced immunity to sensitivity drift. A background sensitivity stabilization loop (SSL) continuously regulates the TMR bias voltage to compensate intrinsic sensitivity variations. Through this closed-loop regulation, sensitivity drift of the TMR sensor induced by temperature, mechanical stress, …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 12
Year of Publication: 2026
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2026.3719689
Publisher: IEEE

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A Line-Connected Q-Sampler-Based Multi-Phase Hybrid Converter

A Line-Connected Q-Sampler-Based Multi-Phase Hybrid Converter 150 150
Author(s): Jiacheng Yang, Zihao Tang, Rui P. Martins, Zheng Wang, Lin Cheng, Mo Huang

Abstract:

This article presents a line-connected Q-sampler-based (LQS) multi-phase (MP) hybrid converter for direct conversion from high-rail to point-of-load (PoL). The proposed topology uses an input-parallel switched-capacitor (SC) structure to support “ALL-ON” operation during load transients, while a “multi-source- ${V}_{\mathrm { X}}$ ” control decouples voltage conversion ratio (VCR) from phase count, …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 12
Year of Publication: 2026
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2026.3718696
Publisher: IEEE

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THz-TSI: A Terahertz Wireless Through-Silicon Interconnect Module for Advanced 3-D Integration Applications

THz-TSI: A Terahertz Wireless Through-Silicon Interconnect Module for Advanced 3-D Integration Applications 150 150
Author(s): Chen Jiang, Xiaodi Feng, Xiaohan Shen, Chixiao Chen, Qi Liu, Ming Liu, Ningsheng Xu

Abstract:

By vertically stacking device layers, advanced 3-D integration overcomes traditional planar scaling limits, delivering the bandwidth and power efficiency essential for modern artificial intelligence (AI) and high-performance computing (HPC) integrated systems. However, continued scaling of conventional through-silicon vias (TSVs) and microbumps presents critical bottlenecks due to inherent thermo-mechanical stress, complex …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 13
Year of Publication: 2026
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2026.3720291
Publisher: IEEE

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A Calibration-Free Frequency-Scalable ΔΣ ADC Incorporating PVT-Robust Dynamic Integration

A Calibration-Free Frequency-Scalable ΔΣ ADC Incorporating PVT-Robust Dynamic Integration 150 150
Author(s): Tohru Kaneko, Hideaki Ishida, Yuzuru Yamaki, Satoshi Takehara, Un-Ku Moon

Abstract:

This article summarizes a calibration-free, frequency-scalable $Delta Sigma $ analog-to-digital converter (ADC) which employs dynamic open-loop integrators for low-power sensing systems. The integrators use a capacitive degeneration scheme to obtain an integration factor determined by a capacitor ratio. To enhance process-voltage-temperature (PVT) robustness, bottom-plate level shift (BPLS) and a timer are …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 14
Year of Publication: 2026
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2026.3719645
Publisher: IEEE

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