low power

A 23.9-μW 13.6-Bit Period Modulation-Based Capacitance-to-Digital Converter With Dynamic Current Mirror Front-End

A 23.9-μW 13.6-Bit Period Modulation-Based Capacitance-to-Digital Converter With Dynamic Current Mirror Front-End 150 150

Abstract:

This letter proposes a low-power high-precision capacitance-to-digital converter (CDC) utilizing a dynamic current mirror (DCM) to transform a sensor input capacitance $(C_{\mathrm{ IN}})$ into an output current. The resulting current is directly proportional to the ratio of $C_{\mathrm{ IN}}$ to an internal reference capacitor $(C_{\mathrm {REF}})$ and …

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An IEEE 802.15.4/4z Coherent Quadrature Hybrid Correlation UWB Receiver in 65-nm CMOS

An IEEE 802.15.4/4z Coherent Quadrature Hybrid Correlation UWB Receiver in 65-nm CMOS 150 150

Abstract:

This article presents a coherent ultra-wideband (UWB) receiver architecture based on a quadrature hybrid correlation (QHC) method that significantly reduces the digital-correlation-relevant power in the conventional standard-compliant UWB receiver. The proposed QHC receiver front end employs analog correlation, two-step synchronization with a digital-assisted path, and time-interleaved (TI) sampling methods for …

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A 300- $\mu$ W 2.4-GHz PVT-Insensitive Subthreshold Reference-Based LNA

A 300- $\mu$ W 2.4-GHz PVT-Insensitive Subthreshold Reference-Based LNA 150 150

Abstract:

This article introduces a novel ultra-low-power reference-based low-noise amplifier (LNA) designed to reduce performance variations due to process, voltage, and temperature (PVT) when operating in the subthreshold region. The LNA is embedded within a reference circuit that directly controls the performance of the LNA over PVT variations. By combining the …

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A 72-Channel Resistive-and-Capacitive Sensor-Interface Chip With Noise-Orthogonalizing and Pad-Sharing Techniques

A 72-Channel Resistive-and-Capacitive Sensor-Interface Chip With Noise-Orthogonalizing and Pad-Sharing Techniques 150 150

Abstract:

The growing trend of the Internet of Things (IoT) involves trillions of sensors in various applications. An extensive array of parameters need to be gathered concurrently with high-precision, low-cost, and low-power sensor nodes, such as resistive (R) and capacitive (C) sensors. Single-chip channel fusion can be an effective solution, while …

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