Circuits

1.58-b FeFET-Based Ternary Neural Networks: Achieving Robust Compute-In-Memory With Weight-Input Transformations

1.58-b FeFET-Based Ternary Neural Networks: Achieving Robust Compute-In-Memory With Weight-Input Transformations 150 150

Abstract:

Ternary weight neural networks (TWNs), with weights quantized to three states (−1, 0, and 1), have emerged as promising solutions for resource-constrained edge artificial intelligence (AI) platforms due to their high energy efficiency with acceptable inference accuracy. Further energy savings can be achieved with TWN accelerators utilizing techniques such as compute-in-memory (CiM) and …

View on IEEE Xplore

Non-Volatile ReRAM-Based Compact Event-Triggered Counters

Non-Volatile ReRAM-Based Compact Event-Triggered Counters 150 150

Abstract:

With an increasing number of transistors per circuit, the fabrication cost and the energy consumption of each integrated circuits increase exponentially, which drives the need to reduce the number of transistors. In this study, we explore a novel design for a 16-bit digital counter that utilizes a combination of complementary …

View on IEEE Xplore

Benchmarking of FERAM-Based Memory System by Optimizing Ferroelectric Device Model

Benchmarking of FERAM-Based Memory System by Optimizing Ferroelectric Device Model 150 150

Abstract:

We present a framework for design technology co-optimization (DTCO) of the main memory system with one transistor-one capacitor (1T1C) ferroelectric random access memory (FERAM) as an alternative to dynamic random access memory (DRAM). We start with the ferroelectric capacitor device model and perform array-level memory circuit simulation. Then, we …

View on IEEE Xplore

A Bit-Cell Failure Analysis Framework for Ferroelectric Field-Effect Transistor-Based Memories

A Bit-Cell Failure Analysis Framework for Ferroelectric Field-Effect Transistor-Based Memories 150 150

Abstract:

The ferroelectric field-effect transistor (FeFET) is a promising memory device technology due to desirable attributes, such as fast access times, high memory cell density, good endurance, compatibility with CMOS process, and impressive scalability. While previous research has explored the impact of process variations at the device level, their effects on …

View on IEEE Xplore

3-D Stacked HBM and Compute Accelerators for LLM: Optimizing Thermal Management and Power Delivery Efficiency

3-D Stacked HBM and Compute Accelerators for LLM: Optimizing Thermal Management and Power Delivery Efficiency 150 150

Abstract:

Advanced packaging is becoming essential for designing hardware accelerators for large language models (LLMs). Different architectures, such as 2.5-D integration of memory with logic, have been proposed; however, the bandwidth limits the throughput of the complete system. Recent works have proposed memory on logic systems, where high bandwidth memory (HBM) …

View on IEEE Xplore

A 28-nm Computing-in-Memory Processor With Zig-Zag Backbone-Systolic CIM and Block-/Self-Gating CAM for NN/Recommendation Applications

A 28-nm Computing-in-Memory Processor With Zig-Zag Backbone-Systolic CIM and Block-/Self-Gating CAM for NN/Recommendation Applications 150 150

Abstract:

Computing-in-memory (CIM) chips have demonstrated promising energy efficiency for artificial intelligence (AI) applications such as neural networks (NNs), Transformer, and recommendation system (RecSys). However, several challenges still exist. First, a large gap between the macro and system-level CIM energy efficiency is observed. Second, several memory-dominate operations, such as embedding in …

View on IEEE Xplore

A Fully-Dynamic Capacitive Touch Sensor With Tri-level Energy Recycling and Compressive Sensing Technique

A Fully-Dynamic Capacitive Touch Sensor With Tri-level Energy Recycling and Compressive Sensing Technique 150 150

Abstract:

Capacitive touch screens have become the dominant user interface over the past decade. Achieving high framerates with low power consumption remains a critical design goal for touch systems. The conventional charge-recycling technique reduces driving power by 64%, but it relies on off-chip capacitors. To address this issue, we propose a tri-level …

View on IEEE Xplore

Reference-Load Sharing Scheme: An Area- and Energy-Efficient Nonvolatile Register Design Using MTJ Devices

Reference-Load Sharing Scheme: An Area- and Energy-Efficient Nonvolatile Register Design Using MTJ Devices 150 150

Abstract:

This article proposes a circuit configuration for an area- and energy-efficient nonvolatile register using magnetic tunnel junction (MTJ) devices, suitable for persistent computation in intermittent computing environments. The proposed configuration, named the reference-load sharing scheme (RLSS), stores 1 bit of information using the resistance of a dedicated MTJ device and a …

View on IEEE Xplore

SLiMDO: A Single-Link Multi-Domain-Output Isolated DC–DC Converter With Passive Magnetic Flux Sharing for Local Energy Distribution and Rx Behavior Sensing-Based Global Power Modulation

SLiMDO: A Single-Link Multi-Domain-Output Isolated DC–DC Converter With Passive Magnetic Flux Sharing for Local Energy Distribution and Rx Behavior Sensing-Based Global Power Modulation 150 150

Abstract:

This article introduces a small form-factor single-link multi-domain-output (SLiMDO) isolated dc–dc converter design. The proposed design provides two regulated outputs in separate domains in the receiver (Rx) side with a single micro-transformer. These isolated Rxes achieve local voltage regulation and automatic energy distribution across domains through passive magnetic flux …

View on IEEE Xplore