Publications
SSCS proudly sponsors six top-notch publications as complimentary member benefits in print and electronic formats. The IEEE Journal of Solid-State Circuits (JSSC) - historically one of the top-five downloaded technical journals on IEEE Xplore - is available on-line and in print. The electronic-only Solid-State Circuits Letters (SSC-L) is a brief format companion to the JSSC that offers fast turnaround to authors for the latest innovations in our field. The IEEE Journal on Exploratory Solid-State Computational Devices and Circuits (JxCDC) - an open-access monthly accessible free of charge via IEEE Xplore - offers researchers a journal to publish and extend their research results with supplementary technical materials. Our newest open-access journal, IEEE Open Journal of Solid-State Circuits launches in Fall 2020.
|
Shanthi Pavan Vice President of Publications |
Members also receive the IEEE Solid-State Circuits Magazine free of charge (in print and on-line), which is a tutorial-level quarterly featuring pioneering breakthroughs, trending topics, and “who’s who” reports about IC community leaders and international, regional, and local award recipients. Other electronic-only publications are the RFIC Virtual Journal, a one-stop, curated compilation of RFIC papers within the publications library of the IEEE, and IEEE Design & Test Magazine, which offers insight into models, methods and tools for microelectronic systems.
- IEEE Journal of Solid-State Circuits
- Guest Editorial Introduction to the Special Issue on the 2021 IEEE International Solid-State Circuits Conference (ISSCC)
- A Self-Calibrated Hybrid Thermal-Diffusivity/Resistor-Based Temperature Sensor
- Energy-Efficient CMOS Humidity Sensors Using Adaptive Range-Shift Zoom CDC and Power-Aware Floating Inverter Amplifier Array
- An 82-mW -Based Filter-Less Class-D Headphone Amplifier With 93-dB THDN, 113-dB SNR, and 93 Efficiency
- A Fill-In Technique for Robust IMD Suppression in Chopper Amplifiers
- A 5-V Dynamic Class-C Paralleled Single-Stage Amplifier With Near-Zero Dead-Zone Control and Current-Redistributive Rail-to-Rail
G m-Boosting Technique - An Automotive-Grade Monolithic Masterless Fault-Tolerant Hybrid Dickson DCDC Converter for 48-V Multi-Phase Applications
- Fully Integrated GaN-on-Silicon Gate Driver and GaN Switch With Temperature-Compensated Fast Turn-on Technique for Achieving Switching Frequency of 50 MHz and Slew Rate of 118.3 V/Ns
- A 12-Level Series-Capacitor 48-1V DCDC Converter With On-Chip Switch and GaN Hybrid Power Conversion
- A 1.25-GHz Fully Integrated DCDC Converter Using Electromagnetically Coupled Class-D
LC Oscillators - A 12-b 16-GS/s RF-Sampling Capacitive DAC for Multi-Band Soft Radio Base-Station Applications With On-Chip Transmission-Line Matching Network in 16-nm FinFET
- A 13.8-ENOB Fully Dynamic Third-Order Noise-Shaping SAR ADC in a Single-Amplifier EF-CIFF Structure With Hardware-Reusing kT/C Noise Cancellation
- A Hybrid-Loop Structure and Interleaved Noise-Shaped Quantizer for a Robust 100-MHz BW and 69-dB DR DSM
- A
Ka -Band Doherty-Like LMBA for High-Speed Wireless Communication in 28-nm CMOS - A Low-Power Reflection-Coefficient Sensor for 28-GHz Beamforming Transmitters in 22-nm FD-SOI CMOS
- Quadrature Switched/Floated Capacitor Power Amplifier With Reconfigurable Self-Coupling Canceling Transformer for Deep Back-Off Efficiency Enhancement
- A Low Phase Noise and High FoM Distributed-Swing-Boosting Multi-Core Oscillator Using Harmonic-Impedance-Expanding Technique
- A 32-kHz-Reference 2.4-GHz Fractional-
N Oversampling PLL With 200-kHz Loop Bandwidth - A 14-nm Ultra-Low Jitter Fractional-
N PLL Using a DTC Range Reduction Technique and a Reconfigurable Dual-Core VCO
- High-Accuracy Deep Belief Network: Fuzzy Neural Networks Using MRAM-Based Stochastic Neurons
- Combining Accuracy and Plasticity in Convolutional Neural Networks Based on Resistive Memory Arrays for Autonomous Learning
- Assessment of Two-Dimensional Materials-Based Technology for Analog Neural Networks
See more issues of IEEE Journal on Exploratory Solid-State Computational Devices and Circuits
- List Staff
- [Contributors]
- Welcome to the Fall 2021 Issue of IEEE Solid-State Circuits Magazine [Editors Note]
- Reflections [Presidents Corner]
- The Design of an EqualizerPart One [The Analog Mind]
- Buck and Boost Converters [Circuit Intuitions]
- Duct Tape for the Frequency Domain: If This Ol Hack Dont Fix It, It Aint Broke [Shop Talk: What You Didnt Learn in School]
- Women in Circuits [Guest Editorial]
- Circuit Implementation Using Emerging Technologies: Enabling energy-efficient electronics for biomedical and power management applications
- Low-Jitter Frequency Generation Techniques for 5G Communication: A tutorial
- Cyclic Sparsely Connected Architectures: From foundations to applications
- 2.5D and 3D Heterogeneous Integration: Emerging applications
- Miniaturized Wireless Neural Interfaces: A tutorial
- Interface Circuits for Piezoelectric Energy Harvesting: A review of designs and methods
- A Review of Nonmagnetic Nonreciprocal Electronic Devices: Recent advances in nonmagnetic nonreciprocal components
- Now Accepting Applications: IEEE Solid-State Circuits Society James D. Meindl Innovators Award: Deadline for Submissions: December 15th [Society News]
- Democratizing IC Design: The Story of a New Movement and the Launch of the SSCS PICO Program [Society News]
- Mentors and Mentees From All Around the World Connect Virtually at VLSI 2021 [Society News]
- SSCS Holds Two Episodes of Webinars for Young Excellence [Society News]
- IEEE SSCS Macau Chapter Hosts Two Invited Lectures [Chapters]
Aims & Scope - This new electronic publication provides relevant references pertaining to RFIC technology, paired with value-added editorial commentary from technology experts. The RFIC Virtual Journal aims to be the leading focal point on radio frequency integrated circuits from a worldwide perspective by collecting and disseminating knowledge on theory; enabling technologies, design methodologies, fabrication, testing of radio frequency integrated circuits, and systems; and determining which process signals to be transmitted or received through wireless communication.
To access this journal content have your IEEE Xplore login information ready and click here.
- Editorial Welcome to the New Editor-in-Chief
- A 5-V-Program 1-V-Sense Anti-Fuse Technology Featuring On-Demand Sense and Integrated Power Delivery in a 22-nm Ultra Low Power FinFET Process
- 10-nm SRAM Design Using Gate-Modulated Self-Collapse Write-Assist Enabling 175-mV
V MIN Reduction With Negligible Active Power Overhead - A 9-bit, 45 mW, 0.05 mm2 Source-Series-Terminated DAC Driver With Echo Canceller in 22-nm CMOS for In-Vehicle Communication
- A 40-nm Ultra-Low Leakage Voltage-Stacked SRAM for Intelligent IoT Sensors
- High Slew-Rate Quadruple-Voltage Mixed-Quenching Active-Resetting Circuit for SPADs in 0.35-
m CMOS for Increasing PDP