SSCS proudly sponsors six top-notch publications as complimentary member benefits in print and electronic formats. The IEEE Journal of Solid-State Circuits (JSSC) - historically one of the top-five downloaded technical journals on IEEE Xplore - is available on-line and in print. The electronic-only Solid-State Circuits Letters (SSC-L) is a brief format companion to the JSSC that offers fast turnaround to authors for the latest innovations in our field. The IEEE Journal on Exploratory Solid-State Computational Devices and Circuits (JxCDC) - an open-access monthly accessible free of charge via IEEE Xplore - offers researchers a journal to publish and extend their research results with supplementary technical materials. Our newest open-access journal, IEEE Open Journal of Solid-State Circuits launches in Fall 2020. 

Shanthi Pavan

Shanthi Pavan

Vice President of Publications 

Members also receive the IEEE Solid-State Circuits Magazine free of charge (in print and on-line), which is a tutorial-level quarterly featuring pioneering breakthroughs, trending topics, and “who’s who” reports about IC community leaders and international, regional, and local award recipients.  Other electronic-only publications are the RFIC Virtual Journal, a one-stop, curated compilation of RFIC papers within the publications library of the IEEE, and IEEE Design & Test Magazine, which offers insight into models, methods and tools for microelectronic systems.



See more issues of JSSC.

Aims & Scope - This new electronic publication provides relevant references pertaining to RFIC technology, paired with value-added editorial commentary from technology experts. The RFIC Virtual Journal aims to be the leading focal point on radio frequency integrated circuits from a worldwide perspective by collecting and disseminating knowledge on theory; enabling technologies, design methodologies, fabrication, testing of radio frequency integrated circuits, and systems; and determining which process signals to be transmitted or received through wireless communication.

To access this journal content have your IEEE Xplore login information ready and click here.