Abstract: Three-dimensional integrated circuits (3D ICs) are shaping the future of AI hardware by stacking multiple chips vertically to achieve higher bandwidth, lower latency, and better energy efficiency. But this vertical integration also introduces new design challenges, including heat dissipation, power delivery, cross-layer timing, clock distribution, routing congestion, and multi-physics reliability, making manual design impractical. In this talk, I will present our work on algorithm-driven automation for 3D ICs, in which complex designs are automatically generated and optimized using advanced computational methods rather than being handcrafted by engineers. In this talk, we cover the full physical design flow, from 3D partitioning, placement, routing, and clock network design to power, thermal, timing, and final sign-off. Our AI-enhanced techniques work together with traditional EDA tools to enable scalable, high-performance, and robust 3D integrated systems.
Register here: https://ieee.webex.com/weblink/register/rcd347508b711a4baaed5476ae62eabee
Bios: Dr. Sung Kyu Lim is Dean’s Professor of Electrical and Computer Engineering at the University of Southern California, joining in Fall 2025 after over two decades at Georgia Tech. He received his B.S., M.S., and Ph.D. in Computer Science from UCLA. His research focuses on the architecture, design, and electronic design automation (EDA) of 2.5D and 3D integrated circuits, with over 450 publications. Dr. Lim is an IEEE Fellow and recipient of major awards, including multiple Best Paper Awards (DAC 2023, TCAD 2022), and several Georgia Tech teaching honors. From 2022 to 2024, he served as a Program Manager at DARPA’s Microsystems Technology Office.