Voltage

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A 1.1-nJ/Conversion RC-Discharge-Based Resistance Sensor With ±0.65% (3σ) 1 -Point Trimmed Inaccuracy in 0.18-μm CMOS Technology

A 1.1-nJ/Conversion RC-Discharge-Based Resistance Sensor With ±0.65% (3σ) 1 -Point Trimmed Inaccuracy in 0.18-μm CMOS Technology 150 150
Author(s): Mu Wu, Yihang Cheng, Xingli Cui, Sining Pan, Huaqiang Wu

Abstract:

This letter presents an energy-efficient RC discharge-based sensor readout circuit for sub-kilo-ohm resistance measurements. An SAR logic is implemented to adjust the DAC capacitor array to equalize the RC time constants of the resistance-sensing and DAC branches, thereby eliminating the high static current required to bias the small sensing resistor. …

Published in: IEEE Solid-State Circuits Letters
Page(s): 109 – 112
Year of Publication: 2026
Electronic ISSN: 2573-9603
DOI: 10.1109/LSSC.2026.3677301
Publisher: IEEE

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A 7-Level 18-Wire-State Trio-Signaling Transmitter for MIPI C-PHY 3.0 Interfaces

A 7-Level 18-Wire-State Trio-Signaling Transmitter for MIPI C-PHY 3.0 Interfaces 150 150
Author(s): Junyeong Lee, Myeongjin Oh, Kiwoon Kim, Jung-Hoon Chun

Abstract:

This letter presents a MIPI C-PHY v3.0 TX, which adopts trio-signaling using three wires per lane. Each line supports seven-level signaling, enabling 18 wire states to map 32-bit data into nine symbols, achieving 3.56 bits/symbol efficiency. Balanced coding maintains constant driver current, enhancing SSO noise immunity, and embedded clocking is achieved …

Published in: IEEE Solid-State Circuits Letters
Page(s): 101 – 104
Year of Publication: 2026
Electronic ISSN: 2573-9603
DOI: 10.1109/LSSC.2026.3672642
Publisher: IEEE

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Sub-Terahertz Wideband ASK Transceiver for 14/27/64 Gb/s 0.27-km/0.12-m/0.1-mm Interconnection in 28-nm CMOS

Sub-Terahertz Wideband ASK Transceiver for 14/27/64 Gb/s 0.27-km/0.12-m/0.1-mm Interconnection in 28-nm CMOS 150 150
Author(s): Dawei Tang, Xiaoyue Xia, Leyang Huang, Zekun Li, Chun Yang, Zheng Yan, Si-Yuan Tang, Peigen Zhou, Rui Zhang, Liqun Lu, Wentao Zhu, Zhe Chen, Jixin Chen, Hao Gao, Wei Hong

Abstract:

This article presents a 28-nm CMOS sub-terahertz (sub-THz) amplitude shift-keying (ASK) transceiver achieving competitive wireless and wireline communication performance. The over-the-air (OTA) link demonstrates 14 Gb/s/0.27 km, 16Gb/s/1m, and 27 Gb/s/12 cm without equalization (EQ), while supporting 64 Gb/s on-Off keying (OOK) and 40 Gb/s pulse amplitude modulation (…

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 17
Year of Publication: 2026
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2026.3665552
Publisher: IEEE

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A Pseudo-Series Resonance CMOS Oscillator

A Pseudo-Series Resonance CMOS Oscillator 150 150
Author(s): Jiawen Chen, Kai Xu, Teerachot Siriburanon, Robert Bogdan Staszewski

Abstract:

This article presents a single-core, low-phase-noise (PN) digitally controlled oscillator (DCO) employing a pseudo-series resonance (pseudo-SR) technique with a transformer-based resonator. The proposed pseudo-SR resonator offers two key advantages: 1) a low impedance with a 180° phase shift at the impedance pole, emulating series resonance (SR) to enable single-stage oscillation and reduce …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 14
Year of Publication: 2026
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2026.3663515
Publisher: IEEE

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A Compact Reconfigurable Dual-Path Dual-Band LNA for 5G NR FR2 Applications

A Compact Reconfigurable Dual-Path Dual-Band LNA for 5G NR FR2 Applications 150 150
Author(s): Pei Qin, Junyu Wu, Taotao Xu, Yongchun Li, Wenjie Feng, Quan Xue, Wenquan Che

Abstract:

This article presents a reconfigurable dual-path dual-band low noise amplifier (LNA) for fifth generation (5G) millimeter-wave (mmW) communications. A novel band-switching input matching architecture based on the cross-connected transistors is proposed to achieve optimal dual-band input matching and $g_{m}$ -boosting. This architecture allows the dual-band input transistors to share …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 14
Year of Publication: 2026
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2026.3661593
Publisher: IEEE

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A 475-nW Area-Efficient Programmable Analog Feature Extraction Filterbank for Audio Classification

A 475-nW Area-Efficient Programmable Analog Feature Extraction Filterbank for Audio Classification 150 150
Author(s): Patrice Abbie D. Legaspi, Shubham Yadav, Mark S. Oude Alink, Bram Nauta

Abstract:

Audio classification in edge devices has many applications and can be implemented at varying levels of complexity, typically consisting of a feature extractor followed by a classifier. Such devices are often always-on, constantly listening to their surroundings, and have a small form factor; therefore, they require low-power operation and high …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 15
Year of Publication: 2026
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2026.3655426
Publisher: IEEE

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A Low-Reference-Spur Injection-Locked Clock Multiplier Using Sub-Sampling Frequency Tracking Loop and Injection Pulse Timing Calibrator

A Low-Reference-Spur Injection-Locked Clock Multiplier Using Sub-Sampling Frequency Tracking Loop and Injection Pulse Timing Calibrator 150 150
Author(s): Hyeonjun Nam, Hyogyoung An, Changmin An, Sungjin Kim, Heein Yoon

Abstract:

This article presents an injection-locked clock multiplier (ILCM) achieving the low-reference spur (spur ${}_{\mathrm {REF}}$ ) with minimal overhead of a calibrator. To remove the dominant sources of frequency error, which are frequency drift ( $f_{\mathrm {DF}}$ ), phase offset ( $\varPhi _{\mathrm {OS}}$ ), and injection-induced phase error ( $\varPhi _{\mathrm {INJ}}$ ), the ILCM …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 11
Year of Publication: 2026
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2025.3650135
Publisher: IEEE

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A 77-fJ/bit 8-Gbps Adaptive-Voltage-Compatible Self-Timed Die-to-Die Link for 2.5-D and 3-D Interconnect in 3 nm

A 77-fJ/bit 8-Gbps Adaptive-Voltage-Compatible Self-Timed Die-to-Die Link for 2.5-D and 3-D Interconnect in 3 nm 150 150
Author(s): Brian Zimmer, Stephen G. Tell, C. Thomas Gray

Abstract:

This work presents a self-timed die-to-die link that serializes four data bits per pin for 2.5-D, or 3-D interconnects using a standard adaptive digital clock and voltage supply. The link achieves 8 Gbps of per-pin bandwidth with a latency of one cycle, energy efficiency of 77 fJ/b, and bandwidth density of 44…

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 10
Year of Publication: 2026
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2026.3658215
Publisher: IEEE

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A Folded-Differential Switched-Capacitor SRAM CIM Macro With Scalable MAC Sizes for TinyML Inference

A Folded-Differential Switched-Capacitor SRAM CIM Macro With Scalable MAC Sizes for TinyML Inference 150 150
Author(s): Zhonghao Chen, Ling-An Cheong, Tianyi Yu, Yiming Chen, Guodong Yin, Teng Yi, Yongpan Liu, Huazhong Yang, Xueqing Li

Abstract:

This letter presents a switched-capacitor SRAM compute-in-memory macro optimized for TinyML inference. Key features include: 1) an area-efficient folded-differential multiply-and-accumulate (FD-MAC) scheme to double the signal margin; 2) a closed-loop floating-inverter amplifier (FIA)-based charge accumulation technique for signal-to-noise ratio enhancement and multiply-and-accumulate (MAC) voltage integration; and 3) a sparsity-aware multistep MAC method …

Published in: IEEE Solid-State Circuits Letters
Page(s): 73 – 76
Year of Publication: 2026
Electronic ISSN: 2573-9603
DOI: 10.1109/LSSC.2026.3662477
Publisher: IEEE

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