Transistors

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A 298–334-GHz Scalable Injection-Locked Phased-Array Radiator With Second-Subharmonic-Termination-Assisted Waveform Formulation for Power Enhancement

A 298–334-GHz Scalable Injection-Locked Phased-Array Radiator With Second-Subharmonic-Termination-Assisted Waveform Formulation for Power Enhancement 150 150
Author(s): Meng Yang, Liang Wu

Abstract:

This article introduces an injection-locked $4\times 2$ phased-array radiator featuring scalability in both horizontal and vertical dimensions. The system architecture is constructed by sequentially cascading four identical phase-shifting and frequency-quadrupling (PSFQ) elements in a chain-like configuration and then cohering two such chains, thereby achieving global frequency synchronization. Particularly, phase shifting and …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 12
Year of Publication: 2025
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2025.3624563
Publisher: IEEE

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A 14-b Energy-Efficient BW/Power Scalable CTDSM With a Frequency-Controlled Current Source

A 14-b Energy-Efficient BW/Power Scalable CTDSM With a Frequency-Controlled Current Source 150 150
Author(s): Xinjie Wu, Xiaopeng Yu, Nick Nianxiong Tan, Zhong Tang

Abstract:

This work presents a 14-bit energy-efficient bandwidth (BW)/power scalable continuous-time delta–sigma modulator (CTDSM) for sensor interfaces in IoT applications. To ensure low noise for small input signals and achieve BW/power scalability, it is built around Gm-C integrators biased via a linear frequency-controlled current source (FCCS). The FCCS …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 10
Year of Publication: 2025
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2025.3621527
Publisher: IEEE

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A Dual-Input Bidirectional Three-Level Battery Charger Using Coarse-Fine V CF Balancing and Frequency Foldback Control for Foldable Mobile Applications

A Dual-Input Bidirectional Three-Level Battery Charger Using Coarse-Fine V CF Balancing and Frequency Foldback Control for Foldable Mobile Applications 150 150
Author(s): Woojin Hong, Hyebong Ko, Jinwoo So, Woonhyung Heo, Yonghwan Cho, Jeongdu Yoo, Ho-Sung Son, Youngwoo Chung, Dong-Joon Kim, Byeonghyeon Jin, Minkyu Kwon, Kyungmin Park, Daeyong Han, Sungkye Cho, Daewoong Cho, Jung Wook Heo, Sungwoo Lee, Sungwoo Moon, Hyoung-Seok Oh, Hwayeal Yu

Abstract:

Foldable mobile applications recently have been leading the battery charger to have a slim height with a small form-factor and high efficiency at higher input voltages to increase the power density. Another trend for mobile applications is the power sharing, which enables to supply two mobile devices simultaneously. To meet …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 15
Year of Publication: 2025
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2025.3618150
Publisher: IEEE

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1.58-b FeFET-Based Ternary Neural Networks: Achieving Robust Compute-In-Memory With Weight-Input Transformations

1.58-b FeFET-Based Ternary Neural Networks: Achieving Robust Compute-In-Memory With Weight-Input Transformations 150 150
Author(s): Imtiaz Ahmed, Akul Malhotra, Revanth Koduru, Sumeet Kumar Gupta

Abstract:

Ternary weight neural networks (TWNs), with weights quantized to three states (−1, 0, and 1), have emerged as promising solutions for resource-constrained edge artificial intelligence (AI) platforms due to their high energy efficiency with acceptable inference accuracy. Further energy savings can be achieved with TWN accelerators utilizing techniques such as compute-in-memory (CiM) and …

Published in: IEEE Journal on Exploratory Solid-State Computational Devices and Circuits
Page(s): 157 – 165
Year of Publication: 2025
Electronic ISSN: 2329-9231
DOI: 10.1109/JXCDC.2025.3621160
Publisher: IEEE

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Comprehensive Device to System Co-Design for SOT-MRAM at the 7 nm Node

Comprehensive Device to System Co-Design for SOT-MRAM at the 7 nm Node 150 150
Author(s): Piyush Kumar, Da Eun Shim, Azad Naeemi

Abstract:

This work presents a comprehensive spin-orbit torque (SOT)-based magnetic random access memory (MRAM) design at the 7 nm technology node, spanning from device-level characteristics to system-level power performance area (PPA). At the device level, we show the tradeoffs among the write current, error rate, and time, based on mircomagnetic simulations. …

Published in: IEEE Journal on Exploratory Solid-State Computational Devices and Circuits
Page(s): 139 – 147
Year of Publication: 2025
Electronic ISSN: 2329-9231
DOI: 10.1109/JXCDC.2025.3621279
Publisher: IEEE

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Understanding Reliability Trade-Offs in 1T-nC and 2T-nC FeRAM Designs

Understanding Reliability Trade-Offs in 1T-nC and 2T-nC FeRAM Designs 150 150
Author(s): Sadik Yasir Tauki, Rudra Biswas, Rakesh Acharya, Jiahui Duan, Rajiv Joshi, Kai Ni, Vijaykrishnan Narayanan

Abstract:

Ferroelectric random access memory (FeRAM) is a promising candidate for energy-efficient nonvolatile memory, particularly for logic-in-memory and compute-in-memory (CIM) applications. Among the available cell architectures, One-Transistor–n-Capacitor (1T-nC) and two-transistor–n-capacitor (2T-nC) FeRAMs each offer distinct trade-offs in density, scalability, and reliability. In this work, we present a comparative study …

Published in: IEEE Journal on Exploratory Solid-State Computational Devices and Circuits
Page(s): 148 – 156
Year of Publication: 2025
Electronic ISSN: 2329-9231
DOI: 10.1109/JXCDC.2025.3619908
Publisher: IEEE

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Non-Volatile ReRAM-Based Compact Event-Triggered Counters

Non-Volatile ReRAM-Based Compact Event-Triggered Counters 150 150
Author(s): Moin Diwan, Shengchao Zhang, Zidu Li, Alex James, Bhaskar Choubey

Abstract:

With an increasing number of transistors per circuit, the fabrication cost and the energy consumption of each integrated circuits increase exponentially, which drives the need to reduce the number of transistors. In this study, we explore a novel design for a 16-bit digital counter that utilizes a combination of complementary …

Published in: IEEE Journal on Exploratory Solid-State Computational Devices and Circuits
Page(s): 131 – 138
Year of Publication: 2025
Electronic ISSN: 2329-9231
DOI: 10.1109/JXCDC.2025.3619415
Publisher: IEEE

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A 28-Gb/mm2 4XX-Layer 1-Tb 3-b/Cell WF-Bonding 3D-nand Flash With 5.6-Gb/s/Pin IOs

A 28-Gb/mm2 4XX-Layer 1-Tb 3-b/Cell WF-Bonding 3D-nand Flash With 5.6-Gb/s/Pin IOs 150 150
Author(s): Sang-Soo Park, Jae-Doeg Lyu, Myungjun Kim, Jaeyun Lee, Youngsun Song, Chung-Ho Yu, Hirano Makoto, Yongseok Kwon, Jong-Hoon Park, Ho-Joon Kim, Daein Lee, Donghyun Seo, Philkyu Kang, Byungrok Go, Minseok Kim, Seoyoon Jeon, Jaehwan Ryu, Jungmin Seo, Hwan-Seok Ku, Youngmin Jo, Doo-Hyun Kim, Hyunjun Yoon, Wontae Kim, Inmo Kim, Sunghoon Kim, Jiho Cho, Moosung Kim, Jae-Woo Im, Jongmin Park, Youngdon Choi, Il-Han Park, Chiweon Yoon, Hyunsuk Kim, Jaehoon Jang, Seungjae Lee, Ki-Whan Song, Sung-Hoi Hur

Abstract:

The challenge of evolving to create a memory that is shrinking compared to the previous generation while satisfying the high performance and low power required for flash memory has been present in every generation, but the recent rapid change to artificial intelligence (AI) trends is very tough, as the level …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 9
Year of Publication: 2025
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2025.3613774
Publisher: IEEE

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Beyond Backside Power: Backside Signal Routing as Technology Booster for Standard-Cell Scaling

Beyond Backside Power: Backside Signal Routing as Technology Booster for Standard-Cell Scaling 150 150
Author(s): Anup Ashok Kedilaya, Sirish Oruganti, Nishant Gupta, Xiuhao Zhang, Ilya Karpov, Mark A. Anders, Jaydeep P. Kulkarni

Abstract:

Advances in process technology enabling backside metals (BSMs) and contacts offer new design–technology co-optimization (DTCO) opportunities to further enhance power, performance, and area gains (PPA) in sub-3-nm nodes. This work exploits backside (BS) contact technology within standard cells to extend both signal and clock routing to BSM layers, …

Published in: IEEE Journal on Exploratory Solid-State Computational Devices and Circuits
Page(s): 107 – 115
Year of Publication: 2025
Electronic ISSN: 2329-9231
DOI: 10.1109/JXCDC.2025.3617784
Publisher: IEEE

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