Transistors

  • No Comments

A Third-Harmonic-Enhanced Triple-Push DCO Utilizing Source-Combining Technique

A Third-Harmonic-Enhanced Triple-Push DCO Utilizing Source-Combining Technique 150 150
Author(s): Qiyao Jiang, Zhuo Xu, Quan Pan, Pui-In Mak, Rui P. Martins, Jun Yin

Abstract:

This article presents a detailed investigation into optimizing the amplitude and phase of the transistor’s terminal voltages to generate a high 3rd-harmonic current in the millimeter-wave (mm-Wave) frequency. Based on the analysis, the digitally controlled source-combining triple-push (SCTP) oscillator is derived to significantly enhance the 3rd-harmonic current by introducing …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 13
Year of Publication: 2026
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2026.3692500
Publisher: IEEE

View on IEEE Xplore

  • No Comments

FeFET-Based CMOS Current Starvation Programmable Delay Element

FeFET-Based CMOS Current Starvation Programmable Delay Element 150 150
Author(s): Albi Mema, Simon Thomann, Hussam Amrouch

Abstract:

Programmable delay elements (PDEs) are crucial circuit building blocks that enable precise timing adjustments of signal transitions. They are used in various critical applications, like time-to-digital converters. They are often used to mitigate aging by clock skew tuning postfabrication. However, typical CMOS PDE designs require many transistors while still offering …

Published in: IEEE Solid-State Circuits Letters
Page(s): 166 – 169
Year of Publication: 2026
Electronic ISSN: 2573-9603
DOI: 10.1109/LSSC.2026.3692304
Publisher: IEEE

View on IEEE Xplore

  • No Comments

A Logic-Compatible 2-Transistor Embedded Bipolar RRAM MACRO: A 28-nm Multiple-Time Programmable (MTP) Memory Without Extra Masks

A Logic-Compatible 2-Transistor Embedded Bipolar RRAM MACRO: A 28-nm Multiple-Time Programmable (MTP) Memory Without Extra Masks 150 150
Author(s): Yi Xiang Huang, Y. S. Lin, P. S. Huang, E. Ray Hsieh

Abstract:

This letter presents a 2-transistor (2T) bipolar embedded resistive RAM (eRRAM) MACRO fabricated in a 28-nm high-k metal gate (HKMG) process for multitime programmable (MTP) applications. To overcome the scaling bottlenecks of traditional embedded Flash, this work utilizes an extra-mask-free, pure front-end-of-line (FEOL) integration, offering a robust solution for automotive …

Published in: IEEE Solid-State Circuits Letters
Page(s): 117 – 120
Year of Publication: 2026
Electronic ISSN: 2573-9603
DOI: 10.1109/LSSC.2026.3675063
Publisher: IEEE

View on IEEE Xplore

  • No Comments

A 142–164-GHz Phased-Array AiP Module With High-Power-Density and High-Efficiency Transceiver in 65-nm CMOS for 6G UE

A 142–164-GHz Phased-Array AiP Module With High-Power-Density and High-Efficiency Transceiver in 65-nm CMOS for 6G UE 150 150
Author(s): Yudai Yamazaki, Yohei Morishita, Sunghwan Park, Takaya Uchino, Chenxin Liu, Jun Sakamaki, Akihiro Egami, Ryosuke Hasaba, Ken Takahashi, Tomoki Abe, Tomohiro Murata, Yoichi Nakagawa, Takashi Tomura, Hiroshi Taneda, Kei Murayama, Makoto Tsukahara, Hiroko Ota, Yoko Nakabayashi, Ryuji Kinugawa, Takumi Kojima, Anyi Tian, Kotaro Ito, Chun Wang, Hans Herdian, Yi Zhang, Zheng Li, Wenqian Wang, Hongye Huang, Dingxin Xu, Sena Kato, Michihiro Ide, Shinsuke Hara, Issei Watanabe, Akifumi Kasamatsu, Yuncheng Zhang, Hiroyuki Sakai, Kazuaki Kunihiro, Atsushi Shirane, Koji Takinami, Kenichi Okada

Abstract:

This work presents a D-band high-power-density four-element phased-array transceiver for 6G user equipment (UE). Conventional designs require large multi-stage LO generation circuits for D-band up/down conversion, making it difficult to achieve compact size and low-power consumption. To address this, we propose an integrated LO chain using an injection-locked tripling …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1275 – 1293
Year of Publication: 2026
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2026.3665184
Publisher: IEEE

View on IEEE Xplore

  • No Comments

A 1.16 e-rms Temporal Random Noise, 123-dB High Dynamic Range, 2.988-μm Pitch 3-Mpixel Three-Stacked Digital Pixel Sensor for Versatile Applications

A 1.16 e-rms Temporal Random Noise, 123-dB High Dynamic Range, 2.988-μm Pitch 3-Mpixel Three-Stacked Digital Pixel Sensor for Versatile Applications 150 150
Author(s): Min-Woong Seo, Yong-Suk Choi, Sanggwon Lee, Yeongseok Shim, Gihwan Cho, Daehee Bae, Masamichi Ito, Jaehun Jeong, Hiroyuki Sugihara, Si-Gyoung Koo, Sung-Jae Byun, Hyukbin Kwon, Youna Lee, Bumjun Kim, Su-Hyun Han, Suksan Kim, Wonoh Ryu, Kwan-Sik Kim, Yongjun Kim, Seung-Sik Kim, Junghoon Jung, Sun-Young Yoo, Jinkyeong Heo, Seung-Chul Shin, Heesung Shim, Jae-Kyu Lee, Jonghyun Go, Jaihyuk Song

Abstract:

This article presents a 3-Mpixel (Mp) three-stacked digital pixel sensor (DPS) featuring the world’s smallest pixel pitch of $2.988~\mu $ m, achieving a low temporal random noise (RN) of 1.16 e-rms and a high dynamic range (HDR) of 123 dB in global-shutter (GS) operation mode for versatile applications. To realize both the …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1319 – 1332
Year of Publication: 2026
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2026.3663214
Publisher: IEEE

View on IEEE Xplore

  • No Comments

A 2–18 GHz High-Efficiency CMOS Nonuniform Distributed Power Amplifier With a Novel Reconfigurable Inductive Termination

A 2–18 GHz High-Efficiency CMOS Nonuniform Distributed Power Amplifier With a Novel Reconfigurable Inductive Termination 150 150
Author(s): Bo Pang, Fei You, Taotao Pang, Rongxing Qin, Zehua Xiao, Yingjie Liu, Yingyu Liu, Xinyu Wang, Junfu Guo, Songbai He

Abstract:

This article presents a 2–18 GHz high-efficiency CMOS nonuniform distributed power amplifier (NDPA) with a novel reconfigurable inductive termination technique for ultra-broadband efficiency enhancement. First, the inherent drawback of the degrading efficiency with growing frequency in a conventional non-reconfigurable NDPA architecture with multi-octave bandwidth is studied. A simple and effective reconfigurable …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 12
Year of Publication: 2026
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2026.3665920
Publisher: IEEE

View on IEEE Xplore

  • No Comments

Sub-Terahertz Wideband ASK Transceiver for 14/27/64 Gb/s 0.27-km/0.12-m/0.1-mm Interconnection in 28-nm CMOS

Sub-Terahertz Wideband ASK Transceiver for 14/27/64 Gb/s 0.27-km/0.12-m/0.1-mm Interconnection in 28-nm CMOS 150 150
Author(s): Dawei Tang, Xiaoyue Xia, Leyang Huang, Zekun Li, Chun Yang, Zheng Yan, Si-Yuan Tang, Peigen Zhou, Rui Zhang, Liqun Lu, Wentao Zhu, Zhe Chen, Jixin Chen, Hao Gao, Wei Hong

Abstract:

This article presents a 28-nm CMOS sub-terahertz (sub-THz) amplitude shift-keying (ASK) transceiver achieving competitive wireless and wireline communication performance. The over-the-air (OTA) link demonstrates 14 Gb/s/0.27 km, 16Gb/s/1m, and 27 Gb/s/12 cm without equalization (EQ), while supporting 64 Gb/s on-Off keying (OOK) and 40 Gb/s pulse amplitude modulation (…

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 17
Year of Publication: 2026
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2026.3665552
Publisher: IEEE

View on IEEE Xplore

  • No Comments

A 7056-PPI Pixel Circuit With Low-Leakage Structure for Active-Matrix Monochrome Micro-LED Displays

A 7056-PPI Pixel Circuit With Low-Leakage Structure for Active-Matrix Monochrome Micro-LED Displays 150 150
Author(s): Chih-Lung Lin, Cheng-Han Ke, Yu-Chang Chiu, Yuan-Yu Lai, Yi-Chien Chen, Cheng-Rui Lu, Yu-Hsiang Fu, Chih-Chuan Huang

Abstract:

This work presents a 5T2C pixel circuit for active-matrix (AM) micro-displays in near-eye display applications. The circuit supports monochrome micro light-emitting diode (micro-LED) displays with ultrahigh resolution of 7056 pixels per inch (PPI). The circuit is designed and fabricated based on medium-voltage (MV) devices from the 55-nm high-voltage (HV) CMOS …

Published in: IEEE Solid-State Circuits Letters
Page(s): 89 – 92
Year of Publication: 2026
Electronic ISSN: 2573-9603
DOI: 10.1109/LSSC.2026.3667520
Publisher: IEEE

View on IEEE Xplore

  • No Comments

A Modular Ring-Oscillator Array Chip for Accurate Stress Testing of CMOS Aging Mechanisms

A Modular Ring-Oscillator Array Chip for Accurate Stress Testing of CMOS Aging Mechanisms 150 150
Author(s): Javier Diaz-Fortuny, Erik Bury, Robin Degraeve, Ben Kaczer

Abstract:

Ring-oscillator (RO) circuits have historically been used to characterize the performance of CMOS technologies, as they can easily expose both process variability and aging through a straightforward circuit structure. ROs are widely employed to study degradation mechanisms such as bias temperature instability (BTI) and hot carrier degradation (HCD), which progressively …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 13
Year of Publication: 2026
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2026.3653472
Publisher: IEEE

View on IEEE Xplore

Search this website