Semiconductor device measurement

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A 70-GHz Bandwidth Amplifier With Integrated Differential Bridged T-coil Peaking and Uniform Group Delay

A 70-GHz Bandwidth Amplifier With Integrated Differential Bridged T-coil Peaking and Uniform Group Delay 150 150
Author(s): Giovanni Scarlato, John R. Long

Abstract:

A two-stage amplifier in 22-nm FD-SOI CMOS integrates a fully-differential bridged T-coil for the first time. Circuit performance is benchmarked against an identical amplifier topology designed with single-ended T-coils (pseudo-differential) and an unpeaked reference. It realizes 70-GHz bandwidth with $12~\pm ~2$ -ps group delay and >10-dB return loss across 90 GHz. Bandwidth …

Published in: IEEE Solid-State Circuits Letters
Page(s): 65 – 68
Year of Publication: 2026
Electronic ISSN: 2573-9603
DOI: 10.1109/LSSC.2026.3661366
Publisher: IEEE

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A 10.2 V 8-Channel Neural Stimulator With Nearly Constant Efficiency Across 90% Current Range and a TDM ADC-Based One-Shot Charge Balancing With < 6 mV Residue

A 10.2 V 8-Channel Neural Stimulator With Nearly Constant Efficiency Across 90% Current Range and a TDM ADC-Based One-Shot Charge Balancing With < 6 mV Residue 150 150
Author(s): Alin Thomas Tharakan, Cong Huang, Yiheng Fu, Horacio Londoño Ramírez, Stéphanie P. Lacour, Mahsa Shoaran

Abstract:

This letter presents an 8-channel current-mode stimulator achieving a ±10.2 V voltage compliance in a standard CMOS process, supporting up to 4.5 mA stimulation current per channel. The proposed dynamic charge pump (DCP), which adaptively sizes its switches based on the stimulation current, helps achieve ~15% higher power efficiency at low currents compared …

Published in: IEEE Solid-State Circuits Letters
Page(s): 49 – 52
Year of Publication: 2026
Electronic ISSN: 2573-9603
DOI: 10.1109/LSSC.2026.3653014
Publisher: IEEE

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A 0.015-mm2 0.5-V Synthesizable Hybrid PLL With Multi-Phase Linear Proportional-Gain Paths

A 0.015-mm2 0.5-V Synthesizable Hybrid PLL With Multi-Phase Linear Proportional-Gain Paths 150 150
Author(s): Qibang Sun, Liqun Feng, Woogeun Rhee, Hanjun Jiang

Abstract:

This brief presents a 0.015-mm2 0.5-V synthesizable hybrid phase locked loop (PLL). All blocks including an analog proportional-gain path can be logically or physically synthesized with digital cells and hardware languages. To mitigate the mismatch and common-mode fluctuation problems of a voltage-mode phase detector, multi-phase proportional-gain paths are designed for …

Published in: IEEE Solid-State Circuits Letters
Page(s): 1 – 1
Year of Publication: 2025
Electronic ISSN: 2573-9603
DOI: 10.1109/LSSC.2025.3649215
Publisher: IEEE

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A Benchmark of Cryo-CMOS Dynamic Comparators in a 40 nm Bulk CMOS Technology

A Benchmark of Cryo-CMOS Dynamic Comparators in a 40 nm Bulk CMOS Technology 150 150
Author(s): Bram Veraverbeke, Filip Tavernier

Abstract:

All cryo-CMOS quantum-classical control interfaces require an analog-to-digital converter (ADC) bridging the analog qubits and the digital control logic. Dynamic comparators play a crucial role in the precision, speed, and power consumption of these ADCs. Yet, their performance is severely impacted by the cryogenic environment. Therefore, this letter benchmarks, for …

Published in: IEEE Solid-State Circuits Letters
Page(s): 317 – 320
Year of Publication: 2025
Electronic ISSN: 2573-9603
DOI: 10.1109/LSSC.2025.3618161
Publisher: IEEE

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A 40.68-MHz, 200-ns-Settling Active Rectifier for mm-Sized Implants

A 40.68-MHz, 200-ns-Settling Active Rectifier for mm-Sized Implants 150 150
Author(s): Ronald Wijermars, Yi-Han Ou-Yang, Sijun Du, Dante G. Muratore

Abstract:

This letter describes a fast-settling active rectifier for a 40.68 MHz wireless power transfer receiver for implantable applications. Fast-settling and low power are achieved through a novel direct voltage-domain compensation technique. The rectifier maintains high efficiency during load and link variations required for downlink communication. The system was fabricated in 40nm …

Published in: IEEE Solid-State Circuits Letters
Page(s): 305 – 308
Year of Publication: 2025
Electronic ISSN: 2573-9603
DOI: 10.1109/LSSC.2025.3611484
Publisher: IEEE

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Design and Verification of Low Parasitic MOS Capacitors With Series Connected Tri-Well Junctions

Design and Verification of Low Parasitic MOS Capacitors With Series Connected Tri-Well Junctions 150 150
Author(s): Zhendong Li, Yongjuan Shi, Yifan Jiang, Chen Hu, Junting Chen, Mengyuan Hua, Xun Liu, Junmin Jiang

Abstract:

This letter presents a tri-well implementation of MOS capacitors designed to tackle the challenge of high parasitic capacitance. By serially connecting the three parasitic well junction capacitors between the three wells (N-Well, deep P-Well, and deep N-Well) and substrate (PSUB), the parasitic capacitance can be significantly decreased. A higher bias …

Published in: IEEE Solid-State Circuits Letters
Page(s): 277 – 280
Year of Publication: 2025
Electronic ISSN: 2573-9603
DOI: 10.1109/LSSC.2025.3608282
Publisher: IEEE

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A 302.5-GHz 30.9-dB-Gain THz Amplifier in 65-nm CMOS

A 302.5-GHz 30.9-dB-Gain THz Amplifier in 65-nm CMOS 150 150
Author(s): Yu-Kai Chen, Yi-Fan Tseng, Wei-Zhe Su, Chun-Hsing Li

Abstract:

A 302.5-GHz high-gain CMOS THz amplifier is proposed in this work. An electromagnetic (EM) modeling approach, verified by transistor measurements, is employed to optimize transistor layout, effectively reducing gate resistance and drain-to-gate capacitance. This significantly enhances the transistor’s maximum oscillation frequency $f_{mathrm {max }}$ from 239.7 to 367.5 GHz. Furthermore, a $…

Published in: IEEE Solid-State Circuits Letters
Page(s): 165 – 168
Year of Publication: 2025
Electronic ISSN: 2573-9603
DOI: 10.1109/LSSC.2025.3574413
Publisher: IEEE

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Two 7–13-GHz GaAs-SiGe Four–Channel Beamforming Chiplets With/Without Metallic Interlayer Shields

Two 7–13-GHz GaAs-SiGe Four–Channel Beamforming Chiplets With/Without Metallic Interlayer Shields 150 150
Author(s): Nengxu Zhu, Yiting Zhang, Genyin Ma, Fanyi Meng

Abstract:

This letter presents two 7–13-GHz GaAs-SiGe four-channel beamforming chiplets to minimize the chip area. The chips integrate GaAs-based power amplifiers (PAs) and low-noise amplifiers (LNAs) with silicon-based phase and amplitude control modules using gold bumps. To mitigate coupling between the metal patterns of the heterogeneous chips and avoid interference with …

Published in: IEEE Solid-State Circuits Letters
Page(s): 161 – 164
Year of Publication: 2025
Electronic ISSN: 2573-9603
DOI: 10.1109/LSSC.2025.3573757
Publisher: IEEE

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