Semiconductor device measurement

3-D In-Sensor Computing for Real-Time DVS Data Compression: 65-nm Hardware-Algorithm Co-Design

3-D In-Sensor Computing for Real-Time DVS Data Compression: 65-nm Hardware-Algorithm Co-Design 150 150

Abstract:

Traditional IO links are insufficient to transport high volume of image sensor data, under stringent power and latency constraints. To address this, we demonstrate a low latency, low power in-sensor computing architecture to compress the data from a 3D-stacked dynamic vision sensor (DVS). In this design, we adopt a 4-bit …

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