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A 200 GHz Wideband and Low-Power Direct-Downconversion Receiver Element in 16 nm FinFET Technology

A 200 GHz Wideband and Low-Power Direct-Downconversion Receiver Element in 16 nm FinFET Technology 150 150
Author(s): Ethan Chou, Hesham Beshary, Nima Baniasadi, Ali M. Niknejad

Abstract:

This letter presents a wideband and low-power direct-downconversion 200 GHz receiver element for digital-beamforming applications implemented in 16 nm FinFET technology. Wideband and low integrated receiver noise figure of 9.8 dB across a 21 GHz baseband bandwidth is realized with a differential low-noise amplifier leveraging an active input balun stage, while wideband gain of 29 …

Published in: IEEE Solid-State Circuits Letters
Page(s): 349 – 352
Year of Publication: 2025
Electronic ISSN: 2573-9603
DOI: 10.1109/LSSC.2025.3626442
Publisher: IEEE

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A 14-b Energy-Efficient BW/Power Scalable CTDSM With a Frequency-Controlled Current Source

A 14-b Energy-Efficient BW/Power Scalable CTDSM With a Frequency-Controlled Current Source 150 150
Author(s): Xinjie Wu, Xiaopeng Yu, Nick Nianxiong Tan, Zhong Tang

Abstract:

This work presents a 14-bit energy-efficient bandwidth (BW)/power scalable continuous-time delta–sigma modulator (CTDSM) for sensor interfaces in IoT applications. To ensure low noise for small input signals and achieve BW/power scalability, it is built around Gm-C integrators biased via a linear frequency-controlled current source (FCCS). The FCCS …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 10
Year of Publication: 2025
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2025.3621527
Publisher: IEEE

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A “No Gain” Direct-Conversion IQ RF-to-Bits Receiver Without Active Linear Amplification

A “No Gain” Direct-Conversion IQ RF-to-Bits Receiver Without Active Linear Amplification 150 150
Author(s): Jeroen Ponte, Roel Plompen, Emiel Zijlma, Eric A. M. Klumperink, Harijot Singh Bindra, Bram Nauta

Abstract:

This work describes a direct-conversion IQ receiver (RX) that does not utilize any active linear (power) amplification, covering its design considerations, prototype implementation, and measurement verification. Only RLC components, MOS transistor (MOST) switches, and comparators are used, leading to several unique design challenges. Key among these are the fact that …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 17
Year of Publication: 2025
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2025.3611114
Publisher: IEEE

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An Area and Power Efficient Source Driver IC With Multi-Line Sensing Real-Time Pixel Compensation for OLED Displays

An Area and Power Efficient Source Driver IC With Multi-Line Sensing Real-Time Pixel Compensation for OLED Displays 150 150
Author(s): Jaewoong Ahn, Seung Hun Choi, Minseong Um, Jun Yeol An, Hyung-Min Lee

Abstract:

This article proposes a source driver integrated circuit (SD-IC) with a pixel compensator designed to minimize both silicon area and power consumption for organic light-emitting diode (OLED) displays. The proposed SD-IC is capable of driving ultrahigh-definition (UHD) active-matrix OLED (AMOLED) panels with a one-horizontal-time (1-H time) of $7.2~\mu $ s while …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 12
Year of Publication: 2025
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2025.3614134
Publisher: IEEE

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A 28-Gb/mm2 4XX-Layer 1-Tb 3-b/Cell WF-Bonding 3D-nand Flash With 5.6-Gb/s/Pin IOs

A 28-Gb/mm2 4XX-Layer 1-Tb 3-b/Cell WF-Bonding 3D-nand Flash With 5.6-Gb/s/Pin IOs 150 150
Author(s): Sang-Soo Park, Jae-Doeg Lyu, Myungjun Kim, Jaeyun Lee, Youngsun Song, Chung-Ho Yu, Hirano Makoto, Yongseok Kwon, Jong-Hoon Park, Ho-Joon Kim, Daein Lee, Donghyun Seo, Philkyu Kang, Byungrok Go, Minseok Kim, Seoyoon Jeon, Jaehwan Ryu, Jungmin Seo, Hwan-Seok Ku, Youngmin Jo, Doo-Hyun Kim, Hyunjun Yoon, Wontae Kim, Inmo Kim, Sunghoon Kim, Jiho Cho, Moosung Kim, Jae-Woo Im, Jongmin Park, Youngdon Choi, Il-Han Park, Chiweon Yoon, Hyunsuk Kim, Jaehoon Jang, Seungjae Lee, Ki-Whan Song, Sung-Hoi Hur

Abstract:

The challenge of evolving to create a memory that is shrinking compared to the previous generation while satisfying the high performance and low power required for flash memory has been present in every generation, but the recent rapid change to artificial intelligence (AI) trends is very tough, as the level …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 9
Year of Publication: 2025
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2025.3613774
Publisher: IEEE

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A Scalable 1024-Channel Ultra-Low-Power Spike Sorting Chip With Event-Driven Detection and Spatial Clustering

A Scalable 1024-Channel Ultra-Low-Power Spike Sorting Chip With Event-Driven Detection and Spatial Clustering 150 150
Author(s): Arash Akhoundi, Pumiao Yan, Yawende Landbrug, Madeline Hays, Boris Murmann, E. J. Chichilnisky, Dante G. Muratore

Abstract:

This article presents a 1024-channel ultra-low-power spike sorting chip featuring event-driven spike detection and spatial clustering for large-scale neural recording. To address power and scalability constraints in brain–computer interfaces (BCIs), the design integrates a compressive analog-to-digital converter (ADC) with a two-stage spike detector that significantly reduces memory and processing …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 17
Year of Publication: 2025
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2025.3611139
Publisher: IEEE

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A 48-Gb/s Inductorless PAM-4 Optical Receiver With 1.28-pJ/bit Efficiency in 28-nm CMOS

A 48-Gb/s Inductorless PAM-4 Optical Receiver With 1.28-pJ/bit Efficiency in 28-nm CMOS 150 150
Author(s): Chongyun Zhang, Li Wang, Fuzhan Chen, Quan Pan, Xianbo Li, C. Patrick Yue

Abstract:

This work presents a 48-Gb/s four-level pulse amplitude modulation (PAM-4) optical receiver (ORX) with a linear analog front-end (AFE) and an integrated sampler. The AFE employs a transadmittance-stage transimpedance-stage (TAS-TIS) topology, replacing conventional CML-based variable gain amplifiers (VGAs) and post-amplifiers, avoiding continuous-time linear equalizers and passive inductors while preserving …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 13
Year of Publication: 2025
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2025.3607107
Publisher: IEEE

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CORDIC-Less Digital Polar Transmitter Architecture Based on Delta-Sigma Modulator

CORDIC-Less Digital Polar Transmitter Architecture Based on Delta-Sigma Modulator 150 150
Author(s): Yuncheng Zhang, Zezheng Liu, Duo Li, Minzhe Tang, Yi Zhang, Hóngyè Huáng, Dingxin Xu, Waleed Madany, Ashbir Aviat Fadila, Wenqian Wang, Yuang Xiong, Daxu Zhang, Garry Pranata Kusuma, Hiroyuki Sakai, Kazuaki Kunihiro, Atsushi Shirane, Kenichi Okada

Abstract:

Conventional digital polar transmitters (TXs) suffer from limited power efficiency and linearity due to the multi-bit nature of intermediate signals. This work proposes a digital polar TX architecture that avoids such drawbacks by reducing the bit count of TX signals. The proposed TX oversamples and quantizes multi-bit I/Q inputs …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 14
Year of Publication: 2025
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2025.3611233
Publisher: IEEE

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A Fully-Dynamic Capacitive Touch Sensor With Tri-level Energy Recycling and Compressive Sensing Technique

A Fully-Dynamic Capacitive Touch Sensor With Tri-level Energy Recycling and Compressive Sensing Technique 150 150
Author(s): Xiangdong Feng, Zhiyu Wang, Haoyang Li, Jiaqing Li, Wei-Chin Lin, Xin Hu, Zhong Tang, Yuyan Liu, Qinwen Fan, Yuxuan Luo, Bo Zhao

Abstract:

Capacitive touch screens have become the dominant user interface over the past decade. Achieving high framerates with low power consumption remains a critical design goal for touch systems. The conventional charge-recycling technique reduces driving power by 64%, but it relies on off-chip capacitors. To address this issue, we propose a tri-level …

Published in: IEEE Solid-State Circuits Letters
Page(s): 1 – 1
Year of Publication: 2025
Electronic ISSN: 2573-9603
DOI: 10.1109/LSSC.2025.3612093
Publisher: IEEE

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