Joining processes

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A Line-Connected Q-Sampler-Based Multi-Phase Hybrid Converter

A Line-Connected Q-Sampler-Based Multi-Phase Hybrid Converter 150 150
Author(s): Jiacheng Yang, Zihao Tang, Rui P. Martins, Zheng Wang, Lin Cheng, Mo Huang

Abstract:

This article presents a line-connected Q-sampler-based (LQS) multi-phase (MP) hybrid converter for direct conversion from high-rail to point-of-load (PoL). The proposed topology uses an input-parallel switched-capacitor (SC) structure to support “ALL-ON” operation during load transients, while a “multi-source- ${V}_{\mathrm { X}}$ ” control decouples voltage conversion ratio (VCR) from phase count, …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 12
Year of Publication: 2026
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2026.3718696
Publisher: IEEE

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THz-TSI: A Terahertz Wireless Through-Silicon Interconnect Module for Advanced 3-D Integration Applications

THz-TSI: A Terahertz Wireless Through-Silicon Interconnect Module for Advanced 3-D Integration Applications 150 150
Author(s): Chen Jiang, Xiaodi Feng, Xiaohan Shen, Chixiao Chen, Qi Liu, Ming Liu, Ningsheng Xu

Abstract:

By vertically stacking device layers, advanced 3-D integration overcomes traditional planar scaling limits, delivering the bandwidth and power efficiency essential for modern artificial intelligence (AI) and high-performance computing (HPC) integrated systems. However, continued scaling of conventional through-silicon vias (TSVs) and microbumps presents critical bottlenecks due to inherent thermo-mechanical stress, complex …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 13
Year of Publication: 2026
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2026.3720291
Publisher: IEEE

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A 58.9–73.7-GHz Quadrature Dual-Core Class-F₃,₅ Oscillator With Tail-Assisted Implicit Quintupling

A 58.9–73.7-GHz Quadrature Dual-Core Class-F₃,₅ Oscillator With Tail-Assisted Implicit Quintupling 150 150
Author(s): Yevhenii Mormul, Patchara Sawakewang, Sayan Kumar, Chawin Khongprasongsiri, Teerachot Siriburanon, Robert Bogdan Staszewski

Abstract:

We introduce a new class-F3,5 oscillator topology that enables quadrature operation by duplicating a conventional class-F3 oscillator core and electromagnetically coupling the two cores through a pair of additional coils feeding source terminals of the $g_{m}$ transistors. The coupling network enhances the fifth-harmonic component, enabling efficient extraction and quadrature …

Published in: IEEE Solid-State Circuits Letters
Page(s): 198 – 201
Year of Publication: 2026
Electronic ISSN: 2573-9603
DOI: 10.1109/LSSC.2026.3699799
Publisher: IEEE

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An 11.5-Gb/s/pin, 0.4-V Driver-Supply Transmitter With Switched-Coupling Charge-Pump-Based Crosstalk Cancellation for Ultra-Dense Capacitively Coupled Channels

An 11.5-Gb/s/pin, 0.4-V Driver-Supply Transmitter With Switched-Coupling Charge-Pump-Based Crosstalk Cancellation for Ultra-Dense Capacitively Coupled Channels 150 150
Author(s): Yoochang Kim, Seunghoon Yi, Seung Chae Jung, Hee-Cheol Joo, Young-Ha Hwang

Abstract:

This work presents an 11.5-Gb/s/pin transmitter (TX) for ultra-dense capacitively coupled channels that achieves near-complete eye-margin recovery while operating from a 0.4-V driver supply using a switched-coupling charge-pump-based crosstalk cancellation (SCCP-XTC) scheme. In the proposed scheme, one of four precharged capacitor banks in each XT cancellation (XTC) path …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 14
Year of Publication: 2026
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2026.3715082
Publisher: IEEE

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A Performance Comparison Between W-Band Sequential and Doherty Power Amplifiers for Power Back-Off Efficiency Improvement

A Performance Comparison Between W-Band Sequential and Doherty Power Amplifiers for Power Back-Off Efficiency Improvement 150 150
Author(s): Yahia Ibrahim, Ali M. Niknejad

Abstract:

This work presents a W-band sequential power amplifier (PA) featuring a compact and low-loss output combiner that enhances power back-off (PBO) efficiency by combining a main PA and an auxiliary PA through an isolated combining output network. The proposed architecture is analyzed and experimentally compared to the conventional Doherty PA (…

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 12
Year of Publication: 2026
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2026.3708783
Publisher: IEEE

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A 300-GHz 2-D Scalable 4 × 4 Phased-Array Receiver With Half-Wavelength Element Spacing in 65-nm CMOS

A 300-GHz 2-D Scalable 4 × 4 Phased-Array Receiver With Half-Wavelength Element Spacing in 65-nm CMOS 150 150
Author(s): Huanting Deng, Kaizhe Guo, Yihan Wang, Houyi Yan, Jiyao Wang, Mengru Yang, Jian Guo, Peng Gu, Xiaohu You, Dixian Zhao

Abstract:

This article presents a 300-GHz 2-D scalable $4\times 4$ phased-array receiver (RX) with half-wavelength element spacing in 65-nm CMOS. To achieve high scalability, a hybrid local oscillator (LO)–intermediate frequency (IF) beamforming scheme based on a coupled oscillator array is proposed, together with an area-efficient aperture-coupled antenna implemented on quartz. The …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 13
Year of Publication: 2026
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2026.3711687
Publisher: IEEE

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A 0.1514-pJ/bit 18-Gb/s/wire Run-Length-Tolerant Transition-Driven AC-Coupled Transceiver for Die-to-Die Interfaces

A 0.1514-pJ/bit 18-Gb/s/wire Run-Length-Tolerant Transition-Driven AC-Coupled Transceiver for Die-to-Die Interfaces 150 150
Author(s): Jun-Cheol Lee, Joo-Hyung Chae

Abstract:

This article presents a transition-driven AC-coupled transceiver (TRX) optimized for low-power and compact die-to-die (D2D) interfaces. To address the limitations of conventional PMOS- and transimpedance-amplifier (TIA)-based receivers (RXs), the proposed RX architecture employs a small 130-fF coupling capacitor to capture only transition information, eliminating the need for bulky …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 12
Year of Publication: 2026
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2026.3708634
Publisher: IEEE

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A Nesting-Connected Reconfigurable SC Converter With Fine-Grained Conversion Ratios and Increased Output Conduction Paths for On-Chip Surround Power Delivery

A Nesting-Connected Reconfigurable SC Converter With Fine-Grained Conversion Ratios and Increased Output Conduction Paths for On-Chip Surround Power Delivery 150 150
Author(s): Xuchu Mu, Yang Jiang, Xin Ming, Bo Zhang, Rui P. Martins, Pui-In Mak

Abstract:

This article presents a reconfigurable switched-capacitor (SC) DC–DC converter that achieves improved overall efficiency over a fine-grained conversion-ratio range, applicable to on-chip surround power delivery (SPD) in compact and lightweight devices. We propose a nesting-connected reconfigurable SC topology generation method, attaining fine-grained subdivision of reconfigurable voltage conversion ratios (VCRs) …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 13
Year of Publication: 2026
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2026.3702012
Publisher: IEEE

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A 138 Gb/s D-Band 2-D Scalable Transceiver Array With On-Chip Antennas Achieving Sub-1-pJ/b Efficiency in 28-nm Bulk CMOS

A 138 Gb/s D-Band 2-D Scalable Transceiver Array With On-Chip Antennas Achieving Sub-1-pJ/b Efficiency in 28-nm Bulk CMOS 150 150
Author(s): Hesham Beshary, Yikuan Chen, Ali M. Niknejad

Abstract:

This article presents a D-band 2-D scalable phased array that integrates a $2{\,}\times{\,} 2$ transceiving (TRX) radio frequency (RF) beamformer with on-chip antennas (OCAs) and a $\times 16$ local-oscillator (LO) multiplication chain. The 2-D array scalability is demonstrated by tiling $2{\,}\times{\,} 2$ chips into an array using a low-cost package to build a 16…

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 15
Year of Publication: 2026
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2026.3704818
Publisher: IEEE

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