impedance

A Bio-Impedance Readout IC With Phase-Locked Sampling for Real-Time Electrical Impedance Spectroscopy

A Bio-Impedance Readout IC With Phase-Locked Sampling for Real-Time Electrical Impedance Spectroscopy 150 150

Abstract:

This article presents an electrical bio-impedance (bioZ) spectroscopy integrated circuit (IC) that achieves both high-throughput and high-accuracy. The proposed phase-locked sampling (PLS) scheme, which employs a sampling phase-locked loop (SPLL) and a reference resistor ( $R_{\textit {REF}}$ ), enables fast and precise impedance demodulation. By extracting the impedance components through sampling …

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A 32-Channel 85.4 dB SNDR Time-Multiplexed Neural Recording Front-End Achieving Within-Conversion Artifact Recovery

A 32-Channel 85.4 dB SNDR Time-Multiplexed Neural Recording Front-End Achieving Within-Conversion Artifact Recovery 150 150

Abstract:

This article presents a 32-channel time-multiplexed highly digital neural recording front-end (RFE) that exhibits sub- $8.8~\mu $ s recovery latency from large stimulation artifacts while delivering high-resolution data at the Nyquist rate. The RFE is time-shared across 32 channels for low-frequency electrocorticography (ECoG) recording and across four channels for high-frequency action potentials (…

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A W-Band Active Bidirectional Phase Shifter With 2° RMS Phase Error Over 26.4% FBW Using Back-Gate Biasing in 28-nm FD-SOI CMOS

A W-Band Active Bidirectional Phase Shifter With 2° RMS Phase Error Over 26.4% FBW Using Back-Gate Biasing in 28-nm FD-SOI CMOS 150 150

Abstract:

This article presents a W-band active bidirectional vector-sum phase shifter (Bi-VSPS) using a bidirectional phase-inverting variable-gain amplifier (Bi-PIVGA) with back-gate biasing in 28-nm fully depleted silicon-on-insulator (FD-SOI) CMOS. The Bi-PIVGA employs a neutralization technique that cancels the gate-to-drain capacitances of both active and inactive transistors in each signal direction. By …

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A Third-Harmonic-Enhanced Triple-Push DCO Utilizing Source-Combining Technique

A Third-Harmonic-Enhanced Triple-Push DCO Utilizing Source-Combining Technique 150 150

Abstract:

This article presents a detailed investigation into optimizing the amplitude and phase of the transistor’s terminal voltages to generate a high 3rd-harmonic current in the millimeter-wave (mm-Wave) frequency. Based on the analysis, the digitally controlled source-combining triple-push (SCTP) oscillator is derived to significantly enhance the 3rd-harmonic current by introducing …

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A 60-GHz Class- F2,3 Standing-Wave Oscillator Employing Triple-Line Resonator Achieving −189-dBc/Hz FoM in 65-nm CMOS

A 60-GHz Class- F2,3 Standing-Wave Oscillator Employing Triple-Line Resonator Achieving −189-dBc/Hz FoM in 65-nm CMOS 150 150

Abstract:

Implementing oscillators with harmonic engineering beyond 60-GHz poses significant challenges due to the need for small inductors resonating beyond 120 GHz. To address this issue, this work presents a 60-GHz standing-wave oscillator (SWO) with both second- and third-harmonic boosting for phase noise reduction. A triple-line resonator is proposed to sustain both …

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Adaptive Linearity Enhancement of Low-Noise Amplifiers Using Doherty Active Load Modulation

Adaptive Linearity Enhancement of Low-Noise Amplifiers Using Doherty Active Load Modulation 150 150

Abstract:

This article introduces Doherty active load modulation into low-noise amplifier (LNA) designs to dynamically enhance linearity. Under nominal small-signal conditions, the proposed LNA operates like conventional counterparts, consuming no additional power. When strong in-band blockers are present, auxiliary paths are adaptively engaged to activate a high-linearity mode without incurring a …

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A 142–164-GHz Phased-Array AiP Module With High-Power-Density and High-Efficiency Transceiver in 65-nm CMOS for 6G UE

A 142–164-GHz Phased-Array AiP Module With High-Power-Density and High-Efficiency Transceiver in 65-nm CMOS for 6G UE 150 150

Abstract:

This work presents a D-band high-power-density four-element phased-array transceiver for 6G user equipment (UE). Conventional designs require large multi-stage LO generation circuits for D-band up/down conversion, making it difficult to achieve compact size and low-power consumption. To address this, we propose an integrated LO chain using an injection-locked tripling …

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A K/Ka-Band Transmit/Receive Front-End With Triple-Coupled Transformer Technique in 65-nm Bulk CMOS

A K/Ka-Band Transmit/Receive Front-End With Triple-Coupled Transformer Technique in 65-nm Bulk CMOS 150 150

Abstract:

This article presents a K/Ka-band transmit/receive (T/R) front-end for jointed sensing and communication (JSAC) applications. A reconfigurable matching network for both signal reception and transmission is realized using the proposed triple-coupled transformer (TCT) technique, achieving low power loss and a compact footprint. The T/R switch at …

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A 2–18 GHz High-Efficiency CMOS Nonuniform Distributed Power Amplifier With a Novel Reconfigurable Inductive Termination

A 2–18 GHz High-Efficiency CMOS Nonuniform Distributed Power Amplifier With a Novel Reconfigurable Inductive Termination 150 150

Abstract:

This article presents a 2–18 GHz high-efficiency CMOS nonuniform distributed power amplifier (NDPA) with a novel reconfigurable inductive termination technique for ultra-broadband efficiency enhancement. First, the inherent drawback of the degrading efficiency with growing frequency in a conventional non-reconfigurable NDPA architecture with multi-octave bandwidth is studied. A simple and effective reconfigurable …

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