Energy efficiency

FSL-HDnn: A 40-nm Few-Shot On-Device Learning Accelerator With Integrated Feature Extraction and Hyperdimensional Computing

FSL-HDnn: A 40-nm Few-Shot On-Device Learning Accelerator With Integrated Feature Extraction and Hyperdimensional Computing 150 150

Abstract:

This article introduces FSL-HDnn, an energy-efficient accelerator that implements the end-to-end pipeline of feature extraction (FE) and on-device few-shot learning (FSL). The accelerator addresses fundamental challenges of on-device learning (ODL) for resource-constrained edge applications through two synergistic modules: a parameter-efficient feature extractor (FE) employing weight clustering and an FSL classifier …

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A 92.1-dB SNDR Easy-Driving Two-Step NS-SAR-Based Incremental ADC With Concurrent Gain-Error Plus Noise Suppression

A 92.1-dB SNDR Easy-Driving Two-Step NS-SAR-Based Incremental ADC With Concurrent Gain-Error Plus Noise Suppression 150 150

Abstract:

This article presents a two-step incremental analog-to-digital converter (ADC) that achieves high resolution and energy efficiency while substantially easing the input driving constraints and interstage gain variation. By employing a level-shifted sub-ranging architecture with an input-tracking (IT) feature, the design obviates direct input sampling, thereby significantly relaxing the demands on …

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A 3-nm FinFET 563-kbit 35.5-Mbit/mm2 Dual-Rail SRAM With 3.89-pJ/Access High Energy Efficient and 27.5-μW/Mbit One-Cycle Latency Low-Leakage Mode

A 3-nm FinFET 563-kbit 35.5-Mbit/mm2 Dual-Rail SRAM With 3.89-pJ/Access High Energy Efficient and 27.5-μW/Mbit One-Cycle Latency Low-Leakage Mode 150 150

Abstract:

This article presents a high-density (HD) 6T SRAM macro designed in 3-nm FinFET technology with an extended dual-rail (XDR) architecture, addressing active energy and leakage for mobile applications. Two key innovations are introduced: the delayed-wordline in write operation (DEWL) technique and a one-cycle latency low-leakage access mode (1-CLM). The XDR …

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Modern Wireline Transceivers

Modern Wireline Transceivers 150 150

Abstract:

Over the past two decades, ever-increasing network bandwidth (BW) demands in data centers and high-performance computing systems have fueled exponential growth in per-lane serial link data rates. To keep up with this demand and enable faster communication over BW-limited electrical channels, wireline transceiver architectures and circuit topologies have rapidly evolved …

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A 3 nm FinFET 125 TOPS/W-29 TFLOPS/W, 90 TOPS/mm2-17 TFLOPS/mm2 SRAM-Based INT8, and FP16 Digital-CIM Compiler With Support for Multi-Weight Update/Cycle

A 3 nm FinFET 125 TOPS/W-29 TFLOPS/W, 90 TOPS/mm2-17 TFLOPS/mm2 SRAM-Based INT8, and FP16 Digital-CIM Compiler With Support for Multi-Weight Update/Cycle 150 150

Abstract:

This article presents an static random-access memory (SRAM)-based digital compute-in-memory (CIM) compiler implemented with 3 nm high- $\kappa $ metal gate (HKMG) FinFET technology, supporting flexible INT8 and FP16 formats for weight and activation multiply-accumulate (MAC) operations, offering configuration flexibility, high accuracy, and improved area and power efficiency. The FP16 digital …

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STAR-SRAM: 16-bit Floating-Point SRAM-Based Digital Computing-in-Memory Macro in a 28 nm

STAR-SRAM: 16-bit Floating-Point SRAM-Based Digital Computing-in-Memory Macro in a 28 nm 150 150

Abstract:

A digital computing-in-memory (DCIM) macro emerges as a promising building block in a deep neural network (DNN) accelerator. To better support DNN workloads, circuit designers aim to improve three main metrics for macros: energy efficiency, compute density, and weight density. Improvements in those metrics directly translate into reduced energy consumption, …

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TexCAC: A Direct-Textile-Attachable Microcontroller Integrating 2-MB MRAM for the Command and Control of Advanced Smart Textiles

TexCAC: A Direct-Textile-Attachable Microcontroller Integrating 2-MB MRAM for the Command and Control of Advanced Smart Textiles 150 150

Abstract:

Advanced smart textiles (ASTs) are textile-integrated electronic systems that enable many applications, including healthcare, robotics, and IoT. ASTs contain a variety of electronic components to enable whole system functionality (batteries, sensors, SoCs, etc.), which all require orchestration from a central command-and-control (CAC) module. The primary functions of the CAC module …

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A 28-nm PVT Inner-Tracking Time-Domain Compute-In-Memory Macro for Edge-AI Devices

A 28-nm PVT Inner-Tracking Time-Domain Compute-In-Memory Macro for Edge-AI Devices 150 150

Abstract:

This article presents an energy-efficient and process-, voltage-, and temperature (PVT)-robust time-domain (TD) compute-in-memory (CIM) macro for edge artificial intelligence (AI) devices. It features: 1) a PVT inner-tracking (PIT) technique that aligns the PVT responses of TD computation and TD quantization, delivering inherent robustness without incurring extra power or circuit …

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A BEV Perception Transformer Accelerator With Saliency-Driven Image/Point Cloud Fusion and Phase-Linked Dataflow in 28 nm CMOS

A BEV Perception Transformer Accelerator With Saliency-Driven Image/Point Cloud Fusion and Phase-Linked Dataflow in 28 nm CMOS 150 150

Abstract:

Deploying advanced Transformer-based models for real-time, high-accuracy multimodal bird’s-eye-view (BEV) perception in autonomous driving imposes substantial hardware demands. To address this, we propose a low-cost, low-power image/point-cloud fusion Transformer accelerator that supports two modes: high-performance driving and ultra-low-power sentry operation. We first propose a cross-modal saliency evaluation mechanism …

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