DRAM chips

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A3D-MoE: Acceleration of Large Language Models with Mixture of Experts via 3D Heterogeneous Integration

A3D-MoE: Acceleration of Large Language Models with Mixture of Experts via 3D Heterogeneous Integration 150 150
Author(s): Wei-Hsing Huang, Janak Sharda, Cheng-Jhih Shih, Yuyao Kong, Faaiq Waqar, Pin-Jun Chen, Yingyan Lin, Shimeng Yu

Abstract:

Conventional large language models (LLMs) have large parameter sets, making inference costly and energy-intensive; Mixture-of-Experts (MoE) mitigates this by activating fewer weights per token, but fine-grained MoE LLMs still face runtime workload variability, inefficient conventional scheduling, and high HBM loading energy/bandwidth demands. A3D-MoE addresses these with 3D heterogeneous …

Published in: IEEE Journal on Exploratory Solid-State Computational Devices and Circuits
Page(s): 1 – 1
Year of Publication: 2026
Electronic ISSN: 2329-9231
DOI: 10.1109/JXCDC.2026.3713957
Publisher: IEEE

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Open DRAM Model—Part II: Enabling Processing-in-Memory in 3-D DRAM

Open DRAM Model—Part II: Enabling Processing-in-Memory in 3-D DRAM 150 150
Author(s): Kiseok Lee, Seongkwang Lim, Suman Datta, Shimeng Yu

Abstract:

Processing-in-memory (PIM) by implementing Boolean logic functions in dynamic random access memory (DRAM) has been proposed to alleviate the memory wall problem in data-intensive computing. However, quantitatively evaluating DRAM-based logic operations across different DRAM architectures remains challenging due to the lack of publicly available DRAM cell and peripheral transistor models …

Published in: IEEE Journal on Exploratory Solid-State Computational Devices and Circuits
Page(s): 144 – 152
Year of Publication: 2026
Electronic ISSN: 2329-9231
DOI: 10.1109/JXCDC.2026.3704508
Publisher: IEEE

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Open DRAM Model—Part I: Cross-Layer Device, Array, and Circuit Analysis With BL-to-BL Coupling Mitigation for 4F2 VCT DRAM

Open DRAM Model—Part I: Cross-Layer Device, Array, and Circuit Analysis With BL-to-BL Coupling Mitigation for 4F2 VCT DRAM 150 150
Author(s): Kiseok Lee, Seongkwang Lim, Suman Datta, Shimeng Yu

Abstract:

Dynamic random access memory (DRAM) scaling toward 4F2 vertical channel transistors (VCTs) fundamentally reshapes device, array, and circuit-level design tradeoffs. However, the lack of an open-source DRAM device model that is calibrated with recent industry trends prohibits broader innovations in the research community. In this work, we present an “Open …

Published in: IEEE Journal on Exploratory Solid-State Computational Devices and Circuits
Page(s): 135 – 143
Year of Publication: 2026
Electronic ISSN: 2329-9231
DOI: 10.1109/JXCDC.2026.3704358
Publisher: IEEE

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