compute-in-memory (CIM)

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A 28-nm PVT Inner-Tracking Time-Domain Compute-In-Memory Macro for Edge-AI Devices

A 28-nm PVT Inner-Tracking Time-Domain Compute-In-Memory Macro for Edge-AI Devices 150 150
Author(s): Yuanzhe Zhao, Yuheng Wang, Heng Xie, Zijian Wang, Rui P. Martins, Chi-Hang Chan, Minglei Zhang

Abstract:

This article presents an energy-efficient and process-, voltage-, and temperature (PVT)-robust time-domain (TD) compute-in-memory (CIM) macro for edge artificial intelligence (AI) devices. It features: 1) a PVT inner-tracking (PIT) technique that aligns the PVT responses of TD computation and TD quantization, delivering inherent robustness without incurring extra power or circuit …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 13
Year of Publication: 2026
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2026.3691189
Publisher: IEEE

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Denim: Heterogeneous Compute-in-Memory Accelerator Exploiting Denoising–Similarity for Diffusion Models

Denim: Heterogeneous Compute-in-Memory Accelerator Exploiting Denoising–Similarity for Diffusion Models 150 150
Author(s): Ruiqi Guo, Lei Wang, Xiaofeng Chen, Keyi Jiang, Zhiheng Yue, Huiming Han, Yang Wang, Fengbin Tu, Shaojun Wei, Yang Hu, Shouyi Yin

Abstract:

Diffusion models have recently revolutionized the field of image synthesis due to their ability to generate photorealistic images. However, one of the main drawbacks of diffusion models is that the image generation process is expensive. Large image-to-image networks have to be applied multiple times in order to iteratively optimize the …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 15
Year of Publication: 2026
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2026.3684745
Publisher: IEEE

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PERCEL: A Rewritable NVM CIM Incorporating a CTT-Based Per-Cell DAC

PERCEL: A Rewritable NVM CIM Incorporating a CTT-Based Per-Cell DAC 150 150
Author(s): Samyak Chakrabarty, Vinod Jacob, Mohammadreza Zeinali, Georgios Karfakis, Siyun Qiao, Ziyi Guo, Puneet Gupta, Subramanian Iyer, Sudhakar Pamarti

Abstract:

Compute-in-memory (CiM) accelerators perform matrix vector multiplications (MVMs) directly inside memory arrays, reducing data movement and improving both energy efficiency and throughput for artificial intelligence (AI) workloads. To reduce the number of conversions, recent designs use multibit compute cells. Nevertheless, practical multibit CiM still faces a tension among accuracy, efficiency, …

Published in: IEEE Journal on Exploratory Solid-State Computational Devices and Circuits
Page(s): 70 – 77
Year of Publication: 2026
Electronic ISSN: 2329-9231
DOI: 10.1109/JXCDC.2026.3680497
Publisher: IEEE

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A Folded-Differential Switched-Capacitor SRAM CIM Macro With Scalable MAC Sizes for TinyML Inference

A Folded-Differential Switched-Capacitor SRAM CIM Macro With Scalable MAC Sizes for TinyML Inference 150 150
Author(s): Zhonghao Chen, Ling-An Cheong, Tianyi Yu, Yiming Chen, Guodong Yin, Teng Yi, Yongpan Liu, Huazhong Yang, Xueqing Li

Abstract:

This letter presents a switched-capacitor SRAM compute-in-memory macro optimized for TinyML inference. Key features include: 1) an area-efficient folded-differential multiply-and-accumulate (FD-MAC) scheme to double the signal margin; 2) a closed-loop floating-inverter amplifier (FIA)-based charge accumulation technique for signal-to-noise ratio enhancement and multiply-and-accumulate (MAC) voltage integration; and 3) a sparsity-aware multistep MAC method …

Published in: IEEE Solid-State Circuits Letters
Page(s): 73 – 76
Year of Publication: 2026
Electronic ISSN: 2573-9603
DOI: 10.1109/LSSC.2026.3662477
Publisher: IEEE

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An Approximate Digital CIM Macro With Low-Power Multiply-Add Units and Dynamic Sparse-Adaptive Configuring for Edge AI Inference

An Approximate Digital CIM Macro With Low-Power Multiply-Add Units and Dynamic Sparse-Adaptive Configuring for Edge AI Inference 150 150
Author(s): Xiaofeng Li, Yi Zhan, Purui Zhu, Rui Zhou, Jiayin Song, Heng You, Yumei Zhou, Shushan Qiao

Abstract:

This letter presents an approximate digital compute-in-memory (CIM) macro for low-power edge AI inference. It introduces three hierarchical innovations: 1) novel fused approximate multiply-add units (FAMUs) that reduces power and area consumption; 2) a bit-critical weight allocation architecture that optimally balances accuracy and hardware cost; and 3) a dynamic sparsity-adaptive configuration method to …

Published in: IEEE Solid-State Circuits Letters
Page(s): 45 – 48
Year of Publication: 2026
Electronic ISSN: 2573-9603
DOI: 10.1109/LSSC.2026.3652570
Publisher: IEEE

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A 28-nm FeFET Compute-in-Memory Macro With 64×64 Array Size and On-Chip 4-Bit Flash ADC

A 28-nm FeFET Compute-in-Memory Macro With 64×64 Array Size and On-Chip 4-Bit Flash ADC 150 150
Author(s): Vaidehi Garg, Jianwei Jia, Omkar Phadke, Shimeng Yu

Abstract:

Compute-in-memory (CIM) using emerging nonvolatile memory devices is a promising candidate for energy-efficient deep neural network (DNN) inference at the edge. Ferroelectric field-effect transistors (FeFETs) have recently gained attention as nonvolatile, CMOS-compatible devices with a higher on/off ratio and lower read and write energy compared to resistive random-access memory (…

Published in: IEEE Solid-State Circuits Letters
Page(s): 13 – 16
Year of Publication: 2026
Electronic ISSN: 2573-9603
DOI: 10.1109/LSSC.2025.3640522
Publisher: IEEE

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DPe-CIM: A 4T-1C Dual-Port eDRAM-Based Compute-in-Memory for Simultaneous Computing and Refresh With Adaptive Refresh and Data Conversion Reduction Scheme

DPe-CIM: A 4T-1C Dual-Port eDRAM-Based Compute-in-Memory for Simultaneous Computing and Refresh With Adaptive Refresh and Data Conversion Reduction Scheme 150 150
Author(s): Do Han Kim, Minyoung Jo, Gi Seok Kim, Dong Gyun Ha, Ung Bin Oh, Donghan Ko, Jiwoo Lee, Mingu Kang, Seong-Ook Jung

Abstract:

This article presents DPe-CIM, a 4T-1C dual-port embedded dynamic random access memory (eDRAM)-based compute-in-memory (CIM) macro with adaptive refresh and data conversion reduction. DPe-CIM proposes four key features that improve area and energy efficiency: 1) dual-port eDRAM cell (DPC) separates the multiply-and-accumulate (MAC) and refresh ports, enabling simultaneous MAC …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 13
Year of Publication: 2025
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2025.3623117
Publisher: IEEE

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1.58-b FeFET-Based Ternary Neural Networks: Achieving Robust Compute-In-Memory With Weight-Input Transformations

1.58-b FeFET-Based Ternary Neural Networks: Achieving Robust Compute-In-Memory With Weight-Input Transformations 150 150
Author(s): Imtiaz Ahmed, Akul Malhotra, Revanth Koduru, Sumeet Kumar Gupta

Abstract:

Ternary weight neural networks (TWNs), with weights quantized to three states (−1, 0, and 1), have emerged as promising solutions for resource-constrained edge artificial intelligence (AI) platforms due to their high energy efficiency with acceptable inference accuracy. Further energy savings can be achieved with TWN accelerators utilizing techniques such as compute-in-memory (CiM) and …

Published in: IEEE Journal on Exploratory Solid-State Computational Devices and Circuits
Page(s): 157 – 165
Year of Publication: 2025
Electronic ISSN: 2329-9231
DOI: 10.1109/JXCDC.2025.3621160
Publisher: IEEE

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Understanding Reliability Trade-Offs in 1T-nC and 2T-nC FeRAM Designs

Understanding Reliability Trade-Offs in 1T-nC and 2T-nC FeRAM Designs 150 150
Author(s): Sadik Yasir Tauki, Rudra Biswas, Rakesh Acharya, Jiahui Duan, Rajiv Joshi, Kai Ni, Vijaykrishnan Narayanan

Abstract:

Ferroelectric random access memory (FeRAM) is a promising candidate for energy-efficient nonvolatile memory, particularly for logic-in-memory and compute-in-memory (CIM) applications. Among the available cell architectures, One-Transistor–n-Capacitor (1T-nC) and two-transistor–n-capacitor (2T-nC) FeRAMs each offer distinct trade-offs in density, scalability, and reliability. In this work, we present a comparative study …

Published in: IEEE Journal on Exploratory Solid-State Computational Devices and Circuits
Page(s): 148 – 156
Year of Publication: 2025
Electronic ISSN: 2329-9231
DOI: 10.1109/JXCDC.2025.3619908
Publisher: IEEE

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