Circuits

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A Modular Ring-Oscillator Array Chip for Accurate Stress Testing of CMOS Aging Mechanisms

A Modular Ring-Oscillator Array Chip for Accurate Stress Testing of CMOS Aging Mechanisms 150 150
Author(s): Javier Diaz-Fortuny, Erik Bury, Robin Degraeve, Ben Kaczer

Abstract:

Ring-oscillator (RO) circuits have historically been used to characterize the performance of CMOS technologies, as they can easily expose both process variability and aging through a straightforward circuit structure. ROs are widely employed to study degradation mechanisms such as bias temperature instability (BTI) and hot carrier degradation (HCD), which progressively …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 13
Year of Publication: 2026
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2026.3653472
Publisher: IEEE

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A 77-fJ/bit 8-Gbps Adaptive-Voltage-Compatible Self-Timed Die-to-Die Link for 2.5-D and 3-D Interconnect in 3 nm

A 77-fJ/bit 8-Gbps Adaptive-Voltage-Compatible Self-Timed Die-to-Die Link for 2.5-D and 3-D Interconnect in 3 nm 150 150
Author(s): Brian Zimmer, Stephen G. Tell, C. Thomas Gray

Abstract:

This work presents a self-timed die-to-die link that serializes four data bits per pin for 2.5-D, or 3-D interconnects using a standard adaptive digital clock and voltage supply. The link achieves 8 Gbps of per-pin bandwidth with a latency of one cycle, energy efficiency of 77 fJ/b, and bandwidth density of 44…

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 10
Year of Publication: 2026
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2026.3658215
Publisher: IEEE

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A Standalone-in-Memory Voltage Crossover-Based Assist Switching Circuit for Reliable and Efficient Process Tracking Memory Vmin Improvement in Intel 18A-RibbonFET Technology

A Standalone-in-Memory Voltage Crossover-Based Assist Switching Circuit for Reliable and Efficient Process Tracking Memory Vmin Improvement in Intel 18A-RibbonFET Technology 150 150
Author(s): Saroj Satapathy, Amlan Ghosh, John Riley, Jalal Quadri, Jaydeep Kulkarni, Feroze Merchant

Abstract:

Advanced CMOS memory requires voltage biasing assist techniques to achieve low operating voltages (Vmin), which must be deactivated at higher voltages for high electric field reliability. Centralized power management unit (PMU) control signals face timing synchronization and process tracking challenges when distributed across cores to activate assist circuits in various …

Published in: IEEE Solid-State Circuits Letters
Page(s): 37 – 40
Year of Publication: 2026
Electronic ISSN: 2573-9603
DOI: 10.1109/LSSC.2026.3652110
Publisher: IEEE

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Coupled Simulation Methodology for In-Memory Computing Systems

Coupled Simulation Methodology for In-Memory Computing Systems 150 150
Author(s): Daniel Schön, Christian Owusu-Afriyie, Quang Huy Nguyen, Rainer Leupers, Stephan Menzel, Melvin Galicia

Abstract:

Simulations for the development and optimization of future in-memory computing (IMC) systems often face the problem that the modeling of the large system is desired, but at the same time, the effects at the device level should also be taken into account. Such effects could be due to the material …

Published in: IEEE Journal on Exploratory Solid-State Computational Devices and Circuits
Page(s): 18 – 26
Year of Publication: 2026
Electronic ISSN: 2329-9231
DOI: 10.1109/JXCDC.2026.3652426
Publisher: IEEE

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Integrated Spatiotemporal Multiscale- Multiphysics-Uncertainty Simulation for Controlling Variability in RRAM Devices

Integrated Spatiotemporal Multiscale- Multiphysics-Uncertainty Simulation for Controlling Variability in RRAM Devices 150 150
Author(s): Ziyan Liao, Zhiheng Huang, Min Xiao, Yuezhong Meng, Hui Yan, Yang Liu

Abstract:

Resistive random access memory (RRAM) is a leading candidate for next-generation nonvolatile memory and neuromorphic computing. However, its performance is limited by inherent switching variability and uncertainties in spatiotemporal multiscale materials and processes. This study integrates multiphysics and multiscale modeling with uncertainty quantification (UQ) to systematically address these limitations and …

Published in: IEEE Journal on Exploratory Solid-State Computational Devices and Circuits
Page(s): 1 – 8
Year of Publication: 2026
Electronic ISSN: 2329-9231
DOI: 10.1109/JXCDC.2025.3633067
Publisher: IEEE

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A 29-Gb/mm2 1-Tb 3-b/Cell 3-D Flash Memory With CMOS Direct Bonded Array (CBA) Technology

A 29-Gb/mm2 1-Tb 3-b/Cell 3-D Flash Memory With CMOS Direct Bonded Array (CBA) Technology 150 150
Author(s): Kosuke Yanagidaira, Mario Sako, Yasuhiro Hirashima, Yumi Higashi, Yutaka Shimizu, Takeshi Nakano, Yusuke Ochi, Hiroaki Yamada, Nobushi Matsuura, Akihiro Imamoto, Kazuaki Kawaguchi, Koji Tabata, Hiroaki Hoshino, Takeshi Hioka, Shigehito Saigusa, Hiroki Date, Masaki Unno, Jumpei Sato, You Kamata, Takahiro Shimizu, Akio Sugahara, Taira Shibuya, Atsushi Okuyama, Junji Yamada, Takatoshi Minamoto, Hardwell Chibvongodze, Naoki Ojima, Hiroshi Sugawara, Masahiro Kano, Jang-Woo Lee, Hiroyuki Mizukoshi, Ryuji Yamashita, Kensaku Abe, Naohito Morozumi, In-Soo Yoon, Takuya Ariki, Jong Hak Yuh, Khin Htoo, Yosuke Kato, Yoshihiro Oyama, Yen-Lung Jason Li, Yoshihisa Watanabe, Toshiyuki Kouchi, Koji Hosono

Abstract:

This article reports a 1-Tb 3-b/cell 3-D flash memory fabricated with CMOS direct bonded array (CBA) technology. Compaction of circuits and wires achieves the highest bit density in the world over 29 Gb/mm2 with 332-word line (WL) layers. The bit density is improved by 71% from a previous generation despite …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 237 – 249
Year of Publication: 2026
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2025.3617579
Publisher: IEEE

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Integrating Atomistic Insights With Circuit Simulations via Transformer-Driven Symbolic Regression

Integrating Atomistic Insights With Circuit Simulations via Transformer-Driven Symbolic Regression 150 150
Author(s): Md Rahatul Islam Udoy, Jack Hutchins, Shamiul Alam, Catherine Schuman, Ahmedullah Aziz

Abstract:

This article introduces a framework that establishes a cohesive link between the first principles-based simulations and circuit-level analyses using a machine learning-based compact modeling platform. Starting with atomistic simulations, the framework examines the microscopic details of material behavior, forming the foundation for later stages. The generated datasets, with molecular insights, …

Published in: IEEE Journal on Exploratory Solid-State Computational Devices and Circuits
Page(s): 179 – 187
Year of Publication: 2025
Electronic ISSN: 2329-9231
DOI: 10.1109/JXCDC.2025.3624662
Publisher: IEEE

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Quantum Field Theory Model for Spin-Based Devices Using 2-D van der Waals Materials

Quantum Field Theory Model for Spin-Based Devices Using 2-D van der Waals Materials 150 150
Author(s): Axel I. Saenz Rodriguez, Oksana Ostroverkhova, Pallavi Dhagat

Abstract:

We explore the effects of layered geometries of 2-D quantum spin systems as a method to tune and control material properties for spintronic devices. We analyze the dispersion relation of a 2-D quantum spin system with a shifted bilayer square lattice through the linear spin wave (LSW) approximation of quantum …

Published in: IEEE Journal on Exploratory Solid-State Computational Devices and Circuits
Page(s): 171 – 178
Year of Publication: 2025
Electronic ISSN: 2329-9231
DOI: 10.1109/JXCDC.2025.3624217
Publisher: IEEE

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1.58-b FeFET-Based Ternary Neural Networks: Achieving Robust Compute-In-Memory With Weight-Input Transformations

1.58-b FeFET-Based Ternary Neural Networks: Achieving Robust Compute-In-Memory With Weight-Input Transformations 150 150
Author(s): Imtiaz Ahmed, Akul Malhotra, Revanth Koduru, Sumeet Kumar Gupta

Abstract:

Ternary weight neural networks (TWNs), with weights quantized to three states (−1, 0, and 1), have emerged as promising solutions for resource-constrained edge artificial intelligence (AI) platforms due to their high energy efficiency with acceptable inference accuracy. Further energy savings can be achieved with TWN accelerators utilizing techniques such as compute-in-memory (CiM) and …

Published in: IEEE Journal on Exploratory Solid-State Computational Devices and Circuits
Page(s): 157 – 165
Year of Publication: 2025
Electronic ISSN: 2329-9231
DOI: 10.1109/JXCDC.2025.3621160
Publisher: IEEE

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