Area efficiency

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A 28-nm System-in-One-Macro Computing-in-Memory Chip Utilizing Leakage-Eliminated 2T1C and Capacitor-Over-Logic 1T1C eDRAM

A 28-nm System-in-One-Macro Computing-in-Memory Chip Utilizing Leakage-Eliminated 2T1C and Capacitor-Over-Logic 1T1C eDRAM 150 150
Author(s): Zhihang Qian, Zhaori Cong, Shengzhe Yan, Zeyu Guo, Zhuoyu Dai, Yifan He, Wenyu Sun, Chunmeng Dou, Feng Zhang, Di Geng, Jinshan Yue, Yongpan Liu, Qi Liu, Ming Liu

Abstract:

Computing-in-memory (CIM) is a promising paradigm for energy- and area-efficient implementation of the heavy general matrix multiplication (GEMM) operations, especially in the evolving deep learning algorithms. Though existing CIM macros have demonstrated remarkable energy/area efficiency, the corresponding metrics of the system-level CIM chips degrade due to the peripheral components, …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 15
Year of Publication: 2026
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2026.3684971
Publisher: IEEE

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A 475-nW Area-Efficient Programmable Analog Feature Extraction Filterbank for Audio Classification

A 475-nW Area-Efficient Programmable Analog Feature Extraction Filterbank for Audio Classification 150 150
Author(s): Patrice Abbie D. Legaspi, Shubham Yadav, Mark S. Oude Alink, Bram Nauta

Abstract:

Audio classification in edge devices has many applications and can be implemented at varying levels of complexity, typically consisting of a feature extractor followed by a classifier. Such devices are often always-on, constantly listening to their surroundings, and have a small form factor; therefore, they require low-power operation and high …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 15
Year of Publication: 2026
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2026.3655426
Publisher: IEEE

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A 29-Gb/mm2 1-Tb 3-b/Cell 3-D Flash Memory With CMOS Direct Bonded Array (CBA) Technology

A 29-Gb/mm2 1-Tb 3-b/Cell 3-D Flash Memory With CMOS Direct Bonded Array (CBA) Technology 150 150
Author(s): Kosuke Yanagidaira, Mario Sako, Yasuhiro Hirashima, Yumi Higashi, Yutaka Shimizu, Takeshi Nakano, Yusuke Ochi, Hiroaki Yamada, Nobushi Matsuura, Akihiro Imamoto, Kazuaki Kawaguchi, Koji Tabata, Hiroaki Hoshino, Takeshi Hioka, Shigehito Saigusa, Hiroki Date, Masaki Unno, Jumpei Sato, You Kamata, Takahiro Shimizu, Akio Sugahara, Taira Shibuya, Atsushi Okuyama, Junji Yamada, Takatoshi Minamoto, Hardwell Chibvongodze, Naoki Ojima, Hiroshi Sugawara, Masahiro Kano, Jang-Woo Lee, Hiroyuki Mizukoshi, Ryuji Yamashita, Kensaku Abe, Naohito Morozumi, In-Soo Yoon, Takuya Ariki, Jong Hak Yuh, Khin Htoo, Yosuke Kato, Yoshihiro Oyama, Yen-Lung Jason Li, Yoshihisa Watanabe, Toshiyuki Kouchi, Koji Hosono

Abstract:

This article reports a 1-Tb 3-b/cell 3-D flash memory fabricated with CMOS direct bonded array (CBA) technology. Compaction of circuits and wires achieves the highest bit density in the world over 29 Gb/mm2 with 332-word line (WL) layers. The bit density is improved by 71% from a previous generation despite …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 237 – 249
Year of Publication: 2026
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2025.3617579
Publisher: IEEE

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