Abstract: Today's complex systems for high-performance computing feature chiplets using advanced packaging technologies, commercially known as EMIB, CoWoS, InFO, FOCoS, and several others from multiple sources. These 2D/2.5D structures require ultra-dense I/O PHYs to deliver a large amount of data between dice over a distance of a few millimeters without adding much power and area […]

Abstract: The automotive industry is in the midst of a significant transformation. “CASE: Connected, Autonomous, Shared & Service, Electric” has been advocated as a trend. Along with this trend, automotive E/E (Electrical/Electronic) architecture will evolve from the current distributed architecture to a domain architecture and then to the future zone architecture in the autonomous driving […]