wireless

  • No Comments

THz-TSI: A Terahertz Wireless Through-Silicon Interconnect Module for Advanced 3-D Integration Applications

THz-TSI: A Terahertz Wireless Through-Silicon Interconnect Module for Advanced 3-D Integration Applications 150 150
Author(s): Chen Jiang, Xiaodi Feng, Xiaohan Shen, Chixiao Chen, Qi Liu, Ming Liu, Ningsheng Xu

Abstract:

By vertically stacking device layers, advanced 3-D integration overcomes traditional planar scaling limits, delivering the bandwidth and power efficiency essential for modern artificial intelligence (AI) and high-performance computing (HPC) integrated systems. However, continued scaling of conventional through-silicon vias (TSVs) and microbumps presents critical bottlenecks due to inherent thermo-mechanical stress, complex …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 13
Year of Publication: 2026
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2026.3720291
Publisher: IEEE

View on IEEE Xplore

  • No Comments

A 129–146-GHz Direct-Digital Modulation FinFET Transmitter With On-Chip Mismatch Calibrations for Beyond-5G Wireless Communications

A 129–146-GHz Direct-Digital Modulation FinFET Transmitter With On-Chip Mismatch Calibrations for Beyond-5G Wireless Communications 150 150
Author(s): Runzhou Chen, Hao-Yu Chien, Boxun Yan, Chao-Jen Tien, Mau-Chung Frank Chang

Abstract:

This article presents a D-band direct-digital modulation (DDM) transmitter with on-chip digital calibration blocks for future beyond-5G (B5G) wireless communication. The proposed DDM architecture mitigates the need for complex intermediate frequency (IF) generation and power-hungry digital-to-analog converters (DACs). The transmitter is implemented primarily in TSMC’s 16-nm p-FinFETs, …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1776 – 1790
Year of Publication: 2026
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2025.3644224
Publisher: IEEE

View on IEEE Xplore

  • No Comments

A Millimeter-Wave Direct Digital Transmitter Using Multiphase Subharmonic Switching PA

A Millimeter-Wave Direct Digital Transmitter Using Multiphase Subharmonic Switching PA 150 150
Author(s): Soumya Mahapatra, Mostafa Ayesh, Ce Yang, Mayank Palaria, Shiyu Su, Aoyang Zhang, Mike Shuo-Wei Chen

Abstract:

This article presents a direct digital transmitter (TX) employing a multiphase subharmonic switching (MP-SHS) power amplifier (PA) to achieve both high peak and power back-off (PBO) efficiency with wide signal bandwidth. A phase-shifted subharmonic (SH) local oscillator (LO) divider is proposed to suppress SH spurs with minimal implementation overhead by …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 16
Year of Publication: 2025
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2025.3605564
Publisher: IEEE

View on IEEE Xplore

Search this website