Transmitters

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A 7-level 18-wire-state Trio-signaling Transmitter for MIPI C-PHY 3.0 Interfaces

A 7-level 18-wire-state Trio-signaling Transmitter for MIPI C-PHY 3.0 Interfaces 150 150
Author(s): Junyeong Lee, Myeongjin Oh, Kiwoon Kim, Jung-Hoon Chun

Abstract:

This paper presents a MIPI C-PHY v3.0 TX, which adopts trio-signaling using three wires per lane. Each line supports 7-level signaling, enabling 18 wire states to map 32-bit data into 9 symbols, achieving 3.56 bits/symbol efficiency. Balanced coding maintains constant driver current, enhancing SSO noise immunity, and embedded clocking is achieved by …

Published in: IEEE Solid-State Circuits Letters
Page(s): 1 – 1
Year of Publication: 2026
Electronic ISSN: 2573-9603
DOI: 10.1109/LSSC.2026.3672642
Publisher: IEEE

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A 0.29 pJ/b 5.27 Tb/s/mm UCIe Advanced Package Link With 2.5-D CoWoS Interposer and a 0.52 pJ/b 0.448 Tb/s/mm UCIe Standard Package Link With Organic Substrate in 3 nm FinFET

A 0.29 pJ/b 5.27 Tb/s/mm UCIe Advanced Package Link With 2.5-D CoWoS Interposer and a 0.52 pJ/b 0.448 Tb/s/mm UCIe Standard Package Link With Organic Substrate in 3 nm FinFET 150 150
Author(s): Didem Turker Melek, James Vandersand, R. Navin Kumar, Pyare M. Sarkar, Prakash BS, Adrian Leuciuc, Kevin Geary, Shaojun Ma, Chirag M. Mehta, Basant Bothra, Shashi Jain, Pawan Sabharwal, Ranjan Vaish, Kirti Bhanushali, Yutong Ding, Craig Frost, John Annunziata, Krishanu Sadhu, Dimitris Kyritsis, Jeff Bostak, Ming Li, Steve Williams, Ken Chang

Abstract:

This work presents two die-to-die (D2D) wireline transceivers, one compliant with the UCIe advanced package (UCIe-AP) and the other with the UCIe standard package (UCIe-SP) standard, developed in 3 nm FinFET. The Universal Chiplet interconnect express (UCIe)-AP link has 64 RX and 64 TX data lanes in one PHY module and …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 13
Year of Publication: 2026
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2026.3651425
Publisher: IEEE

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A Millimeter-Wave Direct Digital Transmitter Using Multiphase Subharmonic Switching PA

A Millimeter-Wave Direct Digital Transmitter Using Multiphase Subharmonic Switching PA 150 150
Author(s): Soumya Mahapatra, Mostafa Ayesh, Ce Yang, Mayank Palaria, Shiyu Su, Aoyang Zhang, Mike Shuo-Wei Chen

Abstract:

This article presents a direct digital transmitter (TX) employing a multiphase subharmonic switching (MP-SHS) power amplifier (PA) to achieve both high peak and power back-off (PBO) efficiency with wide signal bandwidth. A phase-shifted subharmonic (SH) local oscillator (LO) divider is proposed to suppress SH spurs with minimal implementation overhead by …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 16
Year of Publication: 2025
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2025.3605564
Publisher: IEEE

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A 240-GHz Sub-THz Direct-Conversion Transmitter With I/Q Phase Calibration in 40-nm CMOS

A 240-GHz Sub-THz Direct-Conversion Transmitter With I/Q Phase Calibration in 40-nm CMOS 150 150
Author(s): Chun-Sheng Lin, Chih-Hsueh Lin, Chun-Hsing Li

Abstract:

A 240-GHz direct-conversion transmitter (TX), consisting of an LO chain and fundamental I/Q mixers, is proposed for sub-THz communication applications. The LO chain integrates phase-shifter-embedded impedance matching networks (IMNs) and frequency tripler with an optimized harmonic IMN, delivering I/Q LO signals at 240 GHz with high output power, 360° phase …

Published in: IEEE Solid-State Circuits Letters
Page(s): 225 – 228
Year of Publication: 2025
Electronic ISSN: 2573-9603
DOI: 10.1109/LSSC.2025.3592246
Publisher: IEEE

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A 0.7-V Multiclass Digital Doherty Power Amplifier for BLE Applications With 41% Peak DE in 22-nm CMOS

A 0.7-V Multiclass Digital Doherty Power Amplifier for BLE Applications With 41% Peak DE in 22-nm CMOS 150 150
Author(s): Edoardo Baiesi Fietta, David Seebacher, Davide Ponton, Andrea Bevilacqua

Abstract:

This letter presents a multiclass, asymmetric digital Doherty power amplifier (DDPA) for Bluetooth low energy (BLE) applications, that achieves high efficiency at full-scale as well as at 8.6-dB back-off using a single 0.7-V supply voltage. The proposed DDPA is made of two power-combined switched-capacitor power amplifiers (SCPAs) and uses an …

Published in: IEEE Solid-State Circuits Letters
Page(s): 217 – 220
Year of Publication: 2025
Electronic ISSN: 2573-9603
DOI: 10.1109/LSSC.2025.3591570
Publisher: IEEE

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