Transceivers

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A 142–164-GHz Phased-Array AiP Module With High-Power-Density and High-Efficiency Transceiver in 65-nm CMOS for 6G UE

A 142–164-GHz Phased-Array AiP Module With High-Power-Density and High-Efficiency Transceiver in 65-nm CMOS for 6G UE 150 150
Author(s): Yudai Yamazaki, Yohei Morishita, Sunghwan Park, Takaya Uchino, Chenxin Liu, Jun Sakamaki, Akihiro Egami, Ryosuke Hasaba, Ken Takahashi, Tomoki Abe, Tomohiro Murata, Yoichi Nakagawa, Takashi Tomura, Hiroshi Taneda, Kei Murayama, Makoto Tsukahara, Hiroko Ota, Yoko Nakabayashi, Ryuji Kinugawa, Takumi Kojima, Anyi Tian, Kotaro Ito, Chun Wang, Hans Herdian, Yi Zhang, Zheng Li, Wenqian Wang, Hongye Huang, Dingxin Xu, Sena Kato, Michihiro Ide, Shinsuke Hara, Issei Watanabe, Akifumi Kasamatsu, Yuncheng Zhang, Hiroyuki Sakai, Kazuaki Kunihiro, Atsushi Shirane, Koji Takinami, Kenichi Okada

Abstract:

This work presents a D-band high-power-density four-element phased-array transceiver for 6G user equipment (UE). Conventional designs require large multi-stage LO generation circuits for D-band up/down conversion, making it difficult to achieve compact size and low-power consumption. To address this, we propose an integrated LO chain using an injection-locked tripling …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1275 – 1293
Year of Publication: 2026
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2026.3665184
Publisher: IEEE

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Sub-Terahertz Wideband ASK Transceiver for 14/27/64 Gb/s 0.27-km/0.12-m/0.1-mm Interconnection in 28-nm CMOS

Sub-Terahertz Wideband ASK Transceiver for 14/27/64 Gb/s 0.27-km/0.12-m/0.1-mm Interconnection in 28-nm CMOS 150 150
Author(s): Dawei Tang, Xiaoyue Xia, Leyang Huang, Zekun Li, Chun Yang, Zheng Yan, Si-Yuan Tang, Peigen Zhou, Rui Zhang, Liqun Lu, Wentao Zhu, Zhe Chen, Jixin Chen, Hao Gao, Wei Hong

Abstract:

This article presents a 28-nm CMOS sub-terahertz (sub-THz) amplitude shift-keying (ASK) transceiver achieving competitive wireless and wireline communication performance. The over-the-air (OTA) link demonstrates 14 Gb/s/0.27 km, 16Gb/s/1m, and 27 Gb/s/12 cm without equalization (EQ), while supporting 64 Gb/s on-Off keying (OOK) and 40 Gb/s pulse amplitude modulation (…

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 17
Year of Publication: 2026
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2026.3665552
Publisher: IEEE

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A 56-Gb/s Hybrid Silicon Photonic and 5-nm CMOS 3-D-Integrated Transceiver for Optical Compute I/O

A 56-Gb/s Hybrid Silicon Photonic and 5-nm CMOS 3-D-Integrated Transceiver for Optical Compute I/O 150 150
Author(s): Ganesh Balamurugan, Parmanand Mishra, Subal Sahni, Ankur Aggarwal, Simon Forey, Andrew Gimlett, Prateek Goyal, Han Hao, Santosh Hariwan, Masum Hossain, Sejun Jeon, Narayan Kaniyur, David Lazovsky, Wonho Lee, Bengt Littmann, Raj Nagulapalli, Kevin Park, John Rollinson, Matteo Staffaroni, Prakash Thakur, Saurabh Vats, Preet Virk, Dehua Xiao, Hemesh Yasotharan, Raman Yazdani, Waleed Younis, Shifeng Yu, Phil Winterbottom

Abstract:

This work presents a hybrid 3-D-integrated silicon photonic (SiPh) transceiver suitable for realizing chiplet-based optical I/O in future AI/ML ASIC packages. The optical transceiver die stack is composed of two ICs: a SiPh IC (PIC) with micrometer-scale, thermally robust electro-absorption modulators (EAMs), and a 5-nm CMOS electronic IC (…

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 11
Year of Publication: 2026
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2026.3655295
Publisher: IEEE

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A 0.29 pJ/b 5.27 Tb/s/mm UCIe Advanced Package Link With 2.5-D CoWoS Interposer and a 0.52 pJ/b 0.448 Tb/s/mm UCIe Standard Package Link With Organic Substrate in 3 nm FinFET

A 0.29 pJ/b 5.27 Tb/s/mm UCIe Advanced Package Link With 2.5-D CoWoS Interposer and a 0.52 pJ/b 0.448 Tb/s/mm UCIe Standard Package Link With Organic Substrate in 3 nm FinFET 150 150
Author(s): Didem Turker Melek, James Vandersand, R. Navin Kumar, Pyare M. Sarkar, Prakash BS, Adrian Leuciuc, Kevin Geary, Shaojun Ma, Chirag M. Mehta, Basant Bothra, Shashi Jain, Pawan Sabharwal, Ranjan Vaish, Kirti Bhanushali, Yutong Ding, Craig Frost, John Annunziata, Krishanu Sadhu, Dimitris Kyritsis, Jeff Bostak, Ming Li, Steve Williams, Ken Chang

Abstract:

This work presents two die-to-die (D2D) wireline transceivers, one compliant with the UCIe advanced package (UCIe-AP) and the other with the UCIe standard package (UCIe-SP) standard, developed in 3 nm FinFET. The Universal Chiplet interconnect express (UCIe)-AP link has 64 RX and 64 TX data lanes in one PHY module and …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 13
Year of Publication: 2026
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2026.3651425
Publisher: IEEE

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A 4 × 224 Gb/s Single-Ended PAM-4 Transceiver Front-End With Noise Suppression Technique and Cascaded Equalizers in 130-nm SiGe BiCMOS

A 4 × 224 Gb/s Single-Ended PAM-4 Transceiver Front-End With Noise Suppression Technique and Cascaded Equalizers in 130-nm SiGe BiCMOS 150 150
Author(s): Xiongshi Luo, Xuewei You, Zhenghao Li, Hongzhi Wu, Yangyi Zhang, Fuzhan Chen, Xuxu Cheng, Wentao Zhou, Quan Pan

Abstract:

A dc-coupled analog single-ended (SE) transceiver (TRX) front-end supporting 224 Gb/s/lane is presented. It features SE-to-differential (S2D) and differential-to-SE (D2S) conversion, power-efficient broadband analog equalization, and noise suppression. Both the transmitter and receiver front-ends adopt pseudodifferential structures with dual-loop regulators to achieve a high power supply rejection …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 10
Year of Publication: 2025
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2025.3644437
Publisher: IEEE

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Modern Wireline Transceivers

Modern Wireline Transceivers 150 150
Author(s): Tony Chan Carusone, Timothy O. Dickson, Samuel Palermo, Sudip Shekhar, Mozhgan Mansuri

Abstract:

Over the past two decades, ever-increasing network bandwidth (BW) demands in data centers and high-performance computing systems have fueled exponential growth in per-lane serial link data rates. To keep up with this demand and enable faster communication over BW-limited electrical channels, wireline transceiver architectures and circuit topologies have rapidly evolved …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 395 – 422
Year of Publication: 2026
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2025.3642231
Publisher: IEEE

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A Machine Learning-Inspired PAM-4 Transceiver for Medium-Reach Wireline Links

A Machine Learning-Inspired PAM-4 Transceiver for Medium-Reach Wireline Links 150 150
Author(s): Ramin Javadi, Tejasvi Anand

Abstract:

This article presents an energy-efficient machine learning-inspired PAM-4 wireline transceiver that leverages data encoding at the transmitter (Tx) and feature extraction with classification at the receiver (Rx) to compensate for channel loss ranging from 13 to 26 dB, while maintaining the bit error rate (BER)<10-11. A new consecutive symbol-to-center (CSC) encoding …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 13
Year of Publication: 2025
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2025.3616072
Publisher: IEEE

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A Fully Integrated Galvanic Isolator for Gate Drivers With Asynchronous 100/167 Mb/s ASK/FSK Full-Duplex Communication

A Fully Integrated Galvanic Isolator for Gate Drivers With Asynchronous 100/167 Mb/s ASK/FSK Full-Duplex Communication 150 150
Author(s): Lucrezia Navarin, Karl Norling, Marco Parenzan, Stefano Ruzzu, Andrea Neviani, Andrea Bevilacqua

Abstract:

A fully integrated galvanic isolator for gate drivers that supports high-speed, asynchronous, full-duplex communication is presented. Data transmission from the microcontroller to the power device is achieved using amplitude-shift keying (ASK) at 100 Mb/s, while simultaneous communication in the opposite direction is implemented using frequency-shift keying (FSK) at 167 Mb/s. …

Published in: IEEE Solid-State Circuits Letters
Page(s): 289 – 292
Year of Publication: 2025
Electronic ISSN: 2573-9603
DOI: 10.1109/LSSC.2025.3611018
Publisher: IEEE

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An 800GbE PAM-4 PHY Transceiver for 42 dB Copper and Direct-Drive Optical Applications in 7 nm

An 800GbE PAM-4 PHY Transceiver for 42 dB Copper and Direct-Drive Optical Applications in 7 nm 150 150
Author(s): Chang Liu, Burak Catli, Yong Liu, Anand Vasani, Guansheng Li, Kun Chuai, Lakshmi Rao, Yang Liu, Xin Meng, Jiawen Zhang, Tim He, Batu Dayanik, Vadim Milirud, Meisam Honarvar Nazari, Hyo Gyuem Rhew, Derui Kong, Arvindh Iyer, Nan Wang, Alireza Nilchi, Aminghasem Safarian, Ray Wang, Hyung-Joon Jeon, Xiaochen Yang, Boyu Hu, Jerry Han, Adesh Garg, Kumar Thasari, Heng Zhang, Namik Kocaman, Ali Nazemi, Delong Cui, Afshin Momtaz, Jun Cao

Abstract:

This work presents a low power DSP-based single-chip 800GbE PAM-4 PHY transceiver in 7 nm process capable of driving eight lanes of up to 112-Gb/s. It supports both electrical and optical links with monolithic integrated laser driver enabling direct-drive PAM-4 output capability for EML and silicon photonics. The transceiver supports 42 …

Published in: IEEE Solid-State Circuits Letters
Page(s): 281 – 284
Year of Publication: 2025
Electronic ISSN: 2573-9603
DOI: 10.1109/LSSC.2025.3608134
Publisher: IEEE

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