Through-silicon vias

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SHINSAI: A 586 mm2 Reusable Active TSV Interposer With Programmable Interconnect Fabric and 512 Mb Underdeck Memory

SHINSAI: A 586 mm2 Reusable Active TSV Interposer With Programmable Interconnect Fabric and 512 Mb Underdeck Memory 150 150
Author(s): Haozhe Zhu, Bo Jiao, Yuman Zeng, Yongjiang Li, Jie Liao, Siyao Jia, Zexing Chen, Liyu Lin, Xuanda Lin, Suchang Huang, Mochen Tian, Jundong Zhu, Dexin Wen, Yan Wang, Yu Wang, Jian Xu, Feng Wang, Jun Tao, Chixiao Chen, Qi Liu, Ming Liu

Abstract:

This article presents SHINSAI—a 586 mm2 reusable active through-silicon via (TSV) interposer addressing key challenges in multi-chiplet integration (MCI) architectures. While active interposers overcome fundamental limitations of passive counterparts by integrating functional circuitry, existing solutions face three critical constraints: 1) non-recurring engineering (NRE) costs from application-specific interposers negating chiplet reuse benefits; 2) …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 90 – 102
Year of Publication: 2026
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2025.3623630
Publisher: IEEE

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3-D Stacked HBM and Compute Accelerators for LLM: Optimizing Thermal Management and Power Delivery Efficiency

3-D Stacked HBM and Compute Accelerators for LLM: Optimizing Thermal Management and Power Delivery Efficiency 150 150
Author(s): Janak Sharda, Madison Manley, Jungyoun Kwak, Chinsung Park, Muhannad Bakir, Shimeng Yu

Abstract:

Advanced packaging is becoming essential for designing hardware accelerators for large language models (LLMs). Different architectures, such as 2.5-D integration of memory with logic, have been proposed; however, the bandwidth limits the throughput of the complete system. Recent works have proposed memory on logic systems, where high bandwidth memory (HBM) …

Published in: IEEE Journal on Exploratory Solid-State Computational Devices and Circuits
Page(s): 116 – 122
Year of Publication: 2025
Electronic ISSN: 2329-9231
DOI: 10.1109/JXCDC.2025.3617298
Publisher: IEEE

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