terahertz (THz)

  • No Comments

THz-TSI: A Terahertz Wireless Through-Silicon Interconnect Module for Advanced 3-D Integration Applications

THz-TSI: A Terahertz Wireless Through-Silicon Interconnect Module for Advanced 3-D Integration Applications 150 150
Author(s): Chen Jiang, Xiaodi Feng, Xiaohan Shen, Chixiao Chen, Qi Liu, Ming Liu, Ningsheng Xu

Abstract:

By vertically stacking device layers, advanced 3-D integration overcomes traditional planar scaling limits, delivering the bandwidth and power efficiency essential for modern artificial intelligence (AI) and high-performance computing (HPC) integrated systems. However, continued scaling of conventional through-silicon vias (TSVs) and microbumps presents critical bottlenecks due to inherent thermo-mechanical stress, complex …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 13
Year of Publication: 2026
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2026.3720291
Publisher: IEEE

View on IEEE Xplore

  • No Comments

A 300-GHz 2-D Scalable 4 × 4 Phased-Array Receiver With Half-Wavelength Element Spacing in 65-nm CMOS

A 300-GHz 2-D Scalable 4 × 4 Phased-Array Receiver With Half-Wavelength Element Spacing in 65-nm CMOS 150 150
Author(s): Huanting Deng, Kaizhe Guo, Yihan Wang, Houyi Yan, Jiyao Wang, Mengru Yang, Jian Guo, Peng Gu, Xiaohu You, Dixian Zhao

Abstract:

This article presents a 300-GHz 2-D scalable $4\times 4$ phased-array receiver (RX) with half-wavelength element spacing in 65-nm CMOS. To achieve high scalability, a hybrid local oscillator (LO)–intermediate frequency (IF) beamforming scheme based on a coupled oscillator array is proposed, together with an area-efficient aperture-coupled antenna implemented on quartz. The …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 13
Year of Publication: 2026
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2026.3711687
Publisher: IEEE

View on IEEE Xplore

  • No Comments

A 436–472 GHz 4-Element IF Beamforming Phased-Array Receiver in 65-nm CMOS

A 436–472 GHz 4-Element IF Beamforming Phased-Array Receiver in 65-nm CMOS 150 150
Author(s): Hao Guo, Hao-Tao Hu, Zhicheng Lin, Zijun Guo, Xiaoyue Xia, Kaizhe Guo, Kam Man Shum, Pui-In Mak, Chi Hou Chan

Abstract:

This article presents a 436–472GHz four-element intermediate-frequency (IF) beamforming phased-array receiver fabricated in 65-nm CMOS, targeting scalable terahertz (THz) phased-array systems. The proposed receiver adopts a two-step mixing scheme to reduce the area overhead of the IF beamforming implementation, thereby enhancing the array scalability at THz frequencies. Each receive channel …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 14
Year of Publication: 2026
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2026.3710258
Publisher: IEEE

View on IEEE Xplore

  • No Comments

A 298–334-GHz Scalable Injection-Locked Phased-Array Radiator With Second-Subharmonic-Termination-Assisted Waveform Formulation for Power Enhancement

A 298–334-GHz Scalable Injection-Locked Phased-Array Radiator With Second-Subharmonic-Termination-Assisted Waveform Formulation for Power Enhancement 150 150
Author(s): Meng Yang, Liang Wu

Abstract:

This article introduces an injection-locked $4\times 2$ phased-array radiator featuring scalability in both horizontal and vertical dimensions. The system architecture is constructed by sequentially cascading four identical phase-shifting and frequency-quadrupling (PSFQ) elements in a chain-like configuration and then cohering two such chains, thereby achieving global frequency synchronization. Particularly, phase shifting and …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 12
Year of Publication: 2025
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2025.3624563
Publisher: IEEE

View on IEEE Xplore

Search this website