Temperature

A Zero-Static-Power ADC With Integrated Dynamic Reference and Driver-Free Operation Achieving 58.6 dB SNDR From –40 °C to 85 °C

A Zero-Static-Power ADC With Integrated Dynamic Reference and Driver-Free Operation Achieving 58.6 dB SNDR From –40 °C to 85 °C 150 150

Abstract:

This letter presents a 10-bit ENOB charge-sharing SAR ADC with a fully integrated dynamic bandgap reference (BGR), enabling first-order noise shaping and ultralow-power (ULP) operation. The charge-sharing ADC and dynamic BGR form an ideal pair: both operate without static current, allowing compact integration and high precision. The SAR uses only …

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Self-Heating and Parasitic Effects in Multi-Tier CFET Design

Self-Heating and Parasitic Effects in Multi-Tier CFET Design 150 150

Abstract:

In this article, we study the impact of self-heating effects (SHEs) and middle of line (MOL) and back-end of line (BEOL) induced parasitics on multi-tier CFET design, where multiple nanosheet devices are vertically stacked. We analyze and compare the 4-tier CFET design with the conventional 2-tier CFET, using TCAD models …

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A 6.9-ppm/°C, 0.66-mV/V Line Regulation, 50-mA Multi-Loop Low-Dropout Regulator With Integrated Single-BJT Voltage and Current References

A 6.9-ppm/°C, 0.66-mV/V Line Regulation, 50-mA Multi-Loop Low-Dropout Regulator With Integrated Single-BJT Voltage and Current References 150 150

Abstract:

This article presents a fully integrated output-capacitor-less (OCL) multi-feedback-loop low-dropout regulator (LDO) with an in-built single bipolar junction transistor (BJT)-based voltage and current reference (VCR) for energy-harvesting Internet of Things (IoT) devices. The proposed architecture comprises four loops, which significantly enhance the DC regulation and transient performance of the …

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A Cryogenic Superconducting Quantum Computing Unit Interface Chipset With Phase-Detection-Based Readout and Phase-Shifter-Based Controller

A Cryogenic Superconducting Quantum Computing Unit Interface Chipset With Phase-Detection-Based Readout and Phase-Shifter-Based Controller 150 150

Abstract:

This article presents a cryogenic quantum interface chipset at 3.5 K for superconducting transmon qubit operations. The chipset comprises a phase-detection readout and a phase-shifter-based polar-modulation controller with flexible scalability. With the proposed phase-detection readout scheme, a 9-bit time-to-digital converter (TDC)-based state detector is used to read out the qubit …

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A 28-nm FD-SOI CMOS Analog-IMC Core Based on PCM Featuring 8 512 × 512-Weight Layers and 28M Weights×TOPs/W/mm2

A 28-nm FD-SOI CMOS Analog-IMC Core Based on PCM Featuring 8 512 × 512-Weight Layers and 28M Weights×TOPs/W/mm2 150 150

Abstract:

In-memory computing (IMC) hardware accelerators for deep neural networks (DNNs) require storing a massive number of coefficients within a single computing macro to avoid performance degradation in multicore clusters. This aspect, often overlooked by common figures of merit (FoMs), can be effectively addressed by phase-change memory (PCM) technology, thanks to …

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A High-Linearity Shunt-Based In-Line Current Sensor With Self-Heating Compensation and 14.4 V 2 MHz PWM Rejection

A High-Linearity Shunt-Based In-Line Current Sensor With Self-Heating Compensation and 14.4 V 2 MHz PWM Rejection 150 150

Abstract:

This article presents a cost-effective, fully integrated shunt-resistor-based in-line current sensor that delivers high linearity and strong PWM rejection, enabling precise current measurement and control in dynamic driving systems like robotics, imaging, and audio. To mitigate the self-heating of the on-chip shunt resistor, which degrades linearity, a location-based thermal compensation …

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A 14-b Energy-Efficient BW/Power Scalable CTDSM With a Frequency-Controlled Current Source

A 14-b Energy-Efficient BW/Power Scalable CTDSM With a Frequency-Controlled Current Source 150 150

Abstract:

This work presents a 14-bit energy-efficient bandwidth (BW)/power scalable continuous-time delta–sigma modulator (CTDSM) for sensor interfaces in IoT applications. To ensure low noise for small input signals and achieve BW/power scalability, it is built around Gm-C integrators biased via a linear frequency-controlled current source (FCCS). The FCCS …

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CFET Beyond 3 nm: SRAM Reliability Under Design-Time and Run-Time Variability

CFET Beyond 3 nm: SRAM Reliability Under Design-Time and Run-Time Variability 150 150

Abstract:

This work investigates the reliability of complementary field-effect transistors (CFETs) by addressing both design-time variability arising from process variations and run-time variability due to temperature and aging effects. A rigorously calibrated TCAD model, validated against experimental CFET data, is employed to quantify the impact of metal gate granularity (MGG)-induced …

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