Switches

  • No Comments

A Compact XOR Gate Implemented With a Single Straintronic Magnetic Tunnel Junction

A Compact XOR Gate Implemented With a Single Straintronic Magnetic Tunnel Junction 150 150
Author(s): Supriyo Bandyopadhyay

Abstract:

The XOR Boolean logic gate is widely used in many applications such as encryption (XOR ciphers), binary addition (half- and full-adders), error detection (parity bits), etc. but is challenging to construct because of its demanding conditional dynamics. It typically requires multiple logic switches or other types of gates, which results …

Published in: IEEE Journal on Exploratory Solid-State Computational Devices and Circuits
Page(s): 1 – 1
Year of Publication: 2026
Electronic ISSN: 2329-9231
DOI: 10.1109/JXCDC.2026.3719208
Publisher: IEEE

View on IEEE Xplore

  • No Comments

A 0.73 A/mm3 Switched-Capacitor-Stack-Inductor Volumetric Integrated Voltage Regulator With Auxiliary-Assisted Gain Boosting for High-Power-Density PoL Applications

A 0.73 A/mm3 Switched-Capacitor-Stack-Inductor Volumetric Integrated Voltage Regulator With Auxiliary-Assisted Gain Boosting for High-Power-Density PoL Applications 150 150
Author(s): Xuliang Wang, Renwei Chen, Haoyu Wang, Yang Liu, Wing-Hung Ki, Yan Wang, Xiaosen Liu

Abstract:

This article presents a volumetric integrated voltage regulator (IVR) based on a switched-capacitor-stack-inductor (SCSL) architecture that employs a holistic topology-control-package codesign to overcome the hardware and efficiency bottlenecks of conventional asymmetric multiinductor designs. Based on a discrete-time state-space model, a rigorous root-locus analysis reveals that a rudimentary single voltage-mode control …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 13
Year of Publication: 2026
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2026.3713507
Publisher: IEEE

View on IEEE Xplore

  • No Comments

An Extendable Wideband Band-Divided SPnT Switch Topology Based on a Reconfigurable Pole-to-Throw Network

An Extendable Wideband Band-Divided SPnT Switch Topology Based on a Reconfigurable Pole-to-Throw Network 150 150
Author(s): Zhaowu Wang, Hao Ning, Xinyan Li, Ze Yu, Qiliang Li, Xiaochen Tang, Yong Wang

Abstract:

This article presents an extendable wideband band-divided SP $n$ T switch topology based on a reconfigurable pole-to-throw network (RPTN). Compared to conventions, it mitigates the loss degradation resulting from complex signal routing in advanced RF front-ends. This is enabled by the RPTN, which divides the throws into low-/mid-/high-band (…

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 15
Year of Publication: 2026
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2026.3711644
Publisher: IEEE

View on IEEE Xplore

  • No Comments

A Three-Level Dual-Path Hybrid Buck Converter With Mitigated Capacitive Current and Seamless DVS Across a Wide Output Voltage Range

A Three-Level Dual-Path Hybrid Buck Converter With Mitigated Capacitive Current and Seamless DVS Across a Wide Output Voltage Range 150 150
Author(s): Jae-Hyun Kim, Jun-Gi Lee, Hyunki Han, Hyun-Sik Kim

Abstract:

This article presents a three-level dual-path (TLDP) buck converter tailored for mobile application processors (APs) with a 1.8-V input and 0.4–1.5-V output range. Conventional buck (CB) and multi-level buck (MLB) converters suffer from prohibitive DC resistance ( $R_{\mathrm {DCR}}$ ) losses in compact inductors as load current increases. Although various multi-path …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 15
Year of Publication: 2026
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2026.3710310
Publisher: IEEE

View on IEEE Xplore

  • No Comments

A Nesting-Connected Reconfigurable SC Converter With Fine-Grained Conversion Ratios and Increased Output Conduction Paths for On-Chip Surround Power Delivery

A Nesting-Connected Reconfigurable SC Converter With Fine-Grained Conversion Ratios and Increased Output Conduction Paths for On-Chip Surround Power Delivery 150 150
Author(s): Xuchu Mu, Yang Jiang, Xin Ming, Bo Zhang, Rui P. Martins, Pui-In Mak

Abstract:

This article presents a reconfigurable switched-capacitor (SC) DC–DC converter that achieves improved overall efficiency over a fine-grained conversion-ratio range, applicable to on-chip surround power delivery (SPD) in compact and lightweight devices. We propose a nesting-connected reconfigurable SC topology generation method, attaining fine-grained subdivision of reconfigurable voltage conversion ratios (VCRs) …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 13
Year of Publication: 2026
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2026.3702012
Publisher: IEEE

View on IEEE Xplore

  • No Comments

A Quadrature-Rotation Phased-Array Transmitter With High-Resolution Phase Tuning and Complex Domain Power Back-Off Efficiency Enhancement

A Quadrature-Rotation Phased-Array Transmitter With High-Resolution Phase Tuning and Complex Domain Power Back-Off Efficiency Enhancement 150 150
Author(s): Jie Zhou, Bingzheng Yang, Hongxin Tang, Xun Luo

Abstract:

In this article, a four-element digital-modulated phased-array transmitter based on quadrature switched/floated-capacitor power amplifiers (SFCPAs) and reconfigurable switched-capacitor tuning lines (RSCTLs) is proposed. Phase shifting in each element is achieved by hybrid coarse and fine phase-tuning approaches. The SFCPAs with the quadrature-rotation technique are presented for coarse phase tuning. …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 15
Year of Publication: 2026
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2026.3702007
Publisher: IEEE

View on IEEE Xplore

  • No Comments

A Ka-Band Eight-Stream Phased-Array MIMO Receiver With Time-Hopping Blocker Rejection for 6G

A Ka-Band Eight-Stream Phased-Array MIMO Receiver With Time-Hopping Blocker Rejection for 6G 150 150
Author(s): Minzhe Tang, Dongfan Xu, Yi Zhang, Yuxuan Liu, Zheng Li, Yuncheng Zhang, Yilun Chen, Minghao Fan, Ziyuan Ren, Jian Pang, Dingxin Xu, Chenxin Liu, Daxu Zhang, Duo Li, Hiroyuki Sakai, Kazuaki Kunihiro, Atsushi Shirane, Kenichi Okada

Abstract:

This article presents a Ka-band phased-array multiple-input multiple-output (MIMO) receiver for sixth-generation (6G) wireless networks. A time-division (TD) MIMO architecture is combined with DP antenna array to support eight MIMO streams in the Ka band. The complex weights of each RF element in both polarization arrays are sequentially switched at …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 21
Year of Publication: 2026
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2026.3695546
Publisher: IEEE

View on IEEE Xplore

  • No Comments

A 0.19-PEF Bandwidth/Power Scalable Dynamic Amplifier

A 0.19-PEF Bandwidth/Power Scalable Dynamic Amplifier 150 150
Author(s): Yihang Cheng, Yihan Zhang, Huaqiang Wu, Sining Pan

Abstract:

This letter presents an energy-efficient dynamic amplifier. It utilizes source-coupled input boosting and time-domain differential sampling techniques to boost the effective input signal by $4\times $ compared to its floating inverter amplifier (FIA) prototype without noise or power penalties. With discharge-based dynamic biasing, the bandwidth (BW) and power of the amplifier …

Published in: IEEE Solid-State Circuits Letters
Page(s): 93 – 96
Year of Publication: 2026
Electronic ISSN: 2573-9603
DOI: 10.1109/LSSC.2026.3668876
Publisher: IEEE

View on IEEE Xplore

  • No Comments

A Logic-Compatible 2-Transistor Embedded Bipolar RRAM MACRO: A 28-nm Multiple-Time Programmable (MTP) Memory Without Extra Masks

A Logic-Compatible 2-Transistor Embedded Bipolar RRAM MACRO: A 28-nm Multiple-Time Programmable (MTP) Memory Without Extra Masks 150 150
Author(s): Yi Xiang Huang, Y. S. Lin, P. S. Huang, E. Ray Hsieh

Abstract:

This letter presents a 2-transistor (2T) bipolar embedded resistive RAM (eRRAM) MACRO fabricated in a 28-nm high-k metal gate (HKMG) process for multitime programmable (MTP) applications. To overcome the scaling bottlenecks of traditional embedded Flash, this work utilizes an extra-mask-free, pure front-end-of-line (FEOL) integration, offering a robust solution for automotive …

Published in: IEEE Solid-State Circuits Letters
Page(s): 117 – 120
Year of Publication: 2026
Electronic ISSN: 2573-9603
DOI: 10.1109/LSSC.2026.3675063
Publisher: IEEE

View on IEEE Xplore

Search this website