sub-THz

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Integrated Low-Power Self-Coherent Kramers–Kronig Millimeter-Wave Receiver With Nonlinear Analog and Mixed-Signal Computing

Integrated Low-Power Self-Coherent Kramers–Kronig Millimeter-Wave Receiver With Nonlinear Analog and Mixed-Signal Computing 150 150
Author(s): Sherif Ghozzy, Muhamed Allam, Emir Ali Karahan, Zheng Liu, Kaushik Sengupta

Abstract:

A critical challenge in scaling up high-frequency wireless communication in the millimeter-Wave (mmWave) spectrum has been poor energy efficiency of the constituent transceivers, particularly on the highly energy constrained user equipment (UE). Receiving spectrally-efficient wireless signals (e.g., 64-quadrature amplitude modulation (QAM) etc.) require coherent transceivers with programmable frequency synthesizers, …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 18
Year of Publication: 2026
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2026.3720585
Publisher: IEEE

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A 138 Gb/s D-Band 2-D Scalable Transceiver Array With On-Chip Antennas Achieving Sub-1-pJ/b Efficiency in 28-nm Bulk CMOS

A 138 Gb/s D-Band 2-D Scalable Transceiver Array With On-Chip Antennas Achieving Sub-1-pJ/b Efficiency in 28-nm Bulk CMOS 150 150
Author(s): Hesham Beshary, Yikuan Chen, Ali M. Niknejad

Abstract:

This article presents a D-band 2-D scalable phased array that integrates a $2{\,}\times{\,} 2$ transceiving (TRX) radio frequency (RF) beamformer with on-chip antennas (OCAs) and a $\times 16$ local-oscillator (LO) multiplication chain. The 2-D array scalability is demonstrated by tiling $2{\,}\times{\,} 2$ chips into an array using a low-cost package to build a 16…

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 15
Year of Publication: 2026
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2026.3704818
Publisher: IEEE

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An Antenna-to-Bits F-Band 120-Gbps CMOS RF-64QAM Receiver

An Antenna-to-Bits F-Band 120-Gbps CMOS RF-64QAM Receiver 150 150
Author(s): Youssef O. Hassan, Mohammad Oveisi, Zisong Wang, Payam Heydari

Abstract:

A CMOS 100–140-GHz end-to-end receiver (RX) is presented that integrates the antenna input all the way to the bitstream output, while demodulating 64QAM/16QAM/QPSK entirely in the analog domain. A sequential asynchronous demodulation method enables 120-Gbps operation at a notably small baseband power consumption. Fabricated in a 22-nm FDSOI …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 16
Year of Publication: 2026
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2025.3648748
Publisher: IEEE

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A 200 GHz Wideband and Low-Power Direct-Downconversion Receiver Element in 16 nm FinFET Technology

A 200 GHz Wideband and Low-Power Direct-Downconversion Receiver Element in 16 nm FinFET Technology 150 150
Author(s): Ethan Chou, Hesham Beshary, Nima Baniasadi, Ali M. Niknejad

Abstract:

This letter presents a wideband and low-power direct-downconversion 200 GHz receiver element for digital-beamforming applications implemented in 16 nm FinFET technology. Wideband and low integrated receiver noise figure of 9.8 dB across a 21 GHz baseband bandwidth is realized with a differential low-noise amplifier leveraging an active input balun stage, while wideband gain of 29 …

Published in: IEEE Solid-State Circuits Letters
Page(s): 349 – 352
Year of Publication: 2025
Electronic ISSN: 2573-9603
DOI: 10.1109/LSSC.2025.3626442
Publisher: IEEE

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A 240-GHz Sub-THz Direct-Conversion Transmitter With I/Q Phase Calibration in 40-nm CMOS

A 240-GHz Sub-THz Direct-Conversion Transmitter With I/Q Phase Calibration in 40-nm CMOS 150 150
Author(s): Chun-Sheng Lin, Chih-Hsueh Lin, Chun-Hsing Li

Abstract:

A 240-GHz direct-conversion transmitter (TX), consisting of an LO chain and fundamental I/Q mixers, is proposed for sub-THz communication applications. The LO chain integrates phase-shifter-embedded impedance matching networks (IMNs) and frequency tripler with an optimized harmonic IMN, delivering I/Q LO signals at 240 GHz with high output power, 360° phase …

Published in: IEEE Solid-State Circuits Letters
Page(s): 225 – 228
Year of Publication: 2025
Electronic ISSN: 2573-9603
DOI: 10.1109/LSSC.2025.3592246
Publisher: IEEE

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