SRAM

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A Folded-Differential Switched-Capacitor SRAM CIM Macro With Scalable MAC Sizes for TinyML Inference

A Folded-Differential Switched-Capacitor SRAM CIM Macro With Scalable MAC Sizes for TinyML Inference 150 150
Author(s): Zhonghao Chen, Ling-An Cheong, Tianyi Yu, Yiming Chen, Guodong Yin, Teng Yi, Yongpan Liu, Huazhong Yang, Xueqing Li

Abstract:

This letter presents a switched-capacitor SRAM compute-in-memory macro optimized for TinyML inference. Key features include: 1) an area-efficient folded-differential multiply-and-accumulate (FD-MAC) scheme to double the signal margin; 2) a closed-loop floating-inverter amplifier (FIA)-based charge accumulation technique for signal-to-noise ratio enhancement and multiply-and-accumulate (MAC) voltage integration; and 3) a sparsity-aware multistep MAC method …

Published in: IEEE Solid-State Circuits Letters
Page(s): 73 – 76
Year of Publication: 2026
Electronic ISSN: 2573-9603
DOI: 10.1109/LSSC.2026.3662477
Publisher: IEEE

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MixCIM: A Hybrid Computing-in-Memory Macro With Less Data-Movement and Better Memory-Reuse for Depthwise Separable Neural Networks

MixCIM: A Hybrid Computing-in-Memory Macro With Less Data-Movement and Better Memory-Reuse for Depthwise Separable Neural Networks 150 150
Author(s): Xin Qiao, Youming Yang, Jiahao Song, Renjie Wei, Xiyuan Tang, Meng Li, Runsheng Wang, Yuan Wang

Abstract:

Computing-in-memory (CIM) architectures have demonstrated strong potential for edge artificial intelligence (AI) devices due to their enhanced parallelism and energy efficiency. With the growing complexity of AI tasks and the rapid increase in model size, computation and deployment costs have surged. Depthwise separable neural networks (DSNNs) have attracted interest for …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 13
Year of Publication: 2026
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2026.3651775
Publisher: IEEE

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An Approximate Digital CIM Macro With Low-Power Multiply-Add Units and Dynamic Sparse-Adaptive Configuring for Edge AI Inference

An Approximate Digital CIM Macro With Low-Power Multiply-Add Units and Dynamic Sparse-Adaptive Configuring for Edge AI Inference 150 150
Author(s): Xiaofeng Li, Yi Zhan, Purui Zhu, Rui Zhou, Jiayin Song, Heng You, Yumei Zhou, Shushan Qiao

Abstract:

This letter presents an approximate digital compute-in-memory (CIM) macro for low-power edge AI inference. It introduces three hierarchical innovations: 1) novel fused approximate multiply-add units (FAMUs) that reduces power and area consumption; 2) a bit-critical weight allocation architecture that optimally balances accuracy and hardware cost; and 3) a dynamic sparsity-adaptive configuration method to …

Published in: IEEE Solid-State Circuits Letters
Page(s): 45 – 48
Year of Publication: 2026
Electronic ISSN: 2573-9603
DOI: 10.1109/LSSC.2026.3652570
Publisher: IEEE

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A 3-nm FinFET 563-kbit 35.5-Mbit/mm2 Dual-Rail SRAM With 3.89-pJ/Access High Energy Efficient and 27.5-μW/Mbit One-Cycle Latency Low-Leakage Mode

A 3-nm FinFET 563-kbit 35.5-Mbit/mm2 Dual-Rail SRAM With 3.89-pJ/Access High Energy Efficient and 27.5-μW/Mbit One-Cycle Latency Low-Leakage Mode 150 150
Author(s): Yumito Aoyagi, Koji Nii, Makoto Yabuuchi, Tomotaka Tanaka, Kazuto Mizutani, Masaya Hamada, Yuichiro Ishii, Yen Chi Chou, Jun Cheng Liu, Chien-Yu Huang, Kang-Hui Peng, Yu-Hao Hsu, Isabel Wang, Hong-Chen Cheng, Hung-Jen Liao, Tsung-Yung Jonathan Chang

Abstract:

This article presents a high-density (HD) 6T SRAM macro designed in 3-nm FinFET technology with an extended dual-rail (XDR) architecture, addressing active energy and leakage for mobile applications. Two key innovations are introduced: the delayed-wordline in write operation (DEWL) technique and a one-cycle latency low-leakage access mode (1-CLM). The XDR …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 11
Year of Publication: 2025
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2025.3639747
Publisher: IEEE

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A 28-nm Digital Compute-in-Memory Ising Annealer With Asynchronous Random Number Generator for Traveling Salesman Problem

A 28-nm Digital Compute-in-Memory Ising Annealer With Asynchronous Random Number Generator for Traveling Salesman Problem 150 150
Author(s): Yuyao Kong, Haomei Liu, Vaidehi Garg, Shimeng Yu

Abstract:

This work presents a compact digital compute-in-memory (DCIM) Ising annealer targeting large-scale combinatorial optimization. A centroid-based weight mapping method combined with hierarchical clustering reduces the memory capacity required for traveling salesman problem (TSP) weights, enabling efficient mapping with limited on-chip storage. An asynchronous random number generator (ARNG) based on dual …

Published in: IEEE Solid-State Circuits Letters
Page(s): 1 – 4
Year of Publication: 2026
Electronic ISSN: 2573-9603
DOI: 10.1109/LSSC.2025.3639178
Publisher: IEEE

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A 37.8 Mb/mm² SRAM in Intel 18A Technology Featuring a Resistive Supply-Line Write Scheme and Write-Assist With Parallel Boost Injection

A 37.8 Mb/mm² SRAM in Intel 18A Technology Featuring a Resistive Supply-Line Write Scheme and Write-Assist With Parallel Boost Injection 150 150
Author(s): Harold Pilo, Manish Arora, Chien-An Lai, Mike Lee, Zack Lo, Mayur Randeria

Abstract:

A high-density (HD), SRAM-based register file (RF) has been demonstrated in Intel 18A Technology (Wang et al., 2025 and Pilo et al., 2025) featuring RibbonFET GAA transistors and a back side power delivery network (BSDPN). The RF is optimized for HD and array efficiency and achieves a density of 37.8 Mb/mm2, the …

Published in: IEEE Solid-State Circuits Letters
Page(s): 357 – 360
Year of Publication: 2025
Electronic ISSN: 2573-9603
DOI: 10.1109/LSSC.2025.3628176
Publisher: IEEE

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Impact of Aging, Self-Heating, and Parasitics Effects on NSFET and CFET

Impact of Aging, Self-Heating, and Parasitics Effects on NSFET and CFET 150 150
Author(s): Swati Deshwal, Sufia Shahin, Anirban Kar, Yogesh S. Chauhan, Hussam Amrouch

Abstract:

This work presents a comparative analysis of complementary field-effect transistor (CFET) and nanosheet FET (NSFET) architectures, with a focus on self-heating effects (SHEs), negative bias temperature instability (NBTI), hot carrier degradation (HCD), and the impact of back-end-of-line (BEOL) parasitics on standard cell performance. NBTI degradation is modeled using a framework …

Published in: IEEE Journal on Exploratory Solid-State Computational Devices and Circuits
Page(s): 188 – 196
Year of Publication: 2025
Electronic ISSN: 2329-9231
DOI: 10.1109/JXCDC.2025.3624653
Publisher: IEEE

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MIX-ACIM: A 28-nm Mixed-Precision Analog Compute-in-Memory With Digital Feature Restoration for Vector-Matrix Multiplication

MIX-ACIM: A 28-nm Mixed-Precision Analog Compute-in-Memory With Digital Feature Restoration for Vector-Matrix Multiplication 150 150
Author(s): Wei-Chun Wang, Shida Zhang, Laith Shamieh, Narasimha Vasishta Kidambi, Isha Chakraborty, Saibal Mukhopadhyay

Abstract:

A mixed-precision analog compute-in-memory (Mix-ACIM) is presented for mixed-precision vector-matrix multiplication (VMM). The design features an all-analog current-domain fixed-point (FxP) VMM with floating-point conversion and feature restoration. A 28 nm CMOS test chip shows 41 TOPS/W and 24 TOPS/mm2 for FxP (8-bit input/weight and 12-bit output) and 24.18 TFLOPS/W and 3.3 …

Published in: IEEE Solid-State Circuits Letters
Page(s): 213 – 216
Year of Publication: 2025
Electronic ISSN: 2573-9603
DOI: 10.1109/LSSC.2025.3590757
Publisher: IEEE

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CFET Beyond 3 nm: SRAM Reliability Under Design-Time and Run-Time Variability

CFET Beyond 3 nm: SRAM Reliability Under Design-Time and Run-Time Variability 150 150
Author(s): Sufia Shahin, Swati Deshwal, Anirban Kar, Mahdi Benkhelifa, Yogesh S. Chauhan, Hussam Amrouch

Abstract:

This work investigates the reliability of complementary field-effect transistors (CFETs) by addressing both design-time variability arising from process variations and run-time variability due to temperature and aging effects. A rigorously calibrated TCAD model, validated against experimental CFET data, is employed to quantify the impact of metal gate granularity (MGG)-induced …

Published in: IEEE Journal on Exploratory Solid-State Computational Devices and Circuits
Page(s): 51 – 59
Year of Publication: 2025
Electronic ISSN: 2329-9231
DOI: 10.1109/JXCDC.2025.3568622
Publisher: IEEE

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