Solid modeling

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A 3-D HBI Compliant 1.536 TB/s/mm2 Bandwidth Scalable Attention Accelerator With 22.5-GOPS Throughput High Speed SoftMax for Quantized Transformers in Intel 3

A 3-D HBI Compliant 1.536 TB/s/mm2 Bandwidth Scalable Attention Accelerator With 22.5-GOPS Throughput High Speed SoftMax for Quantized Transformers in Intel 3 150 150
Author(s): Prerna Budhkar, Mirco Sciulli, Srivatsa Rangachar Srinivasa, Gauthaman Murali, Ragh Kuttappa, Paolo Aseron, Trang Nguyen, Vinayak Honkote, Tanay Karnik

Abstract:

This letter presents a novel hardware accelerator compatible with <3- $\mu $ m pitch 3-D Cu-Cu hybrid bonding interconnect (HBI) technology, particularly designed to efficiently execute multihead attention (MHA) of encoder transformer models. We present an accelerator that addresses performance losses due to low precision models by incorporating specialized hardware optimizations …

Published in: IEEE Solid-State Circuits Letters
Page(s): 69 – 72
Year of Publication: 2026
Electronic ISSN: 2573-9603
DOI: 10.1109/LSSC.2026.3659575
Publisher: IEEE

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IRIS: An Energy-Efficient Spatial Computing SoC for Real-Time Interactive Rendering and Modeling With Surface-Aware 3-D Gaussian Splatting

IRIS: An Energy-Efficient Spatial Computing SoC for Real-Time Interactive Rendering and Modeling With Surface-Aware 3-D Gaussian Splatting 150 150
Author(s): Seokchan Song, Seryeong Kim, Wonhoon Park, Jongjun Park, Sanghyuk An, Gwangtae Park, Minseo Kim, Hoi-Jun Yoo

Abstract:

The 3-D Gaussian splatting (3DGS), based on a machine learning-driven radiance field technique, is rapidly emerging as a next-generation solution in 3-D graphics. Owing to its short modeling time, computational simplicity, and high rendering quality, it is expected to replace traditional 3-D graphics on edge devices. However, its substantial memory …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 14
Year of Publication: 2025
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2025.3613707
Publisher: IEEE

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