Sensors

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Monolithic Electronic–Biophotonic System-on-Chip for Label-Free Real-Time Molecular Sensing

Monolithic Electronic–Biophotonic System-on-Chip for Label-Free Real-Time Molecular Sensing 150 150
Author(s): Christos Adamopoulos, Hyeong-Seok Oh, Sidney Buchbinder, Panagiotis Zarkos, Pavan Bhargava, Asmaysinh Gharia, Ali M. Niknejad, Mekhail Anwar, Vladimir Stojanović

Abstract:

Label-free miniaturized optical sensors can have a tremendous impact on highly sensitive and scalable point-of-care (PoC) diagnostics by monitoring real-time molecular interactions without any labels. However, current biophotonic platforms are limited by complex optical and external readout equipment, precluding their use in a PoC setting. In this work, we address …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 15
Year of Publication: 2024
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2024.3382933
Publisher: IEEE

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Energy-Accuracy Trade-Offs for Resistive In-Memory Computing Architectures

Energy-Accuracy Trade-Offs for Resistive In-Memory Computing Architectures 150 150
Author(s): Saion K. Roy, Naresh R. Shanbhag

Abstract:

Resistive in-memory computing (IMC) architectures currently lag behind SRAM IMCs and digital accelerators in both energy efficiency and compute density due to their low compute accuracy. This article proposes the use of signal-to-noise-plus-distortion ratio (SNDR) to quantify the compute accuracy of IMCs and identify the device, circuit, and architectural parameters …

Published in: IEEE Journal on Exploratory Solid-State Computational Devices and Circuits
Page(s): 22 – 30
Year of Publication: 2024
Electronic ISSN: 2329-9231
DOI: 10.1109/JXCDC.2024.3381888
Publisher: IEEE

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A 72-Channel Resistive-and-Capacitive Sensor-Interface Chip With Noise-Orthogonalizing and Pad-Sharing Techniques

A 72-Channel Resistive-and-Capacitive Sensor-Interface Chip With Noise-Orthogonalizing and Pad-Sharing Techniques 150 150
Author(s): Xiangdong Feng, Yuxuan Luo, Tianyi Cai, Yangfan Xuan, Yunshan Zhang, Yili Shen, Changgui Yang, Qijing Xiao, Sijun Du, Bo Zhao

Abstract:

The growing trend of the Internet of Things (IoT) involves trillions of sensors in various applications. An extensive array of parameters need to be gathered concurrently with high-precision, low-cost, and low-power sensor nodes, such as resistive (R) and capacitive (C) sensors. Single-chip channel fusion can be an effective solution, while …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 702 – 715
Year of Publication: 2024
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2023.3344587
Publisher: IEEE

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