Resistance

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A 3-nm FinFET 563-kbit 35.5-Mbit/mm2 Dual-Rail SRAM With 3.89-pJ/Access High Energy Efficient and 27.5-μW/Mbit One-Cycle Latency Low-Leakage Mode

A 3-nm FinFET 563-kbit 35.5-Mbit/mm2 Dual-Rail SRAM With 3.89-pJ/Access High Energy Efficient and 27.5-μW/Mbit One-Cycle Latency Low-Leakage Mode 150 150
Author(s): Yumito Aoyagi, Koji Nii, Makoto Yabuuchi, Tomotaka Tanaka, Kazuto Mizutani, Masaya Hamada, Yuichiro Ishii, Yen Chi Chou, Jun Cheng Liu, Chien-Yu Huang, Kang-Hui Peng, Yu-Hao Hsu, Isabel Wang, Hong-Chen Cheng, Hung-Jen Liao, Tsung-Yung Jonathan Chang

Abstract:

This article presents a high-density (HD) 6T SRAM macro designed in 3-nm FinFET technology with an extended dual-rail (XDR) architecture, addressing active energy and leakage for mobile applications. Two key innovations are introduced: the delayed-wordline in write operation (DEWL) technique and a one-cycle latency low-leakage access mode (1-CLM). The XDR …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 11
Year of Publication: 2025
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2025.3639747
Publisher: IEEE

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Integrated Spatiotemporal Multiscale-Multiphysics-Uncertainty Simulation for Controlling Variability in RRAM Devices

Integrated Spatiotemporal Multiscale-Multiphysics-Uncertainty Simulation for Controlling Variability in RRAM Devices 150 150
Author(s): Ziyan Liao, Zhiheng Huang, Min Xiao, Yuezhong Meng, Hui Yan, Yang Liu

Abstract:

Resistive random access memory (RRAM) is a leading candidate for next-generation nonvolatile memory and neuromorphic computing. However, its performance is limited by inherent switching variability and uncertainties in spatiotemporal multiscale materials and processes. This study integrates multiphysics and multiscale modeling with uncertainty quantification (UQ) to systematically address these limitations and …

Published in: IEEE Journal on Exploratory Solid-State Computational Devices and Circuits
Page(s): 1 – 1
Year of Publication: 2025
Electronic ISSN: 2329-9231
DOI: 10.1109/JXCDC.2025.3633067
Publisher: IEEE

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A 37.8 Mb/mm² SRAM in Intel 18A Technology Featuring a Resistive Supply-Line Write Scheme and Write-Assist With Parallel Boost Injection

A 37.8 Mb/mm² SRAM in Intel 18A Technology Featuring a Resistive Supply-Line Write Scheme and Write-Assist With Parallel Boost Injection 150 150
Author(s): Harold Pilo, Manish Arora, Chien-An Lai, Mike Lee, Zack Lo, Mayur Randeria

Abstract:

A high-density (HD), SRAM-based register file (RF) has been demonstrated in Intel 18A Technology (Wang et al., 2025 and Pilo et al., 2025) featuring RibbonFET GAA transistors and a back side power delivery network (BSDPN). The RF is optimized for HD and array efficiency and achieves a density of 37.8 Mb/mm2, the …

Published in: IEEE Solid-State Circuits Letters
Page(s): 357 – 360
Year of Publication: 2025
Electronic ISSN: 2573-9603
DOI: 10.1109/LSSC.2025.3628176
Publisher: IEEE

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Comprehensive Device to System Co-Design for SOT-MRAM at the 7 nm Node

Comprehensive Device to System Co-Design for SOT-MRAM at the 7 nm Node 150 150
Author(s): Piyush Kumar, Da Eun Shim, Azad Naeemi

Abstract:

This work presents a comprehensive spin-orbit torque (SOT)-based magnetic random access memory (MRAM) design at the 7 nm technology node, spanning from device-level characteristics to system-level power performance area (PPA). At the device level, we show the tradeoffs among the write current, error rate, and time, based on mircomagnetic simulations. …

Published in: IEEE Journal on Exploratory Solid-State Computational Devices and Circuits
Page(s): 139 – 147
Year of Publication: 2025
Electronic ISSN: 2329-9231
DOI: 10.1109/JXCDC.2025.3621279
Publisher: IEEE

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Non-Volatile ReRAM-Based Compact Event-Triggered Counters

Non-Volatile ReRAM-Based Compact Event-Triggered Counters 150 150
Author(s): Moin Diwan, Shengchao Zhang, Zidu Li, Alex James, Bhaskar Choubey

Abstract:

With an increasing number of transistors per circuit, the fabrication cost and the energy consumption of each integrated circuits increase exponentially, which drives the need to reduce the number of transistors. In this study, we explore a novel design for a 16-bit digital counter that utilizes a combination of complementary …

Published in: IEEE Journal on Exploratory Solid-State Computational Devices and Circuits
Page(s): 131 – 138
Year of Publication: 2025
Electronic ISSN: 2329-9231
DOI: 10.1109/JXCDC.2025.3619415
Publisher: IEEE

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High-Entropy Analog-Based Strong Physical Unclonable Function With Area-to-Entropy-ratio of 166 F2/bit

High-Entropy Analog-Based Strong Physical Unclonable Function With Area-to-Entropy-ratio of 166 F2/bit 150 150
Author(s): Alessandro Catania, Sebastiano Strangio, Maksym Paliy, Christian Sbrana, Michele Bertozzi, Giuseppe Iannaccone

Abstract:

In this letter, we present a high-entropy strong physically unclonable function (PUF) utilizing weak-inversion current mirrors implemented in a standard 65-nm CMOS technology. Each response bit of the proposed PUF relies on the threshold voltage differences of minimum-sized transistors arranged in a $32\times 32$ matrix. The analog operating principle enables encoding …

Published in: IEEE Solid-State Circuits Letters
Page(s): 309 – 312
Year of Publication: 2025
Electronic ISSN: 2573-9603
DOI: 10.1109/LSSC.2025.3616263
Publisher: IEEE

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A 180-nm Voltage-Controlled Magneto-Electric RAM With Sub-1-ns Switching Time

A 180-nm Voltage-Controlled Magneto-Electric RAM With Sub-1-ns Switching Time 150 150
Author(s): Haris Suhail, Haoran He, Vinod Kurian Jacob, Jiyue Yang, Kang L. Wang, Sudhakar Pamarti

Abstract:

Memory performance has emerged as a critical factor influencing both system speed and energy efficiency. However, conventional memory technologies such as embedded Flash (eFlash) and static RAM (SRAM) encounter significant scalability limitations beyond the 28-nm CMOS node. Among novel emerging memory technologies, spin-transfer-torque magnetic RAM (STT-MRAM) has gained prominence due …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 11
Year of Publication: 2025
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2025.3609342
Publisher: IEEE

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Reference-Load Sharing Scheme: An Area- and Energy-Efficient Nonvolatile Register Design Using MTJ Devices

Reference-Load Sharing Scheme: An Area- and Energy-Efficient Nonvolatile Register Design Using MTJ Devices 150 150
Author(s): Masanori Natsui, Tomoo Yoshida, Takahiro Hanyu

Abstract:

This article proposes a circuit configuration for an area- and energy-efficient nonvolatile register using magnetic tunnel junction (MTJ) devices, suitable for persistent computation in intermittent computing environments. The proposed configuration, named the reference-load sharing scheme (RLSS), stores 1 bit of information using the resistance of a dedicated MTJ device and a …

Published in: IEEE Journal on Exploratory Solid-State Computational Devices and Circuits
Page(s): 90 – 98
Year of Publication: 2025
Electronic ISSN: 2329-9231
DOI: 10.1109/JXCDC.2025.3611365
Publisher: IEEE

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A Passive and Scalable High-Order Neuromorphic Circuit Enabled by Mott Memristors

A Passive and Scalable High-Order Neuromorphic Circuit Enabled by Mott Memristors 150 150
Author(s): Zikang Lin, Xiaohui Wu, Shujing Zhao, Weihua Liu, Xin Li, Li Geng, Chuanyu Han

Abstract:

In this study, VO2 Mott memristors have been successfully fabricated, leading to the proposal of a passive and scalable high-order neural circuit. This circuit consists of two coupled VO2 Mott memristors, two resistors, and three capacitors. The proposed high-order neural circuit demonstrates 11 distinct firing behaviors similar to those of biological …

Published in: IEEE Journal on Exploratory Solid-State Computational Devices and Circuits
Page(s): 60 – 66
Year of Publication: 2025
Electronic ISSN: 2329-9231
DOI: 10.1109/JXCDC.2025.3573709
Publisher: IEEE

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