kNOT: A 2-D Distributed Network-on-Textile Architecture With Direct Die-to-Yarn Integration of 0.6 × 2.15 mm2 SoC and bySPI Chiplets for Wearable Computing https://sscs.ieee.org/wp-content/themes/movedo/images/empty/thumbnail.jpg 150 150 https://secure.gravatar.com/avatar/8fcdccb598784519a6037b6f80b02dee03caa773fc8d223c13bfce179d70f915?s=96&d=mm&r=g
Abstract:
This article presents kNOT, a scalable, distributed, and 2-D Network-On-Textile (kNOT) comprising miniaturized systems on chip (SoCs) and bypass SPI (bySPI) networking chiplets that together enable diverse networking and computational tasks. To preserve garment comfort and flexibility, kNOT eliminates bulky boards and interposers through direct-die attachment to embroidered yarns. The …