Metals

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A Logic-Compatible 2-Transistor Embedded Bipolar RRAM MACRO: A 28-nm Multiple-Time Programmable (MTP) Memory Without Extra Masks

A Logic-Compatible 2-Transistor Embedded Bipolar RRAM MACRO: A 28-nm Multiple-Time Programmable (MTP) Memory Without Extra Masks 150 150
Author(s): Yi Xiang Huang, Y. S. Lin, P. S. Huang, E. Ray Hsieh

Abstract:

This letter presents a 2-transistor (2T) bipolar embedded resistive RAM (eRRAM) MACRO fabricated in a 28-nm high-k metal gate (HKMG) process for multitime programmable (MTP) applications. To overcome the scaling bottlenecks of traditional embedded Flash, this work utilizes an extra-mask-free, pure front-end-of-line (FEOL) integration, offering a robust solution for automotive …

Published in: IEEE Solid-State Circuits Letters
Page(s): 117 – 120
Year of Publication: 2026
Electronic ISSN: 2573-9603
DOI: 10.1109/LSSC.2026.3675063
Publisher: IEEE

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A 70-GHz Bandwidth Amplifier With Integrated Differential Bridged T-coil Peaking and Uniform Group Delay

A 70-GHz Bandwidth Amplifier With Integrated Differential Bridged T-coil Peaking and Uniform Group Delay 150 150
Author(s): Giovanni Scarlato, John R. Long

Abstract:

A two-stage amplifier in 22-nm FD-SOI CMOS integrates a fully-differential bridged T-coil for the first time. Circuit performance is benchmarked against an identical amplifier topology designed with single-ended T-coils (pseudo-differential) and an unpeaked reference. It realizes 70-GHz bandwidth with $12~\pm ~2$ -ps group delay and >10-dB return loss across 90 GHz. Bandwidth …

Published in: IEEE Solid-State Circuits Letters
Page(s): 65 – 68
Year of Publication: 2026
Electronic ISSN: 2573-9603
DOI: 10.1109/LSSC.2026.3661366
Publisher: IEEE

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Inverse Design of Multilayered Pixelated mm-Wave Power Amplifiers

Inverse Design of Multilayered Pixelated mm-Wave Power Amplifiers 150 150
Author(s): Vinay Chenna, Hossein Hashemi

Abstract:

A topology optimization methodology is presented for the design of multistage, multipath, linear and nonlinear millimeter-wave (mm-Wave) power amplifiers (PAs). Optimization algorithms autonomously generate complete multilayered PA core layouts, including actives and passives, with minimal human intervention in just a few days. Experimental results from fabricated linear and nonlinear W-band …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 12
Year of Publication: 2026
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2026.3656334
Publisher: IEEE

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A 37.8 Mb/mm² SRAM in Intel 18A Technology Featuring a Resistive Supply-Line Write Scheme and Write-Assist With Parallel Boost Injection

A 37.8 Mb/mm² SRAM in Intel 18A Technology Featuring a Resistive Supply-Line Write Scheme and Write-Assist With Parallel Boost Injection 150 150
Author(s): Harold Pilo, Manish Arora, Chien-An Lai, Mike Lee, Zack Lo, Mayur Randeria

Abstract:

A high-density (HD), SRAM-based register file (RF) has been demonstrated in Intel 18A Technology (Wang et al., 2025 and Pilo et al., 2025) featuring RibbonFET GAA transistors and a back side power delivery network (BSDPN). The RF is optimized for HD and array efficiency and achieves a density of 37.8 Mb/mm2, the …

Published in: IEEE Solid-State Circuits Letters
Page(s): 357 – 360
Year of Publication: 2025
Electronic ISSN: 2573-9603
DOI: 10.1109/LSSC.2025.3628176
Publisher: IEEE

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Comprehensive Device to System Co-Design for SOT-MRAM at the 7 nm Node

Comprehensive Device to System Co-Design for SOT-MRAM at the 7 nm Node 150 150
Author(s): Piyush Kumar, Da Eun Shim, Azad Naeemi

Abstract:

This work presents a comprehensive spin-orbit torque (SOT)-based magnetic random access memory (MRAM) design at the 7 nm technology node, spanning from device-level characteristics to system-level power performance area (PPA). At the device level, we show the tradeoffs among the write current, error rate, and time, based on mircomagnetic simulations. …

Published in: IEEE Journal on Exploratory Solid-State Computational Devices and Circuits
Page(s): 139 – 147
Year of Publication: 2025
Electronic ISSN: 2329-9231
DOI: 10.1109/JXCDC.2025.3621279
Publisher: IEEE

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Beyond Backside Power: Backside Signal Routing as Technology Booster for Standard-Cell Scaling

Beyond Backside Power: Backside Signal Routing as Technology Booster for Standard-Cell Scaling 150 150
Author(s): Anup Ashok Kedilaya, Sirish Oruganti, Nishant Gupta, Xiuhao Zhang, Ilya Karpov, Mark A. Anders, Jaydeep P. Kulkarni

Abstract:

Advances in process technology enabling backside metals (BSMs) and contacts offer new design–technology co-optimization (DTCO) opportunities to further enhance power, performance, and area gains (PPA) in sub-3-nm nodes. This work exploits backside (BS) contact technology within standard cells to extend both signal and clock routing to BSM layers, …

Published in: IEEE Journal on Exploratory Solid-State Computational Devices and Circuits
Page(s): 107 – 115
Year of Publication: 2025
Electronic ISSN: 2329-9231
DOI: 10.1109/JXCDC.2025.3617784
Publisher: IEEE

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3-D Stacked HBM and Compute Accelerators for LLM: Optimizing Thermal Management and Power Delivery Efficiency

3-D Stacked HBM and Compute Accelerators for LLM: Optimizing Thermal Management and Power Delivery Efficiency 150 150
Author(s): Janak Sharda, Madison Manley, Jungyoun Kwak, Chinsung Park, Muhannad Bakir, Shimeng Yu

Abstract:

Advanced packaging is becoming essential for designing hardware accelerators for large language models (LLMs). Different architectures, such as 2.5-D integration of memory with logic, have been proposed; however, the bandwidth limits the throughput of the complete system. Recent works have proposed memory on logic systems, where high bandwidth memory (HBM) …

Published in: IEEE Journal on Exploratory Solid-State Computational Devices and Circuits
Page(s): 116 – 122
Year of Publication: 2025
Electronic ISSN: 2329-9231
DOI: 10.1109/JXCDC.2025.3617298
Publisher: IEEE

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Two 7–13-GHz GaAs-SiGe Four–Channel Beamforming Chiplets With/Without Metallic Interlayer Shields

Two 7–13-GHz GaAs-SiGe Four–Channel Beamforming Chiplets With/Without Metallic Interlayer Shields 150 150
Author(s): Nengxu Zhu, Yiting Zhang, Genyin Ma, Fanyi Meng

Abstract:

This letter presents two 7–13-GHz GaAs-SiGe four-channel beamforming chiplets to minimize the chip area. The chips integrate GaAs-based power amplifiers (PAs) and low-noise amplifiers (LNAs) with silicon-based phase and amplitude control modules using gold bumps. To mitigate coupling between the metal patterns of the heterogeneous chips and avoid interference with …

Published in: IEEE Solid-State Circuits Letters
Page(s): 161 – 164
Year of Publication: 2025
Electronic ISSN: 2573-9603
DOI: 10.1109/LSSC.2025.3573757
Publisher: IEEE

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