Logic

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An Approximate Digital CIM Macro With Low-Power Multiply-Add Units and Dynamic Sparse-Adaptive Configuring for Edge AI Inference

An Approximate Digital CIM Macro With Low-Power Multiply-Add Units and Dynamic Sparse-Adaptive Configuring for Edge AI Inference 150 150
Author(s): Xiaofeng Li, Yi Zhan, Purui Zhu, Rui Zhou, Jiayin Song, Heng You, Yumei Zhou, Shushan Qiao

Abstract:

This paper presents an approximate digital compute-in-memory (CIM) macro for low-power edge AI inference. It introduces three hierarchical innovations: 1) novel fused approximate multiply-add units (FAMUs) that reduces power and area consumption; 2) a bit-critical weight allocation architecture that optimally balances accuracy and hardware cost; and 3) a dynamic sparsity-adaptive configuration method to …

Published in: IEEE Solid-State Circuits Letters
Page(s): 1 – 1
Year of Publication: 2026
Electronic ISSN: 2573-9603
DOI: 10.1109/LSSC.2026.3652570
Publisher: IEEE

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A 3-nm FinFET 563-kbit 35.5-Mbit/mm2 Dual-Rail SRAM With 3.89-pJ/Access High Energy Efficient and 27.5-μW/Mbit One-Cycle Latency Low-Leakage Mode

A 3-nm FinFET 563-kbit 35.5-Mbit/mm2 Dual-Rail SRAM With 3.89-pJ/Access High Energy Efficient and 27.5-μW/Mbit One-Cycle Latency Low-Leakage Mode 150 150
Author(s): Yumito Aoyagi, Koji Nii, Makoto Yabuuchi, Tomotaka Tanaka, Kazuto Mizutani, Masaya Hamada, Yuichiro Ishii, Yen Chi Chou, Jun Cheng Liu, Chien-Yu Huang, Kang-Hui Peng, Yu-Hao Hsu, Isabel Wang, Hong-Chen Cheng, Hung-Jen Liao, Tsung-Yung Jonathan Chang

Abstract:

This article presents a high-density (HD) 6T SRAM macro designed in 3-nm FinFET technology with an extended dual-rail (XDR) architecture, addressing active energy and leakage for mobile applications. Two key innovations are introduced: the delayed-wordline in write operation (DEWL) technique and a one-cycle latency low-leakage access mode (1-CLM). The XDR …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 11
Year of Publication: 2025
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2025.3639747
Publisher: IEEE

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A 500 MS/s Robust 2b/cycle Pipelined-SAR ADC Achieving 64.6-dB SNDR and 82.6-dB SFDR With Linearity Enhancement Techniques

A 500 MS/s Robust 2b/cycle Pipelined-SAR ADC Achieving 64.6-dB SNDR and 82.6-dB SFDR With Linearity Enhancement Techniques 150 150
Author(s): Qiang Yu, Zheng Zhu, Lulu Zhang, Qin Huang, Yao Feng, Chao Liang, Biao Hu, Ling Du, Rongbin Yang, Shuangyi Wu, Qiang Li

Abstract:

This letter presents a 14-bit 500-MS/s 3-stage pipelined successive approximation register (SAR) analog-to-digital converter (ADC). By exploiting robust 2b/cycle SAR ADCs, this ADC incorporates significant voltage and time redundancy. High SFDR is achieved through several linearity enhancement techniques. First, a DAC splitting technique addresses the common-mode voltage matching …

Published in: IEEE Solid-State Circuits Letters
Page(s): 9 – 12
Year of Publication: 2026
Electronic ISSN: 2573-9603
DOI: 10.1109/LSSC.2025.3639322
Publisher: IEEE

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A High-Speed D-FF and a 11-Bit Up-Down Counter Using Unipolar Oxide TFTs on a Flexible Foil

A High-Speed D-FF and a 11-Bit Up-Down Counter Using Unipolar Oxide TFTs on a Flexible Foil 150 150
Author(s): Suyash Shrivastava, Pydi Ganga Bahubalindruni

Abstract:

This manuscript presents an experimental characterization of a novel high speed D flip-flop (D-FF). The circuit was fabricated on a $27\mu $ m thick flexible polyimide substrate using a nMOS only, single gate amorphous Indium-Gallium-Zinc-Oxide (a-IGZO) thin-film transistor (TFT) technology. Reliable response of the D-FF was noticed from measurements up to …

Published in: IEEE Solid-State Circuits Letters
Page(s): 373 – 376
Year of Publication: 2025
Electronic ISSN: 2573-9603
DOI: 10.1109/LSSC.2025.3636192
Publisher: IEEE

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Energy-Efficient Logic-in-Memory and Neuromorphic Computing in Raised Source and Drain MOSFETs

Energy-Efficient Logic-in-Memory and Neuromorphic Computing in Raised Source and Drain MOSFETs 150 150
Author(s): Md. Hasan Raza Ansari, Bashayr Alqahtani, Naveen Kumar, Vihar Georgiev, Nazek El-Atab

Abstract:

This work highlights the potential application of raised source and drain (RSD) MOSFETs-based charge trapping memory (CTM) for next-generation computing applications. This simulation study presents a double-gate (DG)-RSD MOSFET technology with a short gate length (50 nm) to significantly improve the performance of logic-in-memory (LIM) and neuromorphic computing (NC) systems. …

Published in: IEEE Journal on Exploratory Solid-State Computational Devices and Circuits
Page(s): 197 – 204
Year of Publication: 2025
Electronic ISSN: 2329-9231
DOI: 10.1109/JXCDC.2025.3630217
Publisher: IEEE

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DPe-CIM: A 4T-1C Dual-Port eDRAM-Based Compute-in-Memory for Simultaneous Computing and Refresh With Adaptive Refresh and Data Conversion Reduction Scheme

DPe-CIM: A 4T-1C Dual-Port eDRAM-Based Compute-in-Memory for Simultaneous Computing and Refresh With Adaptive Refresh and Data Conversion Reduction Scheme 150 150
Author(s): Do Han Kim, Minyoung Jo, Gi Seok Kim, Dong Gyun Ha, Ung Bin Oh, Donghan Ko, Jiwoo Lee, Mingu Kang, Seong-Ook Jung

Abstract:

This article presents DPe-CIM, a 4T-1C dual-port embedded dynamic random access memory (eDRAM)-based compute-in-memory (CIM) macro with adaptive refresh and data conversion reduction. DPe-CIM proposes four key features that improve area and energy efficiency: 1) dual-port eDRAM cell (DPC) separates the multiply-and-accumulate (MAC) and refresh ports, enabling simultaneous MAC …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 13
Year of Publication: 2025
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2025.3623117
Publisher: IEEE

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A 0.8-μm 32-Mpixel Always-On CMOS Image Sensor With Windmill-Pattern Edge Extraction and On-Chip DNN

A 0.8-μm 32-Mpixel Always-On CMOS Image Sensor With Windmill-Pattern Edge Extraction and On-Chip DNN 150 150
Author(s): Mamoru Sato, Sachio Akebono, Kazuyoshi Yasuoka, Eriko Kato, Masahiro Tsuruta, Chiaki Takano, Kensuke Ota, Kazuki Haraguchi, Masahiro Watanabe, Genki Fujii, Koichiro Yamanaka, Kazunori Yasuda, Satoshi Minami, Katsuhiko Hanzawa, Kohei Matsuda, Akihiko Kato, Yosuke Ueno

Abstract:

This letter presents a CMOS image sensor (CIS) that integrates two operation modes: 1) a high-resolution viewing mode with $0.8~\mu $ m 32 Mpixels and 2) a low-power always-on object recognition mode consuming 2.67 mW at 10 frames/s. The CIS features a unique windmill-pattern analog edge extraction circuit that is resilient to illumination variations. An …

Published in: IEEE Solid-State Circuits Letters
Page(s): 353 – 356
Year of Publication: 2025
Electronic ISSN: 2573-9603
DOI: 10.1109/LSSC.2025.3628314
Publisher: IEEE

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A RISC-V SoC With Reconfigurable Custom Instructions on a Synthesized eFPGA Fabric in 22nm FinFET

A RISC-V SoC With Reconfigurable Custom Instructions on a Synthesized eFPGA Fabric in 22nm FinFET 150 150
Author(s): Prashanth Mohan, Siddharth Das, Ken Mai

Abstract:

This letter presents a flexible and energy-efficient RISC-V system-on-chip (SoC) in 22nm FinFET technology, achieving state-of-the-art performance by tightly integrating the CPU with a synthesized embedded FPGA (embedded field programmable gate array (eFPGA)), enabling the implementation of reconfigurable custom instructions. The tight integration of the eFPGA with SoC scratchpad memory …

Published in: IEEE Solid-State Circuits Letters
Page(s): 321 – 324
Year of Publication: 2025
Electronic ISSN: 2573-9603
DOI: 10.1109/LSSC.2025.3618942
Publisher: IEEE

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3-D Stacked HBM and Compute Accelerators for LLM: Optimizing Thermal Management and Power Delivery Efficiency

3-D Stacked HBM and Compute Accelerators for LLM: Optimizing Thermal Management and Power Delivery Efficiency 150 150
Author(s): Janak Sharda, Madison Manley, Jungyoun Kwak, Chinsung Park, Muhannad Bakir, Shimeng Yu

Abstract:

Advanced packaging is becoming essential for designing hardware accelerators for large language models (LLMs). Different architectures, such as 2.5-D integration of memory with logic, have been proposed; however, the bandwidth limits the throughput of the complete system. Recent works have proposed memory on logic systems, where high bandwidth memory (HBM) …

Published in: IEEE Journal on Exploratory Solid-State Computational Devices and Circuits
Page(s): 116 – 122
Year of Publication: 2025
Electronic ISSN: 2329-9231
DOI: 10.1109/JXCDC.2025.3617298
Publisher: IEEE

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