Logic circuits

Comparative Analysis of Sense Amplifier Circuits for Hybrid CMOS-MTJ CIM Architecture

Comparative Analysis of Sense Amplifier Circuits for Hybrid CMOS-MTJ CIM Architecture 150 150

Abstract:

Spin-transfer torque magnetic tunnel junction (STT-MTJ) is widely recognized as a promising device for computation-in-memory (CIM) architecture due to its advantages, such as simple nonvolatile structure, CMOS compatibility, and scalability. In spite of the advantages, achieving reliable and efficient sensing of STT-MTJ remains a design challenge. This work presents a …

View on IEEE Xplore

OISMA: On-the-Fly In-Memory Stochastic Multiplication Architecture for Approximate Matrix Multiplication

OISMA: On-the-Fly In-Memory Stochastic Multiplication Architecture for Approximate Matrix Multiplication 150 150

Abstract:

Artificial intelligence (AI) models are currently driven by a significant upscaling of their complexity, with massive matrix-multiplication workloads representing the major computational bottleneck. In-memory computing (IMC) architectures are proposed to avoid the von Neumann bottleneck. However, both digital/binary-based and analog IMC architectures suffer from various limitations, which significantly degrade …

View on IEEE Xplore

A 28-nm System-in-One-Macro Computing-in-Memory Chip Utilizing Leakage-Eliminated 2T1C and Capacitor-Over-Logic 1T1C eDRAM

A 28-nm System-in-One-Macro Computing-in-Memory Chip Utilizing Leakage-Eliminated 2T1C and Capacitor-Over-Logic 1T1C eDRAM 150 150

Abstract:

Computing-in-memory (CIM) is a promising paradigm for energy- and area-efficient implementation of the heavy general matrix multiplication (GEMM) operations, especially in the evolving deep learning algorithms. Though existing CIM macros have demonstrated remarkable energy/area efficiency, the corresponding metrics of the system-level CIM chips degrade due to the peripheral components, …

View on IEEE Xplore

Self-Enabled Write Assist Cells for High-Density SRAM in Resistance-Dominated Technology Node

Self-Enabled Write Assist Cells for High-Density SRAM in Resistance-Dominated Technology Node 150 150

Abstract:

As technology scaling increases interconnect resistance, writeability degradation in static random access memory (SRAM) becomes critical. This article presents a self-enabled write assist cell (SEWAC) that mitigates writeability degradation caused by increased bitline resistance (R ${}_{\mathrm {BL}}$ ) without requiring timing control. The SEWAC has a cell-compatible layout with the standard 6…

View on IEEE Xplore