A Three-Level Dual-Path Hybrid Buck Converter With Mitigated Capacitive Current and Seamless DVS Across a Wide Output Voltage Range https://sscs.ieee.org/wp-content/themes/movedo/images/empty/thumbnail.jpg 150 150 https://secure.gravatar.com/avatar/8fcdccb598784519a6037b6f80b02dee03caa773fc8d223c13bfce179d70f915?s=96&d=mm&r=g
Abstract:
This article presents a three-level dual-path (TLDP) buck converter tailored for mobile application processors (APs) with a 1.8-V input and 0.4–1.5-V output range. Conventional buck (CB) and multi-level buck (MLB) converters suffer from prohibitive DC resistance ( $R_{\mathrm {DCR}}$ ) losses in compact inductors as load current increases. Although various multi-path …