Hardware acceleration

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A 3-D HBI Compliant 1.536 TB/s/mm2 Bandwidth Scalable Attention Accelerator With 22.5-GOPS Throughput High Speed SoftMax for Quantized Transformers in Intel 3

A 3-D HBI Compliant 1.536 TB/s/mm2 Bandwidth Scalable Attention Accelerator With 22.5-GOPS Throughput High Speed SoftMax for Quantized Transformers in Intel 3 150 150
Author(s): Prerna Budhkar, Mirco Sciulli, Srivatsa Rangachar Srinivasa, Gauthaman Murali, Ragh Kuttappa, Paolo Aseron, Trang Nguyen, Vinayak Honkote, Tanay Karnik

Abstract:

This letter presents a novel hardware accelerator compatible with <3- $\mu $ m pitch 3-D Cu-Cu hybrid bonding interconnect (HBI) technology, particularly designed to efficiently execute multihead attention (MHA) of encoder transformer models. We present an accelerator that addresses performance losses due to low precision models by incorporating specialized hardware optimizations …

Published in: IEEE Solid-State Circuits Letters
Page(s): 69 – 72
Year of Publication: 2026
Electronic ISSN: 2573-9603
DOI: 10.1109/LSSC.2026.3659575
Publisher: IEEE

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SiWB: A 28-nm 800-MHz 4.2-to-14.2-Gb/s/W Configurable Multi-Core Architecture for White-Box Block Cipher With Area-Efficient Random Linear Transformation and Load-Aware Inter-Core Scheduling

SiWB: A 28-nm 800-MHz 4.2-to-14.2-Gb/s/W Configurable Multi-Core Architecture for White-Box Block Cipher With Area-Efficient Random Linear Transformation and Load-Aware Inter-Core Scheduling 150 150
Author(s): Xiangren Chen, Bohan Yang, Wenping Zhu, Hanning Wang, Jinjiang Yang, Min Zhu, Aoyang Zhang, Leibo Liu

Abstract:

White-box cryptography (WBC) seeks to protect secret keys (SKs) even under the white-box security model that features adversaries having full control of the execution environment. Due to the ever-growing demand for content protection under security-critical scenarios, the recent progress on WBC has been nothing short of spectacular. However, the security-prioritized …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 15
Year of Publication: 2026
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2025.3649035
Publisher: IEEE

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