Fabrics

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kNOT: A 2-D Distributed Network-on-Textile Architecture With Direct Die-to-Yarn Integration of 0.6 × 2.15 mm2 SoC and bySPI Chiplets for Wearable Computing

kNOT: A 2-D Distributed Network-on-Textile Architecture With Direct Die-to-Yarn Integration of 0.6 × 2.15 mm2 SoC and bySPI Chiplets for Wearable Computing 150 150
Author(s): Anjali Agrawal, Zhenghong Chen, Braden E. Desman, Jinhua Wang, Akiyoshi Tanaka, Fahim Foysal, Charles D. Hess, Will Farrell, Jim Owens, Daniel S. Truesdell, Benton H. Calhoun

Abstract:

This article presents kNOT, a scalable, distributed, and 2-D Network-On-Textile (kNOT) comprising miniaturized systems on chip (SoCs) and bypass SPI (bySPI) networking chiplets that together enable diverse networking and computational tasks. To preserve garment comfort and flexibility, kNOT eliminates bulky boards and interposers through direct-die attachment to embroidered yarns. The …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 103 – 115
Year of Publication: 2026
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2025.3624099
Publisher: IEEE

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SHINSAI: A 586 mm2 Reusable Active TSV Interposer With Programmable Interconnect Fabric and 512 Mb Underdeck Memory

SHINSAI: A 586 mm2 Reusable Active TSV Interposer With Programmable Interconnect Fabric and 512 Mb Underdeck Memory 150 150
Author(s): Haozhe Zhu, Bo Jiao, Yuman Zeng, Yongjiang Li, Jie Liao, Siyao Jia, Zexing Chen, Liyu Lin, Xuanda Lin, Suchang Huang, Mochen Tian, Jundong Zhu, Dexin Wen, Yan Wang, Yu Wang, Jian Xu, Feng Wang, Jun Tao, Chixiao Chen, Qi Liu, Ming Liu

Abstract:

This article presents SHINSAI—a 586 mm2 reusable active through-silicon via (TSV) interposer addressing key challenges in multi-chiplet integration (MCI) architectures. While active interposers overcome fundamental limitations of passive counterparts by integrating functional circuitry, existing solutions face three critical constraints: 1) non-recurring engineering (NRE) costs from application-specific interposers negating chiplet reuse benefits; 2) …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 90 – 102
Year of Publication: 2026
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2025.3623630
Publisher: IEEE

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A RISC-V SoC With Reconfigurable Custom Instructions on a Synthesized eFPGA Fabric in 22nm FinFET

A RISC-V SoC With Reconfigurable Custom Instructions on a Synthesized eFPGA Fabric in 22nm FinFET 150 150
Author(s): Prashanth Mohan, Siddharth Das, Ken Mai

Abstract:

This letter presents a flexible and energy-efficient RISC-V system-on-chip (SoC) in 22nm FinFET technology, achieving state-of-the-art performance by tightly integrating the CPU with a synthesized embedded FPGA (embedded field programmable gate array (eFPGA)), enabling the implementation of reconfigurable custom instructions. The tight integration of the eFPGA with SoC scratchpad memory …

Published in: IEEE Solid-State Circuits Letters
Page(s): 321 – 324
Year of Publication: 2025
Electronic ISSN: 2573-9603
DOI: 10.1109/LSSC.2025.3618942
Publisher: IEEE

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