Energy consumption

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Antiferromagnetic Programmable Neuron: Structure, Training, and Pattern Recognition Applications

Antiferromagnetic Programmable Neuron: Structure, Training, and Pattern Recognition Applications 150 150
Author(s): I. Sotnyk, O. Prokopenko

Abstract:

Artificial neurons based on antiferromagnetic (AFM) spin Hall oscillators (SHOs) are promising elements for creating ultra-fast, energy-efficient neuromorphic computing systems. These structures can generate picosecond spikes in response to dc and ac electric currents, thereby mimicking the reaction of biological neurons to an external stimuli. However, conventional AFM neurons have …

Published in: IEEE Journal on Exploratory Solid-State Computational Devices and Circuits
Page(s): 1 – 1
Year of Publication: 2025
Electronic ISSN: 2329-9231
DOI: 10.1109/JXCDC.2025.3633490
Publisher: IEEE

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A 29-Gb/mm2 1-Tb 3-b/Cell 3-D Flash Memory With CMOS Direct Bonded Array (CBA) Technology

A 29-Gb/mm2 1-Tb 3-b/Cell 3-D Flash Memory With CMOS Direct Bonded Array (CBA) Technology 150 150
Author(s): Kosuke Yanagidaira, Mario Sako, Yasuhiro Hirashima, Yumi Higashi, Yutaka Shimizu, Takeshi Nakano, Yusuke Ochi, Hiroaki Yamada, Nobushi Matsuura, Akihiro Imamoto, Kazuaki Kawaguchi, Koji Tabata, Hiroaki Hoshino, Takeshi Hioka, Shigehito Saigusa, Hiroki Date, Masaki Unno, Jumpei Sato, You Kamata, Takahiro Shimizu, Akio Sugahara, Taira Shibuya, Atsushi Okuyama, Junji Yamada, Takatoshi Minamoto, Hardwell Chibvongodze, Naoki Ojima, Hiroshi Sugawara, Masahiro Kano, Jang-Woo Lee, Hiroyuki Mizukoshi, Ryuji Yamashita, Kensaku Abe, Naohito Morozumi, In-Soo Yoon, Takuya Ariki, Jong Hak Yuh, Khin Htoo, Yosuke Kato, Yoshihiro Oyama, Yen-Lung Jason Li, Yoshihisa Watanabe, Toshiyuki Kouchi, Koji Hosono

Abstract:

This article reports a 1-Tb 3-b/cell 3-D flash memory fabricated with CMOS direct bonded array (CBA) technology. Compaction of circuits and wires achieves the highest bit density in the world over 29 Gb/mm2 with 332-word line (WL) layers. The bit density is improved by 71% from a previous generation despite …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 237 – 249
Year of Publication: 2026
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2025.3617579
Publisher: IEEE

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A Microscaling Multi-Mode Gain-Cell Computing-in-Memory Macro for Advanced AI Edge Device

A Microscaling Multi-Mode Gain-Cell Computing-in-Memory Macro for Advanced AI Edge Device 150 150
Author(s): Jen-Chun Tien, Ping-Chun Wu, Win-San Khwa, Ashwin Sanjay Lele, Jian-Wei Su, Chiao-Yen Cheng, Jun-Ming Hsu, Yu-Chen Chen, Le-Jung Hsieh, Jyun-Cheng Bai, Yu-Sheng Kao, Tsung-Han Lou, Jui-Jen Wu, Chung-Chuan Lo, Ren-Shuo Liu, Chih-Cheng Hsieh, Kea-Tiong Tang, Meng-Fan Chang

Abstract:

The microscaling (MX) format is an emerging data representation that quantizes high-bitwidth floating-point (FP) values into low-bitwidth FP-like values with a shared-scale (SS) exponent. When implemented with computing-in-memory (CIM), MX allows an attractive tradeoff between accuracy and hardware efficiency for specific neural network (NN) workloads. This work presents the first …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 14
Year of Publication: 2025
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2025.3617944
Publisher: IEEE

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Reference-Load Sharing Scheme: An Area- and Energy-Efficient Nonvolatile Register Design Using MTJ Devices

Reference-Load Sharing Scheme: An Area- and Energy-Efficient Nonvolatile Register Design Using MTJ Devices 150 150
Author(s): Masanori Natsui, Tomoo Yoshida, Takahiro Hanyu

Abstract:

This article proposes a circuit configuration for an area- and energy-efficient nonvolatile register using magnetic tunnel junction (MTJ) devices, suitable for persistent computation in intermittent computing environments. The proposed configuration, named the reference-load sharing scheme (RLSS), stores 1 bit of information using the resistance of a dedicated MTJ device and a …

Published in: IEEE Journal on Exploratory Solid-State Computational Devices and Circuits
Page(s): 90 – 98
Year of Publication: 2025
Electronic ISSN: 2329-9231
DOI: 10.1109/JXCDC.2025.3611365
Publisher: IEEE

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