Converters

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A Three-Level Dual-Path Hybrid Buck Converter With Mitigated Capacitive Current and Seamless DVS Across a Wide Output Voltage Range

A Three-Level Dual-Path Hybrid Buck Converter With Mitigated Capacitive Current and Seamless DVS Across a Wide Output Voltage Range 150 150
Author(s): Jae-Hyun Kim, Jun-Gi Lee, Hyunki Han, Hyun-Sik Kim

Abstract:

This article presents a three-level dual-path (TLDP) buck converter tailored for mobile application processors (APs) with a 1.8-V input and 0.4–1.5-V output range. Conventional buck (CB) and multi-level buck (MLB) converters suffer from prohibitive DC resistance ( $R_{\mathrm {DCR}}$ ) losses in compact inductors as load current increases. Although various multi-path …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 15
Year of Publication: 2026
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2026.3710310
Publisher: IEEE

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A Nesting-Connected Reconfigurable SC Converter With Fine-Grained Conversion Ratios and Increased Output Conduction Paths for On-Chip Surround Power Delivery

A Nesting-Connected Reconfigurable SC Converter With Fine-Grained Conversion Ratios and Increased Output Conduction Paths for On-Chip Surround Power Delivery 150 150
Author(s): Xuchu Mu, Yang Jiang, Xin Ming, Bo Zhang, Rui P. Martins, Pui-In Mak

Abstract:

This article presents a reconfigurable switched-capacitor (SC) DC–DC converter that achieves improved overall efficiency over a fine-grained conversion-ratio range, applicable to on-chip surround power delivery (SPD) in compact and lightweight devices. We propose a nesting-connected reconfigurable SC topology generation method, attaining fine-grained subdivision of reconfigurable voltage conversion ratios (VCRs) …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 13
Year of Publication: 2026
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2026.3702012
Publisher: IEEE

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