Computing-in-memory (CIM)

  • No Comments

APM-CIM: An Array Partition Multi-Macro CIM System With Dynamic Sparse Approximation for Neural Network Edge Applications

APM-CIM: An Array Partition Multi-Macro CIM System With Dynamic Sparse Approximation for Neural Network Edge Applications 150 150
Author(s): Bojun Zhang, Jinkai Wang, Zekun Wang, Xianan Zhu, Zhengkun Gu, Ziyuan Guo, Zhizhong Zhang, Kun Zhang, Weisheng Zhao, Yue Zhang

Abstract:

Computing-in-memory (CIM) has been widely investigated as a solution to the von Neumann bottleneck to reduce data transfer between memory and processor. However, existing CIM macros for neural network (NN) edge applications still suffer from high latency and energy consumption due to the correlation between data precision and the number …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 16
Year of Publication: 2026
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2026.3720241
Publisher: IEEE

View on IEEE Xplore

  • No Comments

A 28-nm Sign-Bit-Embedded Bit-Parallel SRAM Compute-in-Memory Macro With Stage-Wise-Enabled Transition-Counting-Lines and Accumulators for Edge-AI Devices

A 28-nm Sign-Bit-Embedded Bit-Parallel SRAM Compute-in-Memory Macro With Stage-Wise-Enabled Transition-Counting-Lines and Accumulators for Edge-AI Devices 150 150
Author(s): Yunlong Liu, Lichen Feng, Lin Wu, Dong Li, Zhangming Zhu

Abstract:

Computing-in-memory (CIM) architectures are promising for edge-AI devices, as they mitigate the von Neumann bottleneck and reduce data movement. Bit-parallel CIM macros with direct memory mapping and low toggle rate are well-suited for computing systems. However, severe routing congestion, inefficient signed computation, and unnecessary toggling of intermediate signals in local …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 14
Year of Publication: 2026
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2026.3718075
Publisher: IEEE

View on IEEE Xplore

  • No Comments

A 28-nm System-in-One-Macro Computing-in-Memory Chip Utilizing Leakage-Eliminated 2T1C and Capacitor-Over-Logic 1T1C eDRAM

A 28-nm System-in-One-Macro Computing-in-Memory Chip Utilizing Leakage-Eliminated 2T1C and Capacitor-Over-Logic 1T1C eDRAM 150 150
Author(s): Zhihang Qian, Zhaori Cong, Shengzhe Yan, Zeyu Guo, Zhuoyu Dai, Yifan He, Wenyu Sun, Chunmeng Dou, Feng Zhang, Di Geng, Jinshan Yue, Yongpan Liu, Qi Liu, Ming Liu

Abstract:

Computing-in-memory (CIM) is a promising paradigm for energy- and area-efficient implementation of the heavy general matrix multiplication (GEMM) operations, especially in the evolving deep learning algorithms. Though existing CIM macros have demonstrated remarkable energy/area efficiency, the corresponding metrics of the system-level CIM chips degrade due to the peripheral components, …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 15
Year of Publication: 2026
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2026.3684971
Publisher: IEEE

View on IEEE Xplore

  • No Comments

A 28-nm Digital Transpose SRAM Compute-in-Memory Macro With Accurate/Approximate Dual Mode for Floating-Point Edge Training and Inference

A 28-nm Digital Transpose SRAM Compute-in-Memory Macro With Accurate/Approximate Dual Mode for Floating-Point Edge Training and Inference 150 150
Author(s): Yiyang Yuan, Bingxin Zhang, Yiming Yang, Yishan Luo, Qirui Chen, Haitao Wang, Qihao Liu, Zhiming Chen, Hao Wu, Jinshan Yue, Shidong Lv, Xinghua Wang, Pui-In Mak, Xiaoran Li, Feng Zhang

Abstract:

Static random-access memory (SRAM)-based computing-in-memory (CIM) macros have been widely studied to improve the energy efficiency of edge artificial intelligence (AI) inference tasks. However, less attention has been given to AI training, which requires CIM macros to not only perform matrix multiply-accumulate (MAC) operations but also support matrix transposition. …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 13
Year of Publication: 2026
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2026.3679560
Publisher: IEEE

View on IEEE Xplore

  • No Comments

EMO-CIM: An Input/Stationary-Data Similarity-Aware Computing-In-Memory Design for Variable Vector-Wise Computation in Edge Multioperator AI Acceleration

EMO-CIM: An Input/Stationary-Data Similarity-Aware Computing-In-Memory Design for Variable Vector-Wise Computation in Edge Multioperator AI Acceleration 150 150
Author(s): Bo Wang, Yuchen Tang, Feiran Liu, Xiaoxue Zhong, Yuchen Ma, Xin Si, Jun Yang

Abstract:

We propose an edge multioperator computing-in-memory (EMO-CIM) design that supports variable vector-wise multiply-and-accumulate (MAC) in CNN, Depthwise (DW)-Convolution, and Attention operators. It features: 1) a single EMO-CIM bank (ECB) excels in variable vector-wise MAC (V-MAC) for multioperators; 2) merging local input-shared compute units (LISCUs) with a decode-unit and adder-tree (DUAT) facilitates …

Published in: IEEE Solid-State Circuits Letters
Page(s): 97 – 100
Year of Publication: 2026
Electronic ISSN: 2573-9603
DOI: 10.1109/LSSC.2026.3668853
Publisher: IEEE

View on IEEE Xplore

  • No Comments

A 14-nm Nonvolatile-Volatile-Fused Compute-In-Memory Macro Based on Logic-Compatible Flash for Plastic Neural Networks

A 14-nm Nonvolatile-Volatile-Fused Compute-In-Memory Macro Based on Logic-Compatible Flash for Plastic Neural Networks 150 150
Author(s): Weizeng Li, Linfang Wang, Zhidao Zhou, Zhi Li, Wang Ye, Junyu Zhu, Junzhe Shen, Bohan Wang, Hanghang Gao, Hongyang Hu, Jing Liu, Jinshan Yue, Jianguo Yang, Qing Luo, Qi Liu, Chunmeng Dou, Yang Chai, Ming Liu

Abstract:

Designing computing-in-memory (CIM) chips with synaptic plasticity can potentially support energy-efficient on-chip learning in edge devices for rapid local task adaptation. Its silicon implementation is challenging as it requires hybridizing nonvolatile and volatile memory (VM) and customized computational operations. In this work, we propose a plastic CIM (P-CIM) macro featuring: 1) …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 13
Year of Publication: 2026
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2026.3652940
Publisher: IEEE

View on IEEE Xplore

  • No Comments

MixCIM: A Hybrid Computing-in-Memory Macro With Less Data-Movement and Better Memory-Reuse for Depthwise Separable Neural Networks

MixCIM: A Hybrid Computing-in-Memory Macro With Less Data-Movement and Better Memory-Reuse for Depthwise Separable Neural Networks 150 150
Author(s): Xin Qiao, Youming Yang, Jiahao Song, Renjie Wei, Xiyuan Tang, Meng Li, Runsheng Wang, Yuan Wang

Abstract:

Computing-in-memory (CIM) architectures have demonstrated strong potential for edge artificial intelligence (AI) devices due to their enhanced parallelism and energy efficiency. With the growing complexity of AI tasks and the rapid increase in model size, computation and deployment costs have surged. Depthwise separable neural networks (DSNNs) have attracted interest for …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 13
Year of Publication: 2026
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2026.3651775
Publisher: IEEE

View on IEEE Xplore

  • No Comments

AACIM: A 2785-TOPS/W, 161-TOP/mm2, <1.17%-RMSE, Analog-In Analog-Out Computing-In-Memory Macro in 28 nm

AACIM: A 2785-TOPS/W, 161-TOP/mm2, <1.17%-RMSE, Analog-In Analog-Out Computing-In-Memory Macro in 28 nm 150 150
Author(s): Rentao Wan, Chuan-Tung Lin, Bo Zhang, Yannis Tsividis, Mingoo Seok

Abstract:

This article presents an analog-in analog-out CIM macro (AACIM) for use in analog deep neural network (DNN) processors. Our macro receives analog inputs, performs a 64-by-32 vector–matrix multiplication (VMM) with a current-discharging computation mechanism, and produces analog outputs. It stores a 4-bit weight as an analog voltage in the …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 11
Year of Publication: 2025
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2025.3622309
Publisher: IEEE

View on IEEE Xplore

  • No Comments

A Microscaling Multi-Mode Gain-Cell Computing-in-Memory Macro for Advanced AI Edge Device

A Microscaling Multi-Mode Gain-Cell Computing-in-Memory Macro for Advanced AI Edge Device 150 150
Author(s): Jen-Chun Tien, Ping-Chun Wu, Win-San Khwa, Ashwin Sanjay Lele, Jian-Wei Su, Chiao-Yen Cheng, Jun-Ming Hsu, Yu-Chen Chen, Le-Jung Hsieh, Jyun-Cheng Bai, Yu-Sheng Kao, Tsung-Han Lou, Jui-Jen Wu, Chung-Chuan Lo, Ren-Shuo Liu, Chih-Cheng Hsieh, Kea-Tiong Tang, Meng-Fan Chang

Abstract:

The microscaling (MX) format is an emerging data representation that quantizes high-bitwidth floating-point (FP) values into low-bitwidth FP-like values with a shared-scale (SS) exponent. When implemented with computing-in-memory (CIM), MX allows an attractive tradeoff between accuracy and hardware efficiency for specific neural network (NN) workloads. This work presents the first …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 14
Year of Publication: 2025
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2025.3617944
Publisher: IEEE

View on IEEE Xplore

Search this website