Common Information Model (computing)

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A 194.6-TOPS/W Pipelined All Current-Domain Mixed-Signal Compute in Memory in 28-nm CMOS

A 194.6-TOPS/W Pipelined All Current-Domain Mixed-Signal Compute in Memory in 28-nm CMOS 150 150
Author(s): Saideep Cherukuri, N. V. Kidambi, W. C. Wang, I. Chakraborty, S. Zhang, L. Shamieh, J. B. Steinberg, S. Mukhopadhyay

Abstract:

Mixed-signal CIM (MS-CIM) faces bit-cell nonlinearity, poor linearity at high frequency, and throughput limits. We present a hybrid pipelined current-domain MS-CIM macro featuring bit-cell matched linearization interface (BMLI) and loop-unrolled successive approximation refinement (SAR) ADC fabricated in 28-nm CMOS. A $256{\,}\times {\,}256$ SRAM array with 8-bit inputs, 8-bit weights achieve 10.16-TOPS …

Published in: IEEE Solid-State Circuits Letters
Page(s): 174 – 177
Year of Publication: 2026
Electronic ISSN: 2573-9603
DOI: 10.1109/LSSC.2026.3697990
Publisher: IEEE

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A 28-nm PVT Inner-Tracking Time-Domain Compute-In-Memory Macro for Edge-AI Devices

A 28-nm PVT Inner-Tracking Time-Domain Compute-In-Memory Macro for Edge-AI Devices 150 150
Author(s): Yuanzhe Zhao, Yuheng Wang, Heng Xie, Zijian Wang, Rui P. Martins, Chi-Hang Chan, Minglei Zhang

Abstract:

This article presents an energy-efficient and process-, voltage-, and temperature (PVT)-robust time-domain (TD) compute-in-memory (CIM) macro for edge artificial intelligence (AI) devices. It features: 1) a PVT inner-tracking (PIT) technique that aligns the PVT responses of TD computation and TD quantization, delivering inherent robustness without incurring extra power or circuit …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 13
Year of Publication: 2026
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2026.3691189
Publisher: IEEE

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EMO-CIM: An Input/Stationary-Data Similarity-Aware Computing-In-Memory Design for Variable Vector-Wise Computation in Edge Multioperator AI Acceleration

EMO-CIM: An Input/Stationary-Data Similarity-Aware Computing-In-Memory Design for Variable Vector-Wise Computation in Edge Multioperator AI Acceleration 150 150
Author(s): Bo Wang, Yuchen Tang, Feiran Liu, Xiaoxue Zhong, Yuchen Ma, Xin Si, Jun Yang

Abstract:

We propose an edge multioperator computing-in-memory (EMO-CIM) design that supports variable vector-wise multiply-and-accumulate (MAC) in CNN, Depthwise (DW)-Convolution, and Attention operators. It features: 1) a single EMO-CIM bank (ECB) excels in variable vector-wise MAC (V-MAC) for multioperators; 2) merging local input-shared compute units (LISCUs) with a decode-unit and adder-tree (DUAT) facilitates …

Published in: IEEE Solid-State Circuits Letters
Page(s): 97 – 100
Year of Publication: 2026
Electronic ISSN: 2573-9603
DOI: 10.1109/LSSC.2026.3668853
Publisher: IEEE

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MixCIM: A Hybrid Computing-in-Memory Macro With Less Data-Movement and Better Memory-Reuse for Depthwise Separable Neural Networks

MixCIM: A Hybrid Computing-in-Memory Macro With Less Data-Movement and Better Memory-Reuse for Depthwise Separable Neural Networks 150 150
Author(s): Xin Qiao, Youming Yang, Jiahao Song, Renjie Wei, Xiyuan Tang, Meng Li, Runsheng Wang, Yuan Wang

Abstract:

Computing-in-memory (CIM) architectures have demonstrated strong potential for edge artificial intelligence (AI) devices due to their enhanced parallelism and energy efficiency. With the growing complexity of AI tasks and the rapid increase in model size, computation and deployment costs have surged. Depthwise separable neural networks (DSNNs) have attracted interest for …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 13
Year of Publication: 2026
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2026.3651775
Publisher: IEEE

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An Approximate Digital CIM Macro With Low-Power Multiply-Add Units and Dynamic Sparse-Adaptive Configuring for Edge AI Inference

An Approximate Digital CIM Macro With Low-Power Multiply-Add Units and Dynamic Sparse-Adaptive Configuring for Edge AI Inference 150 150
Author(s): Xiaofeng Li, Yi Zhan, Purui Zhu, Rui Zhou, Jiayin Song, Heng You, Yumei Zhou, Shushan Qiao

Abstract:

This letter presents an approximate digital compute-in-memory (CIM) macro for low-power edge AI inference. It introduces three hierarchical innovations: 1) novel fused approximate multiply-add units (FAMUs) that reduces power and area consumption; 2) a bit-critical weight allocation architecture that optimally balances accuracy and hardware cost; and 3) a dynamic sparsity-adaptive configuration method to …

Published in: IEEE Solid-State Circuits Letters
Page(s): 45 – 48
Year of Publication: 2026
Electronic ISSN: 2573-9603
DOI: 10.1109/LSSC.2026.3652570
Publisher: IEEE

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DPe-CIM: A 4T-1C Dual-Port eDRAM-Based Compute-in-Memory for Simultaneous Computing and Refresh With Adaptive Refresh and Data Conversion Reduction Scheme

DPe-CIM: A 4T-1C Dual-Port eDRAM-Based Compute-in-Memory for Simultaneous Computing and Refresh With Adaptive Refresh and Data Conversion Reduction Scheme 150 150
Author(s): Do Han Kim, Minyoung Jo, Gi Seok Kim, Dong Gyun Ha, Ung Bin Oh, Donghan Ko, Jiwoo Lee, Mingu Kang, Seong-Ook Jung

Abstract:

This article presents DPe-CIM, a 4T-1C dual-port embedded dynamic random access memory (eDRAM)-based compute-in-memory (CIM) macro with adaptive refresh and data conversion reduction. DPe-CIM proposes four key features that improve area and energy efficiency: 1) dual-port eDRAM cell (DPC) separates the multiply-and-accumulate (MAC) and refresh ports, enabling simultaneous MAC …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 13
Year of Publication: 2025
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2025.3623117
Publisher: IEEE

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AACIM: A 2785-TOPS/W, 161-TOP/mm2, <1.17%-RMSE, Analog-In Analog-Out Computing-In-Memory Macro in 28 nm

AACIM: A 2785-TOPS/W, 161-TOP/mm2, <1.17%-RMSE, Analog-In Analog-Out Computing-In-Memory Macro in 28 nm 150 150
Author(s): Rentao Wan, Chuan-Tung Lin, Bo Zhang, Yannis Tsividis, Mingoo Seok

Abstract:

This article presents an analog-in analog-out CIM macro (AACIM) for use in analog deep neural network (DNN) processors. Our macro receives analog inputs, performs a 64-by-32 vector–matrix multiplication (VMM) with a current-discharging computation mechanism, and produces analog outputs. It stores a 4-bit weight as an analog voltage in the …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 11
Year of Publication: 2025
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2025.3622309
Publisher: IEEE

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A Microscaling Multi-Mode Gain-Cell Computing-in-Memory Macro for Advanced AI Edge Device

A Microscaling Multi-Mode Gain-Cell Computing-in-Memory Macro for Advanced AI Edge Device 150 150
Author(s): Jen-Chun Tien, Ping-Chun Wu, Win-San Khwa, Ashwin Sanjay Lele, Jian-Wei Su, Chiao-Yen Cheng, Jun-Ming Hsu, Yu-Chen Chen, Le-Jung Hsieh, Jyun-Cheng Bai, Yu-Sheng Kao, Tsung-Han Lou, Jui-Jen Wu, Chung-Chuan Lo, Ren-Shuo Liu, Chih-Cheng Hsieh, Kea-Tiong Tang, Meng-Fan Chang

Abstract:

The microscaling (MX) format is an emerging data representation that quantizes high-bitwidth floating-point (FP) values into low-bitwidth FP-like values with a shared-scale (SS) exponent. When implemented with computing-in-memory (CIM), MX allows an attractive tradeoff between accuracy and hardware efficiency for specific neural network (NN) workloads. This work presents the first …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 14
Year of Publication: 2025
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2025.3617944
Publisher: IEEE

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A 28-nm Computing-in-Memory Processor With Zig-Zag Backbone-Systolic CIM and Block-/Self-Gating CAM for NN/Recommendation Applications

A 28-nm Computing-in-Memory Processor With Zig-Zag Backbone-Systolic CIM and Block-/Self-Gating CAM for NN/Recommendation Applications 150 150
Author(s): Shengzhe Yan, Zhuoyu Dai, Zhaori Cong, Zeyu Guo, Yifan He, Wenyu Sun, Chunmeng Dou, Feng Zhang, Jinshan Yue, Yongpan Liu, Ming Liu

Abstract:

Computing-in-memory (CIM) chips have demonstrated promising energy efficiency for artificial intelligence (AI) applications such as neural networks (NNs), Transformer, and recommendation system (RecSys). However, several challenges still exist. First, a large gap between the macro and system-level CIM energy efficiency is observed. Second, several memory-dominate operations, such as embedding in …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 15
Year of Publication: 2025
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2025.3610539
Publisher: IEEE

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