Cells (biology)

A Practical MRAM Logic-in-Memory Platform With Reference-Bitline Structure

A Practical MRAM Logic-in-Memory Platform With Reference-Bitline Structure 150 150

Abstract:

The memory wall due to data movement is a major challenge that limits performance and energy efficiency in bitwise-operation-intensive applications. To address this issue, this article proposes a global merged reference-based magnetic random access memory (MRAM) logic-in-memory (LIM) structure. The proposed structure generates operation-specific reference resistances by controlling the effective …

View on IEEE Xplore

Topology-Aware Layout Design for Area-Decoupled Transistor Sizing in Multitier CFET SRAM

Topology-Aware Layout Design for Area-Decoupled Transistor Sizing in Multitier CFET SRAM 150 150

Abstract:

This work shows that a multitier complementary FET (CFET) static random access memory (SRAM) can decouple the area term from PPA-oriented transistor sizing. A topology-aware layout design is used to construct orthogonal and point-symmetric multitier CFET SRAM cells under 1-nm-class design rules, enabling high-density (HD), high-performance (HP), and high-current (HC) …

View on IEEE Xplore

Sensing- and Periphery-Aware Modeling of a Hybrid MTJ–CMOS Nonvolatile 1-bit Sign-Weight Memory Subsystem for Energy-Constrained Edge Inference

Sensing- and Periphery-Aware Modeling of a Hybrid MTJ–CMOS Nonvolatile 1-bit Sign-Weight Memory Subsystem for Energy-Constrained Edge Inference 150 150

Abstract:

The spin-transfer-torque magnetic random access memory (STT-MRAM) is attractive for nonvolatile 1-bit sign-weight storage, but a favorable cell or local-read metric does not establish subsystem efficiency. We analyze a hybrid magnetic tunnel junction (MTJ)–complementary metal–oxide–semiconductor (CMOS) memory subsystem, in which MTJs store static signs while sensing, reference …

View on IEEE Xplore

A Current-Mode Nondestructive Circuit Readout Scheme for High-Density 3-D Ferroelectric Memory

A Current-Mode Nondestructive Circuit Readout Scheme for High-Density 3-D Ferroelectric Memory 150 150

Abstract:

The AI era is demanding ever-increasing memory capacity and bandwidth, where 3-D-stacked ferroelectric memory (FeRAM) utilizing nondestructive readout (NDRO) ferroelectric capacitors (FeCAPs) stand as a promising candidate. This work addresses NDRO sensing signal challenges in deeply scaled 3-D FeRAMs using a current-mode sensing scheme, co-designed with the device architecture to …

View on IEEE Xplore

Open DRAM Model—Part II: Enabling Processing-in-Memory in 3-D DRAM

Open DRAM Model—Part II: Enabling Processing-in-Memory in 3-D DRAM 150 150

Abstract:

Processing-in-memory (PIM) by implementing Boolean logic functions in dynamic random access memory (DRAM) has been proposed to alleviate the memory wall problem in data-intensive computing. However, quantitatively evaluating DRAM-based logic operations across different DRAM architectures remains challenging due to the lack of publicly available DRAM cell and peripheral transistor models …

View on IEEE Xplore

CTH-CAM: A Cryogenic eDRAM-Based CAM With 1–26 Tunable Hamming Distance

CTH-CAM: A Cryogenic eDRAM-Based CAM With 1–26 Tunable Hamming Distance 150 150

Abstract:

Cryogenic approximate content-addressable memory (ACAM) offers an appealing solution that allows mismatches between the query and the stored data, measured by the Hamming distance (HD). However, in ACAM designs, increasing the word length shrinks the matchline (ML) voltage spacing between adjacent HD tolerance levels, thereby limiting the tunable-HD tolerance range …

View on IEEE Xplore

A 28-nm FD-SOI CMOS Analog-IMC Core Based on PCM Featuring 8 512 × 512-Weight Layers and 28M Weights×TOPs/W/mm2

A 28-nm FD-SOI CMOS Analog-IMC Core Based on PCM Featuring 8 512 × 512-Weight Layers and 28M Weights×TOPs/W/mm2 150 150

Abstract:

In-memory computing (IMC) hardware accelerators for deep neural networks (DNNs) require storing a massive number of coefficients within a single computing macro to avoid performance degradation in multicore clusters. This aspect, often overlooked by common figures of merit (FoMs), can be effectively addressed by phase-change memory (PCM) technology, thanks to …

View on IEEE Xplore

A Two-Step Time-Domain Logic-Compatible Embedded-Flash Computing-in-Memory Macro for On-Device AI

A Two-Step Time-Domain Logic-Compatible Embedded-Flash Computing-in-Memory Macro for On-Device AI 150 150

Abstract:

Computing in memory (CIM) has emerged as a promising architecture that can significantly reduce power consumption and latency in edge artificial intelligence (AI) devices. For battery-constrained edge devices, non-volatile memories (NVMs) are ideal due to their ability to retain neural network parameters even when powered down, ensuring rapid response time …

View on IEEE Xplore

Merged-Reference-Compatible Offset-Canceling Discharge-Based Sensing Circuit for STT-MRAM in 28-nm CMOS

Merged-Reference-Compatible Offset-Canceling Discharge-Based Sensing Circuit for STT-MRAM in 28-nm CMOS 150 150

Abstract:

This article proposes an offset-canceling (OC) discharge-based sensing circuit (OCDC) for spin-transfer-torque magnetic random access memory (STT-MRAM). The proposed circuit simultaneously implements a merged reference line (MRL) architecture and threshold voltage ( $\mathbf {V}_{\mathbf {TH}}$ ) mismatch cancellation, resolving the structural incompatibility between the conventional OC schemes and MRL. A diode-connection-based, …

View on IEEE Xplore