Bonding

  • No Comments

QEPC: Deferred-Evaluation Probabilistic Computing for Wearable AI — Architecture, Simulation Study, and Design Limits

QEPC: Deferred-Evaluation Probabilistic Computing for Wearable AI — Architecture, Simulation Study, and Design Limits 150 150
Author(s): Mohan Raj Manoharan

Abstract:

Wearable AI workloads such as sensor fusion, physiological inference and uncertainty quantification are probabilistic, yet the neural processing units that serve them are deterministic matrix-multiply engines that discard distributional information at every layer. We describe QEPC, a deferred-evaluation execution model in which probability mass functions are maintained in non-volatile state …

Published in: IEEE Journal on Exploratory Solid-State Computational Devices and Circuits
Page(s): 1 – 1
Year of Publication: 2026
Electronic ISSN: 2329-9231
DOI: 10.1109/JXCDC.2026.3740368
Publisher: IEEE

View on IEEE Xplore

  • No Comments

Open DRAM Model—Part I: Cross-Layer Device, Array, and Circuit Analysis With BL-to-BL Coupling Mitigation for 4F2 VCT DRAM

Open DRAM Model—Part I: Cross-Layer Device, Array, and Circuit Analysis With BL-to-BL Coupling Mitigation for 4F2 VCT DRAM 150 150
Author(s): Kiseok Lee, Seongkwang Lim, Suman Datta, Shimeng Yu

Abstract:

Dynamic random access memory (DRAM) scaling toward 4F2 vertical channel transistors (VCTs) fundamentally reshapes device, array, and circuit-level design tradeoffs. However, the lack of an open-source DRAM device model that is calibrated with recent industry trends prohibits broader innovations in the research community. In this work, we present an “Open …

Published in: IEEE Journal on Exploratory Solid-State Computational Devices and Circuits
Page(s): 135 – 143
Year of Publication: 2026
Electronic ISSN: 2329-9231
DOI: 10.1109/JXCDC.2026.3704358
Publisher: IEEE

View on IEEE Xplore

Search this website