Artificial intelligence (AI)

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A 14-nm Nonvolatile-Volatile-Fused Compute-In-Memory Macro Based on Logic-Compatible Flash for Plastic Neural Networks

A 14-nm Nonvolatile-Volatile-Fused Compute-In-Memory Macro Based on Logic-Compatible Flash for Plastic Neural Networks 150 150
Author(s): Weizeng Li, Linfang Wang, Zhidao Zhou, Zhi Li, Wang Ye, Junyu Zhu, Junzhe Shen, Bohan Wang, Hanghang Gao, Hongyang Hu, Jing Liu, Jinshan Yue, Jianguo Yang, Qing Luo, Qi Liu, Chunmeng Dou, Yang Chai, Ming Liu

Abstract:

Designing computing-in-memory (CIM) chips with synaptic plasticity can potentially support energy-efficient on-chip learning in edge devices for rapid local task adaptation. Its silicon implementation is challenging as it requires hybridizing nonvolatile and volatile memory (VM) and customized computational operations. In this work, we propose a plastic CIM (P-CIM) macro featuring: 1) …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 13
Year of Publication: 2026
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2026.3652940
Publisher: IEEE

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A Microscaling Multi-Mode Gain-Cell Computing-in-Memory Macro for Advanced AI Edge Device

A Microscaling Multi-Mode Gain-Cell Computing-in-Memory Macro for Advanced AI Edge Device 150 150
Author(s): Jen-Chun Tien, Ping-Chun Wu, Win-San Khwa, Ashwin Sanjay Lele, Jian-Wei Su, Chiao-Yen Cheng, Jun-Ming Hsu, Yu-Chen Chen, Le-Jung Hsieh, Jyun-Cheng Bai, Yu-Sheng Kao, Tsung-Han Lou, Jui-Jen Wu, Chung-Chuan Lo, Ren-Shuo Liu, Chih-Cheng Hsieh, Kea-Tiong Tang, Meng-Fan Chang

Abstract:

The microscaling (MX) format is an emerging data representation that quantizes high-bitwidth floating-point (FP) values into low-bitwidth FP-like values with a shared-scale (SS) exponent. When implemented with computing-in-memory (CIM), MX allows an attractive tradeoff between accuracy and hardware efficiency for specific neural network (NN) workloads. This work presents the first …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 14
Year of Publication: 2025
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2025.3617944
Publisher: IEEE

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