Arrays

A Ka-Band Eight-Stream Phased-Array MIMO Receiver With Time-Hopping Blocker Rejection for 6G

A Ka-Band Eight-Stream Phased-Array MIMO Receiver With Time-Hopping Blocker Rejection for 6G 150 150

Abstract:

This article presents a Ka-band phased-array multiple-input multiple-output (MIMO) receiver for sixth-generation (6G) wireless networks. A time-division (TD) MIMO architecture is combined with DP antenna array to support eight MIMO streams in the Ka band. The complex weights of each RF element in both polarization arrays are sequentially switched at …

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A 28-nm FD-SOI CMOS Analog-IMC Core Based on PCM Featuring 8 512 × 512-Weight Layers and 28M Weights×TOPs/W/mm2

A 28-nm FD-SOI CMOS Analog-IMC Core Based on PCM Featuring 8 512 × 512-Weight Layers and 28M Weights×TOPs/W/mm2 150 150

Abstract:

In-memory computing (IMC) hardware accelerators for deep neural networks (DNNs) require storing a massive number of coefficients within a single computing macro to avoid performance degradation in multicore clusters. This aspect, often overlooked by common figures of merit (FoMs), can be effectively addressed by phase-change memory (PCM) technology, thanks to …

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A BEV Perception Transformer Accelerator With Saliency-Driven Image/Point Cloud Fusion and Phase-Linked Dataflow in 28 nm CMOS

A BEV Perception Transformer Accelerator With Saliency-Driven Image/Point Cloud Fusion and Phase-Linked Dataflow in 28 nm CMOS 150 150

Abstract:

Deploying advanced Transformer-based models for real-time, high-accuracy multimodal bird’s-eye-view (BEV) perception in autonomous driving imposes substantial hardware demands. To address this, we propose a low-cost, low-power image/point-cloud fusion Transformer accelerator that supports two modes: high-performance driving and ultra-low-power sentry operation. We first propose a cross-modal saliency evaluation mechanism …

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QVGA CMOS LiDAR Sensor With nMOS-Only SPAD Analog Front-End and Area-Efficient Priority Histogramming TDC

QVGA CMOS LiDAR Sensor With nMOS-Only SPAD Analog Front-End and Area-Efficient Priority Histogramming TDC 150 150

Abstract:

This article presents a high-resolution (HR) CMOS light detection and ranging (LiDAR) sensor capable of generating quarter video graphics array (QVGA) ( $320~{\times }~240$ ) depth images. To support high pixel density, the sensor employs a compact 6-transistor (6-T) nMOS-only single-photon avalanche diode (SPAD) analog front-end (AFE) with a column-shared active recharge circuit. …

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A 12-bit 1-GS/s Current-Steering DAC With Paired Current Source Switching Background Mismatch Calibration

A 12-bit 1-GS/s Current-Steering DAC With Paired Current Source Switching Background Mismatch Calibration 150 150

Abstract:

This article presents a spur-suppressed background calibration technique for high-speed current-steering digital-to-analog converters (DACs), based on a paired current source (CS) switching scheme. In conventional background calibration, periodic switching of CSs to and from the calibration mode introduces unwanted glitches that appear as spurious tones. The proposed technique introduces an …

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MixCIM: A Hybrid Computing-in-Memory Macro With Less Data-Movement and Better Memory-Reuse for Depthwise Separable Neural Networks

MixCIM: A Hybrid Computing-in-Memory Macro With Less Data-Movement and Better Memory-Reuse for Depthwise Separable Neural Networks 150 150

Abstract:

Computing-in-memory (CIM) architectures have demonstrated strong potential for edge artificial intelligence (AI) devices due to their enhanced parallelism and energy efficiency. With the growing complexity of AI tasks and the rapid increase in model size, computation and deployment costs have surged. Depthwise separable neural networks (DSNNs) have attracted interest for …

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A 29-Gb/mm2 1-Tb 3-b/Cell 3-D Flash Memory With CMOS Direct Bonded Array (CBA) Technology

A 29-Gb/mm2 1-Tb 3-b/Cell 3-D Flash Memory With CMOS Direct Bonded Array (CBA) Technology 150 150

Abstract:

This article reports a 1-Tb 3-b/cell 3-D flash memory fabricated with CMOS direct bonded array (CBA) technology. Compaction of circuits and wires achieves the highest bit density in the world over 29 Gb/mm2 with 332-word line (WL) layers. The bit density is improved by 71% from a previous generation despite …

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A 28-nm Computing-in-Memory Processor With Zig-Zag Backbone-Systolic CIM and Block-/Self-Gating CAM for NN/Recommendation Applications

A 28-nm Computing-in-Memory Processor With Zig-Zag Backbone-Systolic CIM and Block-/Self-Gating CAM for NN/Recommendation Applications 150 150

Abstract:

Computing-in-memory (CIM) chips have demonstrated promising energy efficiency for artificial intelligence (AI) applications such as neural networks (NNs), Transformer, and recommendation system (RecSys). However, several challenges still exist. First, a large gap between the macro and system-level CIM energy efficiency is observed. Second, several memory-dominate operations, such as embedding in …

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ROZK: An Energy-Efficient DNN Accelerator Based on Reconfigurable NoC and Local Zero-Skipping

ROZK: An Energy-Efficient DNN Accelerator Based on Reconfigurable NoC and Local Zero-Skipping 150 150

Abstract:

Zero-skipping is a famous technique to improve the energy efficiency of deep neural network (DNN) accelerators. When the zero-skipping is realized with encoded data using lossless compression, irregular and unpredictable size of data due to inconsistent compression rate incurs several design issues including: 1) load imbalance from irregularity of data stored …

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